Abstract: A bonding and indexing method is provided, having a first index head to move a substrate in an indexing direction from a first position to a second position; a second index head to move the substrate in an indexing direction from the second position to a third position; and the first and/or second index head has a bonding element to effect a bonding process between the substrate and an element disposed against the substrate so that bonding and movement in the indexing direction is implemented simultaneously by the first index head and/or bonding and movement in the indexing direction is implemented simultaneously by the second index head.

Abstract: A bonding and indexing apparatus has a first index head to move a substrate in an indexing direction from a first position to a second position and a second index head to move the substrate in an indexing direction from the second position to a third position. The first and/or second index head has a bonding element to effect a bonding process between the substrate and an element disposed against the substrate so that bonding and movement in the indexing direction is implemented simultaneously by the first index head and/or bonding and movement in the indexing direction is implemented simultaneously by the second index head.

Abstract: An apparatus is provided for transferring a semiconductor device from a wafer to a target position. The apparatus has at least one rotatable transfer assembly, which has a transfer head rotatable about an axis of rotation of the rotatable transfer assembly to transfer a semiconductor device from a pick-up position to a transfer position. The apparatus also has a transfer assembly actuator arrangement operative to effect movement of the at least one rotatable transfer assembly in an axial direction relative to a plane of rotation of the transfer head.

Abstract: A bonding and indexing apparatus has a first index head to move a substrate in an indexing direction from a first position to a second position and a second index head to move the substrate in an indexing direction from the second position to a third position. The first and/or second index head has a bonding element to effect a bonding process between the substrate and an element disposed against the substrate so that bonding and movement in the indexing direction is implemented simultaneously by the first index head and/or bonding and movement in the indexing direction is implemented simultaneously by the second index head.

Abstract: An apparatus is provided for transferring a semiconductor device from a wafer to a target position. The apparatus has at least one rotatable transfer assembly, which has a transfer head rotatable about an axis of rotation of the rotatable transfer assembly to transfer a semiconductor device from a pick-up position to a transfer position. The apparatus also has a transfer assembly actuator arrangement operative to effect movement of the at least one rotatable transfer assembly in an axial direction relative to a plane of rotation of the transfer head.