Abstract: A topical formulation comprising (a) a therapeutically effective amount of tofacitinib; (b) at least one solvent; and (c) optionally one or more other pharmaceutically acceptable excipients is provided. Also provided is a method for treating and/or preventing autoimmune diseases in a subject administering said topical formulation.

Abstract: A semiconductor device and methods of fabricating the same are disclosed. The semiconductor device includes a substrate, a fin structure with a fin top surface disposed on the substrate, a source/drain (S/D) region disposed on the fin structure, a gate structure disposed on the fin top surface, and a gate spacer with first and second spacer portions disposed between the gate structure and the S/D region. The first spacer portion extends above the fin top surface and is disposed along a sidewall of the gate structure. The second spacer portion extends below the fin top surface and is disposed along a sidewall of the S/D region.

Abstract: A method including: providing a design data of an integrated circuit (IC), the design data comprising a first cell; identifying a first conductive line in the first cell as a critical internal net of the first cell, wherein the first conductive line is electrically connected between an input terminal of the first cell and an output terminal of the first cell; providing a library of the first cell, wherein the library includes a table of timing or power parameters of the first cell based on a multidimensional input set associated with the critical internal net; updating the design data by determining a timing or power value of the first cell based on the table; performing a timing analysis on the updated design data; and forming a photomask based on the updated design data.

Abstract: A polymer composite for preparing a low dielectric resin composition having a dielectric loss tangent (Df) that is less than or equal to 0.00200 is provided. The polymer composite includes a first styrene-based copolymer having a weight average molecular weight that is lower than 20,000 g/mol and a second styrene-based copolymer having a weight average molecular weight that is higher than 20,000 g/mol, wherein the weight ratio of the first styrene-based copolymer to the second styrene-based copolymer is from 5/95 to 95/5.

Abstract: Systems, apparatus, articles of manufacture, and methods are disclosed to implement seamless switching of dynamic range and/or refresh rate on display devices. An example apparatus disclosed herein causes a display to activate panel self refresh after a command to switch a graphics output from a first dynamic range to a second dynamic range, the graphics output provided to the display. The example apparatus also switches the graphics output from the first dynamic range to the second dynamic range after the panel self refresh is activated. The example apparatus further causes the display to deactivate the panel self refresh after the graphics output is switched to the second dynamic range.

Abstract: A semiconductor device includes a semiconductor substrate, a gate structure, strained layers, source/drain contact patterns, a gate contact via, and source/drain contact vias. The gate structure is disposed over the semiconductor substrate. The strained layers are disposed aside the gate structure. The source/drain contact patterns are disposed on and electrically connected to the strained layers. Top surfaces of the source/drain contact patterns are coplanar with a top surface of the gate structure. The gate contact via is disposed on and electrically connected to the gate structure. The source/drain contact vias are disposed on and electrically connected to the source/drain contact patterns.

Abstract: A method includes obtaining labeled training data including a plurality of spoken terms spoken during a conversation. For each respective spoken term, the method includes generating a corresponding sequence of intermediate audio encodings from a corresponding sequence of acoustic frames, generating a corresponding sequence of final audio encodings from the corresponding sequence of intermediate audio encodings, generating a corresponding speech recognition result, and generating a respective speaker token representing a predicted identity of a speaker for each corresponding speech recognition result. The method also includes training the joint speech recognition and speaker diarization model jointly based on a first loss derived from the generated speech recognition results and the corresponding transcriptions and a second loss derived from the generated speaker tokens and the corresponding speaker labels.

Abstract: A hydrocarbon resin polymer including a repeating unit (A) is derived from dicyclopentadiene (DCPD). The hydrocarbon resin polymer has a fluorine substituent, and the content of the fluorine substituent is 100 to 4500 ppm based on the total weight of the hydrocarbon resin polymer. A manufacturing method of the above hydrocarbon resin polymer. The manufacturing method includes polymerizing a mixture in the presence of a fluorine-containing compound, wherein the fluorine-containing compound is a boron trifluoride complex and the mixture includes a dicyclopentadiene. A substrate structure includes a resin layer, and a conductive layer disposed on the resin layer. The resin layer is formed from a resin composition including the above hydrocarbon resin polymer using a cross-linking process.

Abstract: A memory cell structure includes a transistor structure and a capacitor structure, where the capacitor structure includes a hydrogen absorption layer. The hydrogen absorption layer absorbs hydrogen, which prevents or reduces the likelihood of the hydrogen diffusing into an underlying metal-oxide channel of the transistor structure. In this way, the hydrogen absorption layer minimizes and/or reduces the likelihood of hydrogen contamination in the metal-oxide channel, which may enable a low current leakage to be achieved for the memory cell structure and reduces the likelihood of data corruption and/or failure of the memory cell structure, among other examples.

Abstract: A circuit board structure is provided. The circuit board structure includes a substrate, a solder mask coupler, a supporter, and a chip. The substrate has a conductive structure. The solder mask coupler is disposed on the substrate. The supporter contacts the solder mask coupler, and the supporter is fixed on the substrate via the solder mask coupler. The chip is disposed on the substrate, and the chip is electrically connected with the conductive structure.

