Abstract: An actively externally cooled housing with at least one electronic component having heat-dissipating capacity, has a ventilation inlet located outside the housing, the ventilation inlet generating an airflow that is guided through a lateral flow channel, the flow channel being located on any side wall of the cooled housing on which at least one electronic component with heat-dissipating capacity is located, wherein the ventilation inlet is located in a ventilation housing that is located on the top side of the active-cooled housing and has a lateral air outlet that leads into the lateral flow channel, whereby an air intake occurs through only one air inlet opening that is located on the underside of the ventilation housing and which is essentially open vertically downward, so that the ventilation unit is located in the ventilation housing in such a manner that it is protected against impurities in the ambient air

Abstract: According to the invention, an actively externally cooled housing with at least one electronic component, generating a heat-dissipating capacity, comprising a ventilation inlet arranged outside the housing, generating an airflow running through a lateral flow channel, arranged on any lateral wall of the cooled housing, on which at least one electronic component generating a heat-dissipating capacity is arranged, may be improved, such that overall, with regard to the electronic componentry and the ventilation unit, improved, in particular longer, service intervals, even in environments with unpurified air and also an improved cooling capacity and thus a comparatively high electrical power for the electronic components in the housing can be achieved, whereby, the air inlet occurs through only one air inlet opening, arranged on the underside of a ventilation housing and which is essentially open vertically downwards.