Abstract: A coffee percolator having a brewing chamber wherein at least one of the boundary wall surfaces of the brewing chambr is adjustable transversely of the direction of flow of the hot water through the coffee powder so that the thickness of the coffee powder bed in the direction of flow may be kept substantially constant for the coffee charges of varying size. The coffee percolator may include a brewing sieve having a support sieve with openings of a size exceeding the dimensions of the ground coffee particles and a fine sieve supported on the side of said support sieve facing towards the brewing chamber and having openings of a size smaller than the dimensions of the ground coffee particles.

Abstract: Described is a coffee percolator having a coffee meal supply container mounted at an upper portion thereof, in which heating of the coffee meal supply by the heat of the coffee percolator and the resultant loss of volatile aroma substances are avoided. This is accomplished by providing a cooling system effective to cool the bottom of the supply container. In a preferred embodiment the supply container is cooled by means of air aspirated by a fan through an air flow path extending along the bottom of the supply container and subsequently returned to the environmental atmosphere.

Abstract: Described is a coffee percolator the brewing cycle of which is controlled by control means. This coffee percolator is provided with further control means effective to initiate and to control a hot flushing operation for preheating those parts of the coffee percolator which come into contact with the coffee separately from the brewing cycle proper.

Abstract: A process for connecting flat, film-like components to a printed circuit board includes providing the printed circuit board with through-plated holes whose plating includes a fusible material and extends to contacts on the printed circuit board, positioning the flat, film-like components on the board so that the junctions of the components touch but do not extend into the holes and contacting the printed circuit board on the side opposite to the side with the components with liquid solder which rises in the holes, heats the plating and the junctions and bonds the components to the printed circuit board.