Abstract: A sensor system having a sensor element, a housing in which sensor element is situated and which seals the sensor element from the outside world, at least one first electrical contact element which is electrically coupled with the sensor element; a plug connector, which has at least one second electrical contact element, and at least one spring element which is coupled between the at least one second electrical contact element and the at least one first electrical contact element for electrical contacting, so that the sensor element is electrically connected to the second electrical contact element of the plug connector.

Abstract: A method for producing a surface on a component, which has regions having different wettabilities with respect to a solder. The method includes forming a first metallic layer on the component and forming a second metallic layer on the first metallic layer, the second metallic layer preventing oxidation of the first metallic layer. The method furthermore includes removing the second metallic layer with the aid of a laser in a predefined surface region for exposing the first metallic layer, and oxidizing the exposed first metallic layer on the surface, which results in a wettability with respect to a solder in the predefined surface region that is less than in a surface region adjacent to the predefined surface region.

Abstract: A sensor system having a sensor element, a housing in which sensor element is situated and which seals the sensor element from the outside world, at least one first electrical contact element which is electrically coupled with the sensor element; a plug connector, which has at least one second electrical contact element, and at least one spring element which is coupled between the at least one second electrical contact element and the at least one first electrical contact element for electrical contacting, so that the sensor element is electrically connected to the second electrical contact element of the plug connector.

Abstract: A module, in particular a sensor module, has a module housing, a carrier element, a connection element, and at least one component, the module housing completely enclosing the at least one component and being situated on the carrier element, and the at least one component also being mounted on the connection element and being situated between the connection element and the carrier element.

Abstract: A pressure-sensor system having a sensor element and a hermetic housing for the sensor element has a particularly uncomplicated installation, in particular even under aggressive ambient conditions. The housing of this pressure-sensor system includes a first housing part having a housing bottom, and at least one additional housing part. The sensor element is installed on the housing bottom, and the pressure is supplied via an opening in the housing bottom. The at least one additional housing part is disposed above the sensor element and is connected to the first housing part. Apart from this, connecting pins for the electrical contacting of the sensor element are provided. The connecting pins are guided through the additional housing part.

Abstract: A method for producing a surface on a component, which has regions having different wettabilities with respect to a solder. The method includes forming a first metallic layer on the component and forming a second metallic layer on the first metallic layer, the second metallic layer preventing oxidation of the first metallic layer. The method furthermore includes removing the second metallic layer with the aid of a laser in a predefined surface region for exposing the first metallic layer, and oxidizing the exposed first metallic layer on the surface, which results in a wettability with respect to a solder in the predefined surface region that is less than in a surface region adjacent to the predefined surface region.

Abstract: A pressure-sensor system having a sensor element and a hermetic housing for the sensor element has a particularly uncomplicated installation, in particular even under aggressive ambient conditions. The housing of this pressure-sensor system includes a first housing part having a housing bottom, and at least one additional housing part. The sensor element is installed on the housing bottom, and the pressure is supplied via an opening in the housing bottom. The at least one additional housing part is disposed above the sensor element and is connected to the first housing part. Apart from this, connecting pins for the electrical contacting of the sensor element are provided. The connecting pins are guided through the additional housing part.

Abstract: A module, in particular a sensor module, has a module housing, a carrier element, a connection element, and at least one component, the module housing completely enclosing the at least one component and being situated on the carrier element, and the at least one component also being mounted on the connection element and being situated between the connection element and the carrier element.

Abstract: In electronics manufacturing, it is conventional to print a film onto a substrate (1) and then fire it in a continuous oven. A sequence of substrates is fed through the continuous oven on a conveyor belt (9). In order to fire substrates, even substrates printed on both sides, without damaging the films, the apparatus of the present invention employs wedge-shaped holders (5) which support each substrate only at its edges. The holders are secured to the belt (9) by securing shafts (15) which pass through loops or voids in the mesh belt. The shafts are preferably secured by a securing wire (17) passed through them. Wire (17) is kept from pulling out by an eyelet (19). In this manner, even substrates printed on both sides can be fed to the continuous oven without damage.