Abstract: An electrode assembly for simultaneously welding all the leads of a semiconductor chip to an outer lead frame is disclosed. The electrode assembly includes a gross electrode opposed to a plurality of spot electrodes, and a plurality of parallelogram support members for the spot electrodes, and a housing. Each of the plurality of parallelogram support members includes a first leg fixedly attached to the housing and a second leg supporting one of the spot electrodes. Each of the second legs is resiliently deformable into a stressed position when the electrode supported thereby is biased against the work piece whereby each spot electrode is independently responsive to structural changes in the work piece and contact is maintained between the work piece and the spot electrodes during the entire welding operation.