Abstract: An electrical component, such as an RF device or thermal bridge, for use with a printed circuit board. The component may include a first dielectric layer having a top and a bottom, and a first conductive trace positioned on the bottom of the first dielectric layer. The component may also include a first ground layer positioned on the bottom of the first dielectric layer and spaced apart from the first conductive trace and a first solder layer connecting the first conductive trace to a second conductive trace of the printed circuit board and extending the full length of the first conductive trace. The component may also include a third conductive trace over the top of the first dielectric layer. The component may also include a pad under the first dielectric layer. The pad is soldered to a signal contact region of the printed circuit board. The third conductive trace is coupled to signal outputs formed by the signal contact region of the printed circuit board through a first via.

Abstract: An electrical component, such as an RF device or thermal bridge, for use with a printed circuit board. The component has a first dielectric layer having a top and a bottom, a first conductive trace positioned on the bottom of the dielectric layer, and a first ground layer positioned on the bottom of the dielectric layer and spaced apart from the first conductive trace. For RF applications, a second conductive trace is positioned on top of first dielectric, a second dielectric is positioned on top of the second conductive trace, and a second ground plane is positioned on top of the second dielectric. A printed circuit board having a third conductive trace may then be coupled to the first conductive trace by a first solder layer.

Abstract: An electrical component, such as an RF device or thermal bridge, for use with a printed circuit board. The component has a first dielectric layer having a top and a bottom, a first conductive trace positioned on the bottom of the dielectric layer, and a first ground layer positioned on the bottom of the dielectric layer and spaced apart from the first conductive trace. For RF applications, a second conductive trace is positioned on top of first dielectric, a second dielectric is positioned on top of the second conductive trace, and a second ground plane is positioned on top of the second dielectric. A printed circuit board having a third conductive trace may then be coupled to the first conductive trace by a first solder layer.

Abstract: The present invention is directed to an impedance matching network for use at a predetermined frequency.

Abstract: The present invention is directed to an impedance matching network for use at a predetermined frequency.

Abstract: An electrical component, such as an RF device or thermal bridge, for use with a printed circuit board. The component has a first dielectric layer having a top and a bottom, a first conductive trace positioned on the bottom of the dielectric layer, and a first ground layer positioned on the bottom of the dielectric layer and spaced apart from the first conductive trace. For RF applications, a second conductive trace is positioned on top of first dielectric, a second dielectric is positioned on top of the second conductive trace, and a second ground plane is positioned on top of the second dielectric. A printed circuit board having a third conductive trace may then be coupled to the first conductive trace by a first solder layer.

Abstract: A surface mount crossover component comprising first and second conductor lines electrically isolated from one another by an interposed dielectric layer and capacitively isolated from one another by an interposed ground plane layer. Current flowing through the crossover component via one of the conductor lines encounters no substantial interference from current flowing through the other one of the conductor lines.

Abstract: A surface mount balun includes a first stripline segment having a first and second end, a first balanced port connected to the first end, and a second balanced port connected to the second end, a second stripline segment overlapping and coupled to the first stripline segment, and having a third end adjacent to the first end of the first stripline segment and a fourth end disposed approximately adjacent to the center of the first stripline segment, a third stripline segment overlapping and coupled to the first stripline segment, and having a fifth end adjacent to the second end of the first stripline segment and a sixth end disposed approximately adjacent to the center of the first stripline segment, and a third, unbalanced port connected to the sixth end of the third stripline segment.