Abstract: The device and method according to the invention are used to transfer an electronic ferromagnetic component from a carrier to a substrate using a magnetic assembly. The magnetic assembly is designed and arranged to aid in the correct positioning of the at least partly ferromagnetic electronic component on the substrate. The magnetic field generated by the magnetic assembly produces a magnetic force oriented from the carrier towards the substrate, said magnetic force aiding the transfer of the component from the carrier to the substrate such that a significantly increased positioning accuracy of the component is achieved compared to a transfer without said magnetic force.

Abstract: A method and a device for carrying out the method for transferring electronic components from a carrier substrate to a receiving substrate.

Abstract: A system for aligning an electronic component including a substrate having an aligning structure and an aligning device for aligning the electronic component with the aligning structure. The aligning structure defines a first and a second edge, which are at an angle relative to one another and are complementary to two sides of the electronic component to be aligned. The aligning device aligns the electronic component on the aligning structure by bringing sides of the electronic component into contact with both the first edge and also the second edge of the aligning structure. A dispensing unit dispensing the electronic component at a dispensing point by the device for aligning the electronic component close to the aligning structure. A receiving unit receives the electronic component aligned on the aligning structure in the device.

Abstract: The device and method according to the invention are used to transfer an electronic ferromagnetic component from a carrier to a substrate using a magnetic assembly. The magnetic assembly is designed and arranged to aid in the correct positioning of the at least partly ferromagnetic electronic component on the substrate. The magnetic field generated by the magnetic assembly produces a magnetic force oriented from the carrier towards the substrate, said magnetic force aiding the transfer of the component from the carrier to the substrate such that a significantly increased positioning accuracy of the component is achieved compared to a transfer without said magnetic force.

Abstract: The invention relates to a method and to a device designed for carrying out the method for transferring electronic components (K) from a carrier substrate (T) to a receiving substrate (A, Z).

Abstract: A system for aligning an electronic component including a substrate having an aligning structure and an aligning device for aligning the electronic component with the aligning structure. The aligning structure defines a first and a second edge, which are at an angle relative to one another and are complementary to two sides of the electronic component to be aligned. The aligning device aligns the electronic component on the aligning structure by bringing sides of the electronic component into contact with both the first edge and also the second edge of the aligning structure. A dispensing unit dispensing the electronic component at a dispensing point by the device for aligning the electronic component close to the aligning structure. A receiving unit receives the electronic component aligned on the aligning structure in the device.

Abstract: A method of producing an electronic module with at least one electronic component and one carrier. A structure is provided on the carrier so that the electronic component can take a desired target position relative to the structure. The structure is coated with a liquid meniscus suitable for receiving the electronic component. Multiple electronic components are provided at a delivery point for the electronic components. The carrier, with the structure, is moved nearby and opposite to the delivery point, where the delivery point delivers one of the electronic components without contact, while the structure on the carrier is moving near the delivery point, so that after a phase of free movement the electronic component at least partly touches the material, and the carrier, with the structure, is moved to a downstream processing point, while the electronic component aligns itself to the structure on the liquid meniscus.

Abstract: A method of producing an electronic module with at least one electronic component and one carrier. A structure is provided on the carrier so that the electronic component can take a desired target position relative to the structure. The structure is coated with a liquid meniscus suitable for receiving the electronic component. Multiple electronic components are provided at a delivery point for the electronic components. The carrier, with the structure, is moved nearby and opposite to the delivery point, where the delivery point delivers one of the electronic components without contact, while the structure on the carrier is moving near the delivery point, so that after a phase of free movement the electronic component at least partly touches the material, and the carrier, with the structure, is moved to a downstream processing point, while the electronic component aligns itself to the structure on the liquid meniscus.

Abstract: The invention concerns an RFID transponder device with at least one substrate and at least one RFID chip, with at least one electrically conductive first surface element, which is at a distance from the substrate and connected electrically to the substrate and/or the RFID chip by means of at least one electrically conductive first connecting element.

Abstract: In a method for producing an apparatus for wireless communication, particularly a contactless card, a E-passport, a Smart label or the like, or for producing a prelaminate for such an apparatus, an antenna is produced by applying an antenna structure to a substrate using an additive method, such as metal deposition. The substrate can be made of a PVC or polycarbonate material. A transponder is then produced by connecting a bare chip to the antenna using a direct assembly process, such as a flip-chip process. In a next step, the apparatus or the prelaminate for the apparatus is produced by connecting the transponder to further layers using a laminating method, wherein at least one of the further layers in directly adjoining relationship to the substrate is made of a same material as the substrate.

Abstract: Transponder having a dipole antenna which transmits and receives an electromagnetic wave having a wavelength ? and an RFID chip. The dipole antenna has at least one two-part conductor section with a total length l=?/2 and the chip is arranged between and connected to the two equal-length parts of the conductor section. Each part is composed of a first region made of a first conductive material which faces towards the RFID chip and has a first length which is proportionately small with regard to the total length, and of a second region made of a second conductive material which faces away from the RFID chip and has a second length.

Abstract: The invention relates to a method for connecting a flat bridge module; for chip modules to a flat substrate having a flat antenna on its upper side, in order to form a multi-layer transponder, wherein the bridge module has electrically conductive connection surfaces, wherein, in order to form a mechanical connection, an electrically insulating adhesive is arranged as a layer between an underside of the bridge module on the one hand and parts of an upper side of the substrate and parts of an upper side of the antenna on the other hand and then, in order to form an electrical connection, an electrically conductive adhesive is applied to sections of the upper side of the antenna which protrude laterally with respect to the bridge module in such a way that the adhesive at least partially covers the edges of upper sides of the bridge module. A multi-layer transponder is shown.

Abstract: The invention relates to a method of singulating thin chips from a sawn wafer, comprising the steps of glueing the wafer first onto a carrier and sawing it then into individual chips on said carrier. Subsequently, the chips are detached from the carrier individually or in groups. The method is so conceived that carrier is a rigid board and the adhesive is heat-soluble, the adhesive being deactivated with the aid of heat passing either through the chip itself or through the carrier prior to the detachment of said chips, whereupon the respective chip is detached.