Abstract: A fuse element, in particular suited for use in electric and/or electronic circuits constructed by multilayer technology, including a printed circuit board substrate material, which is usable particularly in the multilayer technology and is coated with a metal or metal alloy from which the fuse is generated by means of photolithographic and/or printing image-producing techniques and ensuing etching or engraving processes, is proposed. The fuse is distinguished in that the printed circuit board substrate material, on which the fuse can be provided, includes at least a high-temperature-stable, electrically insulating material, with a coefficient of thermal expansion that varies essentially analogously to the coefficient of thermal expansion of the metal or metal alloy from which the fuse is made.

Abstract: The invention relates to a fuse element (12_1; 12_2), comprising two connecting contacts (24_1?, 24_1?; 24_2?, 24_2?) and an interposed conductive track (26_1; 26_2), wherein the conductive track (26_1; 26_2) has a reduced line-cross-section, in relation, to the connecting contacts (24_1?, 24_1?; 24_2?, 24_2?) at least in some sections, further comprising at least one overlay (16_1; 16_2?, 16_2?), wherein the fuse element (12_1; 12_2) and the overlay (16_1; 16_2?, 16_2?) each comprise materials which undergo diffusion when a predetermined ambient temperature is exceeded and when an electric current is conducted by the fuse element (12_1; 12_2). The invention further relates to a fuse (TO) having such a fuse element (12_1; 12_2) and a base support (14), wherein the fuse element (12_1; 12_2) is disposed on a surface of the base support (14).

Abstract: The invention relates to a fuse element (12_1; 12_2), comprising two connecting contacts (24_1?, 24_1?; 24_2?, 24_2?) and an interposed conductive track (26_1; 26_2), wherein the conductive track (26_1; 26_2) has a reduced line-cross-section in relation to the connecting contacts (24_1?, 24_1?; 24_2?, 24_2?) at least in some sections, further comprising at least one overlay (16_1; 16_2?, 16_2?), wherein the fuse element (12_1; 12_2) and the overlay (16_1; 16_2?, 16_2?) each comprise materials which undergo diffusion when a predetermined ambient temperature is exceeded and when an electric current is conducted by the fuse element (12_1; 12_2). The invention further relates to a fuse (IO) having such a fuse element (12_1; 12_2) and a base support (14), wherein the fuse element (12_1; 12_2) is disposed on a surface of the base support (14).

Abstract: A fuse element, in particular suited for use in electric and/or electronic circuits constructed by multilayer technology, including a printed circuit board substrate material, which is usable particularly in the multilayer technology and is coated with a metal or metal alloy from which the fuse is generated by means of photolithographic and/or printing image-producing techniques and ensuing etching or engraving processes, is proposed. The fuse is distinguished in that the printed circuit board substrate material, on which the fuse can be provided, includes at least a high-temperature-stable, electrically insulating material, with a coefficient of thermal expansion that varies essentially analogously to the coefficient of thermal expansion of the metal or metal alloy from which the fuse is made.

Abstract: A fuse element (10), in particular suited for use in electric and/or electronic circuits constructed by multilayer technology, including a printed circuit board substrate material (11), which is usable particularly in the multilayer technology and is coated with a metal or metal alloy (15), from which metal or metal alloy the fuse (12) is generated by means of photolithographic and/or printing image-producing techniques and ensuing etching or engraving processes, is proposed. The fuse (10) is distinguished in that the printed circuit board substrate material (11), on which the fuse (12) can be provided, includes at least a high-temperature-stable, electrically insulating material, with a coefficient of thermal expansion that varies essentially analogously to the coefficient of thermal expansion of the metal or metal alloy (15) from which the fuse (12) is made.