Patents by Inventor Hans Ullrich Eckert

Hans Ullrich Eckert has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20080261071
    Abstract: A method for reducing whisker formation and preserving solderability in tin coatings over metal features of electronic components. The tin coating has internal tensile stress and is between about 0.5 m and about 4.0 m in thickness. There is a nickel-based layer under the tin coating.
    Type: Application
    Filed: January 21, 2005
    Publication date: October 23, 2008
    Inventors: Chen Xu, Yun Zhang, Chonglun Fan, Oscar Khaselev, Joseph A. Abys, Eric Walch, Marlies Kleinfeld, Hans Ullrich Eckert