Abstract: An apparatus and method for testing the mechanical strength of a solderless electrical connection having a clamp deformable to retain a bundle of wires against a pin has a double-T-shaped cross piece over which a clamp to be tested is slided. The cross piece has a vertical bore therein for receiving a pressure-applying die for subjecting the clamp to a test pressure. The die is actuated by a motor-driven spindle and a transducer transforms the applied pressure to a voltage for display. Pressure is applied following a pre-determined curve corresponding to worst cast configurations of a wire bundle which may result in failure of the clamp to securely retain the bundle.