Abstract: The invention relates to a component and a method for producing said component. The component comprises a substrate (S), a chip (CH), a frame (MF), which is connected to the substrate (S) and on which the chip (CH) bears. A metallic closure layer (ML) encompasses the frame (MF), the substrate (S) and the chip (CH) such that a volume enclosed by the substrate (S), the chip (CH) and the frame (MF) is hermetically sealed.

Abstract: On a carrier (1) an adhesion layer (4), an ASIC chip (2) and a sensor chip (3) are arranged one above another. An interchip connection (5) is provided for electrically connecting the chips among one another, and an ASIC connection (6) is provided for externally electrically connecting the circuit integrated in the ASIC chip.

Abstract: A component includes a substrate, a chip and a frame. The frame is bonded to the substrate and the chip rests on the frame. A sealing layer on parts of the frame and the chip is designed to hermetically seal a volume enclosed by the substrate, the chip and the metal frame.

Abstract: The invention relates to a method for producing a microphone, in which a transducer element (WE) is mounted on a carrier (TR); a cover is arranged over the transducer element (WE) and the carrier (TR) such that the transducer element (WE) is enclosed between the cover and the carrier (TR); a first sound inlet opening (SO1) is produced in the carrier (TR); a functional test of the microphone is carried out; the first sound inlet opening (SO1) is closed; and a second sound inlet opening (SO2) is created in the cover. The present invention further relates to a microphone resulting from the method, in which the first sound inlet opening (SO1) is prepared but closed.

Abstract: The invention relates to a miniaturized electrical component comprising an MEMS chip and an ASIC chip. The MEMS chip and the ASIC chip are disposed on top of each other; an internal mounting of MEMS chip and ASIC chip is connected to external electrical terminals of the electrical component by means of vias through the MEMS chip or the ASIC chip.

Abstract: A micro electro-mechanical systems (MEMS) package is described herein. The package includes a carrier substrate having a top side, a MEMS chip mounted on the top side of the carrier substrate, and at least one chip component on or above the top side of the carrier substrate or embedded in the carrier substrate. The package also includes a thin metallic shielding layer covering the MEMS chip and the chip component and forming a seal with the top side of the carrier substrate.

Abstract: Data collection and analysis processes include collecting energy consumption data from an in-vehicle energy source sensor, collecting emissions data from an in-vehicle emissions sensor, the emissions data reflecting emissions produced by a vehicle, and collecting mileage data from a mileage sensor in the vehicle. The data collection and analysis processes also include processing the energy consumption data and the emissions data as a function of the mileage data, calculating an efficiency rating from the processing, and transmitting results of the processing to a data collection system.

Abstract: A carrier substrate has a mounting location with a number of electrical connection pads on a top side and external contacts connected thereto on an underside. A metal frame encloses the connection pads of the mounting location. A MEMS chip has electrical contacts on an underside. The MEMS chip is placed on the mounting location of the carrier substrate in such a way that the MEMS chip is seated with an edge region of its underside on the metal frame. Using a flip-chip process, the electrical contacts of the MEMS chip are connected to the connection pads of the carrier substrate by means of bumps the metal frame is connected to the MEMS chip such that a closed cavity is formed between MEMS chip and carrier substrate.

Abstract: The present invention relates to an apparatus (10) for generating countable pulses (30) from impinging X-ray (12, 14) in an imaging device (16), in particular in a computer tomograph, the apparatus (10) comprising a pre-amplifying element (18) adapted to convert a charge pulse (20) generated by an impinging photon (12, 14) into an electrical signal (22) and a shaping element (26) having a feedback loop (28) and adapted to convert the electrical signal (22) into an electrical pulse (30), wherein a delay circuit (38) is connected to the feedback loop (28) such that a time during which the feedback loop (28) collects charges of the electrical signal (22) is extended in order to improve an amplitude of the electrical pulse (30) at an output (56) of the shaping element (26). The invention also relates to a corresponding imaging device (16) and a corresponding method.

