Patents by Inventor Hans-Ulrich Ehrke

Hans-Ulrich Ehrke has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and device for cleaning and then bonding substrates
    Patent number: 7168607
    Abstract: The invention relates to a method and to a device for cleaning and then bonding substrates. According to the invention, at least two opposite substrates are obliquely or vertically sprayed with a cleansing liquid by means of at least one nozzle and are preferably dried, aligned and directly bonded under micro-clean room conditions. The bonding process is preferably visually monitored during bonding in order to immediately remove insufficiently bonded substrates from the process. The inventive device is compact and allows integration of the process steps in a single installation without disruption. The invention is further characterized by an improved quality of the bonded layers and an improved productivity of the bonding process. It also allows the use of novel bonding processes.
    Type: Grant
    Filed: June 21, 2001
    Date of Patent: January 30, 2007
    Inventors: Hans-Ulrich Ehrke, Markus Gabriel, Richard Buttinger
  • Method and device for cleaning and then bonding substrates
    Publication number: 20040014298
    Abstract: The invention relates to a method and to a device for cleaning and then bonding substrates. According to the invention, at least two opposite substrates are obliquely or vertically sprayed with a cleansing liquid by means of at least one nozzle and are preferably dried, aligned and directly bonded under micro-clean room conditions. The bonding process is preferably visually monitored during bonding in order to immediately remove insufficiently bonded substrates from the process. The inventive device is compact and allows integration of the process steps in a single installation without disruption. The invention is further characterized by an improved quality of the bonded layers and an improved productivity of the bonding process. It also allows the use of novel bonding processes.
    Type: Application
    Filed: July 17, 2003
    Publication date: January 22, 2004
    Inventors: Hans-Ulrich Ehrke, Markus Gabriel, Richard Buttinger