Abstract: Printed circuit boards which are to be tin-plated pass through a liquid application station in a horizontal direction, and thereafter through an activation station for the activation of the applied liquid. Then the printed circuit boards arrive at a receiver element of substantially U-shaped cross-sectional configuration, which subsequently is pivoted about a horizontal pivot shaft, out of a horizontal take-up position into a vertical transfer position. During this pivotal movement the printed circuit board bears upon a support element or part which supports the printed circuit board. By means of grippers the printed circuit board, previously brought by the receiver element into a vertical position, is immersed in vertical position into a solder bath. After a certain residence time the printed circuit board is inserted by the gripper into a further receiver element likewise having a U-shaped cross-sectional configuration, this receiver element being located in a vertical receiving position.

Abstract: A material web impregnated with a settable synthetic resin travels in vertical direction, from the bottom towards the top, through a first heat treatment zone where the solvent of the synthetic resin or plastic is evaporated and there occurs a chemical reaction. The tacky material web departing from the first heat or thermal treatment zone then passes through a cooling zone where it is cooled by means of a cooling medium to such a degree that it does not stick to the deflection or diverting rolls over which the material web subsequently is guided. After deflection of the material web the latter is moved in vertical direction downwardly through a second heat treatment zone where the chemical reaction proceeds. Prior to winding-up of the material web the latter is further cooled.

Abstract: Flat articles, in particular printed circuit boards, coated with a curable material, repose at their edges upon two belt conveyors which are positioned at an inclination. By means of these belt or band conveyors, the printed circuit boards are fed, in a predetermined conveying direction, below a heating device containing at least one hot air infeed device. The surface or face of the printed circuit board confronting such hot air infeed device is therefore subjected to the action of the hot or heated air, resulting in curing or hardening of the applied material layer. At the opposite side of the printed circuit board, facing away from the hot air infeed device, there is arranged a collecting tube or pipe which extends in the conveying direction. This collecting tube is provided with outlet openings for cooling air. Hence, the lower face of the printed circuit board has applied thereto the cooling air.

Abstract: The air foil nozzle dryer for drying webs of material is provided with two nozzle arrangements opposite one another relative to the webs of material passing between. The distance between the nozzles of the two nozzle arrangements and the cross-sectional area of the nozzle orifices may be adjusted.

Abstract: A method of, and apparatus for, applying a synthetic resin or plastic powder in a grate-shaped coating to web material wherein an upper layer is formed so as to coincide with and lie upon a lower layer applied by a relief-like structured printing roll. The upper layer is also formed by a relief-like structure printing roll. The powder for both layers, during its transfer into the spaces of the rolls, is brought to its sinter temperature, whereas the web material, before forming the lower layer, is heated approximately to the plasticizing temperature of the powder for this layer. The powder piles of the upper layer are placed upon those of the lower layer directly after transferring the latter to the web material.