Abstract: A heat sink assembly comprises a base having one or more slots, and further comprises one or more fins, each having an end configured for insertion into a respective one of the slots. Each fin end has a first surface that is configured for conformally engaging a first slot sidewall for good thermal conduction from the base into the fin, and has a second surface configured for cold welding to a second slot sidewall for good mechanical fastening of the fin to the base. The combined thermal bonding and cold-welding engagement are produced by pressing the fin ends of the fins into the base slots at a controlled pressing rate. Further, leading and/or trailing edges of the fins may be beveled to improve airflow directed edgewise across the fins.

Abstract: A power resistor may be formed as a stacked arrangement of first and second terminal plates positioned on either side of a resistor plate and insulated therefrom by interposing first and second insulator plates. Preferably, the insulator plates are metallic plates with non-conductive surfaces. As an example, anodized aluminum plates may be used. The metallic insulator plates provide good thermal conduction paths between the resistor plate and the opposing terminal plates, allowing efficient heat transfer from the power resistor. Further, with metallic insulators, each layer in the stack may be made of metal with attendant structural advantages. For example, the stacked resistor may be subjected to significant compressive force in mounting without need for special precautions or load distribution measures, as might be required with ceramic insulating layers. Preferably, the stack includes interlayer features allowing it to be frictionally fitted together, thus simplifying assembly.

Abstract: A power resistor may be formed as a stacked arrangement of first and second terminal plates positioned on either side of a resistor plate and insulated therefrom by interposing first and second insulator plates. Preferably, the insulator plates are metallic plates with non-conductive surfaces. As an example, anodized aluminum plates may be used. The metallic insulator plates provide good thermal conduction paths between the resistor plate and the opposing terminal plates, allowing efficient heat transfer from the power resistor. Further, with metallic insulators, each layer in the stack may be made of metal with attendant structural advantages. For example, the stacked resistor may be subjected to significant compressive force in mounting without need for special precautions or load distribution measures, as might be required with ceramic insulating layers. Preferably, the stack includes interlayer features allowing it to be frictionally fitted together, thus simplifying assembly.