Abstract: For a headlight comprising a plurality of light-emitting diode arrangements (LG) arranged in a manner distributed in planar fashion on a carrier plate (TP), a cooling device for dissipating thermal power losses arising in the individual light-emitting diode arrangements, in which cooling device a plurality of flow channels extending parallel in terms of flow engineering are provided. The individual flow channels each contain a heat sink (KK), around which flows the partial air flow through the flow channel (FR) for the transfer of heat and which is connected to the relevant assigned light-emitting diode arrangement in a manner exhibiting good thermal conductivity.

Abstract: A floodlight having a plurality of light-emitting diode arrangements which are arranged on a light-emitting surface on the front face of a support plate so as to be laterally spaced from one another. The light-emitting diode arrangements are retained directly or indirectly on the support plate by mechanically releasable retaining elements which can be actuated without tools. The retaining elements are designed such that the retaining elements can be actuated from the front face of the support plate, and the light-emitting diode arrangements can be removed from the front face of the support plate when the retaining elements are in the released position. At the same time, the retaining means press the light-emitting diode arrangements onto a heat sink arrangement in a retaining position in order to ensure a good heat transfer between the light-emitting diode arrangements and the heat sink arrangement.

Abstract: A floodlight having a plurality of light-emitting diode arrangements which are arranged on a light-emitting surface on the front face of a support plate so as to be laterally spaced from one another. The light-emitting diode arrangements are retained directly or indirectly on the support plate by mechanically releasable retaining elements which can be actuated without tools. The retaining elements are designed such that the retaining elements can be actuated from the front face of the support plate, and the light-emitting diode arrangements can be removed from the front face of the support plate when the retaining elements are in the released position. At the same time, the retaining means press the light-emitting diode arrangements onto a heat sink arrangement in a retaining position in order to ensure a good heat transfer between the light-emitting diode arrangements and the heat sink arrangement.

Abstract: For a headlight comprising a plurality of light-emitting diode arrangements (LG) arranged in a manner distributed in planar fashion on a carrier plate (TP), a cooling device for dissipating thermal power losses arising in the individual light-emitting diode arrangements, in which cooling device a plurality of flow channels extending parallel in terms of flow engineering are provided. The individual flow channels each contain a heat sink (KK), around which flows the partial air flow through the flow channel (FR) for the transfer of heat and which is connected to the relevant assigned light-emitting diode arrangement in a manner exhibiting good thermal conductivity.