Abstract: A minimum IC operating voltage searching method includes acquiring a corner type of an IC, acquiring ring oscillator data of the IC, generating a first prediction voltage according to the corner type and the ring oscillator data by using a training model, generating a second prediction voltage according to the ring oscillator data by using a non-linear regression approach under an N-ordered polynomial, and generating a predicted minimum IC operating voltage according to the first prediction voltage and the second prediction voltage. N is a positive integer.

Abstract: A capacitive touchpad is provided, which includes a substrate module, a plurality of sensing electrodes, a plurality of driving electrodes and a plurality of light-emitting diode (LED) dies. The plurality of sensing electrodes and the plurality of driving electrodes form a touch sensing region of the capacitive touchpad, and the touch sensing region is divided into a plurality of sensing units having same areas. Each of the LED dies is arranged in two adjacent ones of the plurality of sensing units, and a position of each of the LED dies corresponds to one of the plurality of driving electrodes, and the LED dies are electrically isolated from the plurality of sensing electrodes and the plurality of driving electrodes.

Abstract: A resin composition includes 100 parts by weight of hydrocarbon resin polymers and 0.01 to 50 parts by weight of divinyl aromatic compound. A substrate structure includes a resin layer and a conductive layer disposed on the resin layer, wherein the resin layer is formed from the resin composition. A manufacturing method of the resin composition includes the following steps: providing a mixture, wherein the mixture includes a monovinyl aromatic compound and a divinyl aromatic compound, and optionally includes a bridged ring compound; polymerizing the mixture to form a crude composition; and purifying the crude composition to prepare the resin composition.

Abstract: A method for the surface treatment of a corrosion-resistant nickel-based alloy and the resulting surface structure of the treated alloy is disclosed. The method includes immersing a nickel-based alloy in a first neutral or alkaline solution to remove surface contaminants, followed by immersing the cleaned alloy in a second neutral or alkaline solution to form functional groups on its surface. Subsequently, a low-temperature heat treatment is performed to form a passivation layer on the surface of the nickel-based alloy. The passivation layer has a surface roughness of less than 0.04 microns and a thickness ranging from 5 nanometers to 200 nanometers. The resulting corrosion-resistant nickel-based alloy comprises a substrate made of the nickel-based alloy and a passivation layer established on at least one surface of the substrate. The nickel content of the alloy is greater than 50%, and the alloy may also contain additional metallic components such as chromium (Cr) and manganese (Mn).

Abstract: A mechanical key component and a mechanical keyboard are provided. The mechanical key component includes a circuit board, an elastic element and a key cap. The circuit board is provided with a first sensing electrode. The elastic element is disposed on the circuit board, and a movable portion of the elastic element is connected to a second sensing electrode. The key cap is movably disposed on the elastic element. The elastic element enables the key cap to move between an unpressed position and a pressed position, and the movable portion drives the second sensing electrode to move relative to the first sensing electrode. In response to the key cap being moved between the unpressed position and the pressed position, a coupling capacitance between the first sensing electrode and the second sensing electrode changes to indicate whether the key cap is in the unpressed position or the pressed position.

Abstract: An electronic device includes an outer case, a circuit substrate, a thermopile sensor chip, a filter structure, and a waterproof structure. The outer case has an opening. The circuit substrate is disposed inside the outer case. The thermopile sensor chip is disposed on the circuit substrate. The filter structure is disposed above the thermopile sensor chip. The waterproof structure is surroundingly connected between the filter structure and the outer case, wherein the waterproof structure has a through hole for exposing the filter structure and communicated with the opening of the outer case.

Abstract: A semiconductor device and methods of fabricating the same are disclosed. The semiconductor device includes a substrate, a fin structure with a fin top surface disposed on the substrate, a source/drain (S/D) region disposed on the fin structure, a gate structure disposed on the fin top surface, and a gate spacer with first and second spacer portions disposed between the gate structure and the S/D region. The first spacer portion extends above the fin top surface and is disposed along a sidewall of the gate structure. The second spacer portion extends below the fin top surface and is disposed along a sidewall of the S/D region.

Abstract: Method to implement heat dissipation multilayer and reduce thermal boundary resistance for high power consumption semiconductor devices is provided. The heat dissipation multilayer comprises a first crystalline layer that possesses a first phonon frequency range, a second crystalline layer that has a second phonon frequency range which does not overlap with the first phonon frequency range, and an amorphous layer located between the first and second crystalline layers. The amorphous layer has a third phonon frequency range that overlaps both the first and second phonon frequency ranges.

Abstract: A midsole includes a midsole body and a resilient plate disposed in the midsole body in a manner that the resilient plate extends along a longitudinal direction. The resilient plate includes a plurality of resilient tubular elements that are integrally connected to each other along the longitudinal direction. Each of the resilient tubular elements extends along a width direction perpendicular to the longitudinal direction. A shoe includes an upper, an outsole, and the aforementioned midsole which is connected between the upper and the outsole.

Abstract: A semiconductor structure is provided. The semiconductor structure includes a substrate; a dielectric layer on the substrate; isolation structures extending through the dielectric layer into the substrate; and a floating gate on the dielectric layer and between the isolation structures, wherein the floating gate includes a first portion directly on the dielectric layer; and second portions on the sidewalls of the first portion.