Patents by Inventor Hans-Peter Trah

Hans-Peter Trah has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5242533
    Abstract: Processes are proposed for structuring monocrystalline semiconductor substrates provided with a basic doping, in particular silicon substrates with a (100) or (110) crystal orientation. In this process, at least one main surface of the semiconductor substrate is passivated by means of a structured masking layer, and in an etching step etching into the semiconductor substrate is done anisotropically through openings in the masking layer. It is proposed that as the masking layer (12), a structured, preferably monocrystalline, layer of the basic material of the semiconductor substrate be used, which is doped such that a pn junction is produced between the masking layer (12) and the semiconductor substrate (10), the junction being polarized in the depletion direction and serving as an etch stop.
    Type: Grant
    Filed: January 30, 1992
    Date of Patent: September 7, 1993
    Assignee: Robert Bosch GmbH
    Inventors: Hans-Peter Trah, Guenther Findler, Joerg Muchow
  • Patent number: 5215244
    Abstract: A method of mounting a semiconductor wafer (10) on a metallic mounting surface, particularly during manufacture of valves with macromechanical valve bodies (20), features the steps of applying a metallization (11) to at least one major surface of the semiconductor wafer, and thereafter soldering the thus-metallized major surface, either wholly or in localized surface areas, to the metallic mounting surface.
    Type: Grant
    Filed: February 24, 1992
    Date of Patent: June 1, 1993
    Assignee: Robert Bosch GmbH
    Inventors: Juergen Buchholz, Hans-Peter Trah, Wolfgang Klucken
  • Patent number: 5216273
    Abstract: A microwave is made of a stack of layers. A sculptured silicon substrate is held between two covers each consisting of one or more layers. The inlet and the outlet of the microvalve are formed by perforations in the respective covers. A central valve plate is sculptured out of the silicon substrate with surfaces respectively facing the two covers in the region of the inlet and outlet in a symmetrical fashion. The valve plate is connected to the outer frame portion of the silicon substrate by one or more silicon strips. The valve plate is also shaped as a closure member near the inlet and/or the outlet. Electrodes are provided on the covers opposite the valve plate so that the valve can be electrostatically actuated with the valve plate serving as counterelectrode for these electrodes on the covers.
    Type: Grant
    Filed: September 19, 1991
    Date of Patent: June 1, 1993
    Assignee: Robert Bosch GmbH
    Inventors: Christian Doering, Thomas Grauer, Michael Mettner, Armin Schuelke, Jiri Marek, Hans-Peter Trah, Joerg Muchow, Martin Willmann