Abstract: A component includes a first substrate having a first front side for holding first component structures, and a second substrate having a second front side for holding second component structures. The first and second substrates are connected together electrically and mechanically. The first and second front sides face each other. The first and second component structures include SAW structures, FBAR structures, MEMS sensors or switches, or MEOPS components, or combinations thereof.

Abstract: A plurality of unpackaged substrates connected to one another is disclosed. The stepped structures on and/or in a first main area of a first substrate include a plurality of integrated circuits. The stepped structures run between the integrated circuits. The first conductor tracks extend from at least some contact connections of the respective integrated circuits as far as the stepped structures. The first substrate is connected on the side of the first main area to a further substrate. The first substrate is severed from a second main area opposite to the first main area such that the first substrate is divided into a plurality of substrate pieces. Each substrate piece has one of the integrated circuits. The first conductor tracks are accessible in interspaces between the substrate pieces. The second conductor tracks are formed from the second main area. At least some of the second conductor tracks lead from the second main area over side walls of the substrate pieces as far as the first conductor tracks.

Abstract: A micro electro-mechanical systems (MEMS) package is described herein. The package includes a carrier substrate having a top side, a MEMS chip mounted on the top side of the carrier substrate, and at least one chip component on or above the top side of the carrier substrate or embedded in the carrier substrate. The package also includes a thin metallic shielding layer covering the MEMS chip and the chip component and forming a seal with the top side of the carrier substrate.

Abstract: A chip device is produced providing at least one wafer having a plurality of chip components. The wafer or wafers are separated into the individual chip components and/or into groups of chip components. The individual chip components and/or the groups of chip components are applied to a carrier element, in such a way that interspaces having a predetermined width are formed between the individual chip components and/or the groups of chip components. A polymer is introduced into the interspaces in order to form a composite element composed of the chip components and a polymer matrix. The composite element is separated in such a way that chip devices composed of in each case one of the chip components and at least one section of the polymer matrix are formed. The invention furthermore relates to a chip device produced by means of the method.

Abstract: A MEMS component includes a chip that has a rear side having a low roughness of less than one tenth of the wavelength at the center frequency of an acoustic wave propagating in the component. Metallic structures for scattering bulk acoustic waves are provided on the rear side of the chip and a material of the metallic structures is acoustically matched to a material of the chip.

Abstract: A component has a substrate and a compensation layer. A lower face of the substrate is mechanically firmly connected to the compensation layer. The lower face of the substrate and the upper face of the compensation layer have a topography.

Abstract: On a carrier (1) an adhesion layer (4), an ASIC chip (2) and a sensor chip (3) are arranged one above another. An interchip connection (5) is provided for electrically connecting the chips among one another, and an ASIC connection (6) is provided for externally electrically connecting the circuit integrated in the ASIC chip.

Abstract: A circuit board comprising a circuit carrier, a cover layer composed of a nonconductive material, comprising an organic substance, arranged on the circuit carrier, a first metallization layer at least partly arranged on the cover layer, wherein the first metallization layer has a flexible region.

Abstract: A micro electro-mechanical systems (MEMS) package is described herein. The package includes a carrier substrate having a top side, a MEMS chip mounted on the top side of the carrier substrate, and at least one chip component on or above the top side of the carrier substrate or embedded in the carrier substrate. The package also includes a thin metallic shielding layer covering the MEMS chip and the chip component and forming a seal with the top side of the carrier substrate.

Abstract: Frames (3) applied on a wafer (1) are leveled and covered with a covering film, such that gas-tight housings are formed for component structures (5), in particular for filter or MEMS structures. Inner columns (4) can be provided for supporting the housing and for the ground connection; outer columns (4) can be provided for the electrical connection and are connected to the component structures by means of conductor tracks (6) that are electrically insulated from the frames (3).

Abstract: An MEMS package is proposed, wherein a chip having MEMS structures on its top side is connected to a rigid covering plate and a frame structure, which comprises a polymer, to form a sandwich structure in such a way that a closed cavity which receives the MEMS structures is formed. Solderable or bondable electrical contact are arranged on the rear side of the chip or on the outer side of the covering plate which faces away from the chip, and are electrically conductively connected to at least one connection pad by means of an electrical connection structure.