Abstract: A grounding device for reducing EMI emissions generated from a processor module is herein disclosed. The processor module includes a printed circuit board (PCB), having electronic components generating unwanted electromagnetic emissions, and a thermal plate capacitively coupled to the PCB. The grounding device is coupled to a connector resident on a motherboard. The grounding device includes a number of spring contact fingers and mounting tabs. The mounting tabs are used to mount the grounding device to the motherboard in a desired position and to provide an electrical connection to the ground plane of the motherboard. The spring contact fingers enable the thermal plate to maintain physical and electrical contact with the grounding device.

Abstract: An EMI reduction device is interposed between a printed circuit board (PCB) assembly and a heat sink. The PCB assembly includes a processor core that is the source of unintentional electromagnetic interference (EMI). The EMI reduction device contacts a heat sink which is positioned over the processor core such that it capacitively couples emissions from the processor core to a grounding plane resident in the PCB assembly, thereby reducing the unintentional EMI. Simultaneously, the EMI reduction device is able to maintain thermal contact with the heat sink.

Abstract: An EMI reduction device coupled between to a printed circuit board (PCB) assembly and a heat sink is herein disclosed. The PCB assembly includes a processor core that is the source of unintentional electromagnetic interference (EMI). The EMI reduction device is attached to a heat sink which is positioned over the processor core such that it capacitively couples emissions from the processor core to a grounding plane resident in the PCB assembly, thereby reducing the unintentional EMI. Simultaneously, the EMI reduction device is able to maintain thermal contact with the heat sink.

Abstract: An EMI reduction device is coupled between a printed circuit board (PCB) assembly and a heat sink. The PCB assembly includes a processor core that is the source of unintentional electromagnetic interference (EMI). The EMI reduction device is attached to a heat sink which is positioned over the processor core such that it capacitively couples emissions from the processor core to a grounding plane resident in the PCB assembly, thereby reducing the unintentional EMI. Simultaneously, the EMI reduction device is able to maintain thermal contact with the heat sink.