Abstract: Various embodiments relate to application of a fluid to a substrate. The fluid is locally heated, for example, to obtain a desired thickness profile.

Abstract: Various embodiments relate to application of a fluid to a substrate. The fluid is locally heated, for example, to obtain a desired thickness profile.

Abstract: Various embodiments relate to application of a fluid to a substrate. The fluid is locally heated, for example, to obtain a desired thickness profile.

Abstract: Various embodiments relate to application of a fluid to a substrate. The fluid is locally heated, for example, to obtain a desired thickness profile.

Abstract: A device and a method for the processing of wafers is disclosed. One embodiment provides a method and a device in which a system wafer is bonded to a carrier work piece by using a bonding substance so as to increase the stability of the system wafer. After processing of the system wafer, the bonding effect of the bonding substance is cancelled. The system wafer can easily be detached from the carrier work piece without cutting out the carrier work piece, so that the dust exposure and the mechanical stress of the system wafer which occurs during the cutting out of the carrier work piece is avoided.

Abstract: The invention relates to a monitoring system for a conveying device for flat articles, especially wafers, which conveying device is provided with a carriage (28) that is movable along a predetermined path next to a flat article (10) that is located at a predetermined removal location, the carriage having a receiving device for the accommodation of the flat article (10), which monitoring system contains a light source (50) having a light-exit window and a light receiver (52) having a light-admission window, whereby the light-exit window and the light-admission window are positioned in such a way that a light beam (60) directed form the light-exit window to the light-admission window is partially covered by the carriage (28) during its movement through the light beam, and an evaluation unit that is connected to the light receiver and that compares a target signal derived from its movement of the carriage along a target path with an actual signal derived from an actual movement of the carriage, and indicates a d

Abstract: Aliphatic dinitriles are prepared by reacting aliphatic dicarboxylic acids with ammonia in excess at from 200.degree. to 500.degree. C. in the presence of zeolites as catalysts.

Abstract: Adipodinitrile is prepared by reacting adipic acid with excess ammonia at from 250.degree. to 350.degree. C. in the liquid phase in the presence of a diluent by a process in which a liquid hydrocarbon which is inert under the reaction conditions is used as the diluent.

Abstract: An improved process for producing adipic acid from the acidic wash waters which arise in the process for oxidizing cyclohexane with air, by treatment with nitric acid at from 10.degree. to 50.degree. C., with removal of the heat of reaction by external cooling, wherein the reaction mixture is led, at a flow velocity of at least 2.0 m/sec, as a thin layer spirally in counter-current to the coolant, under conditions which do not perturb the flow of the reaction mixture.