Abstract: An improved piezoresistive pressure sensor or an improved piezoresistive pressure pickup having a pressure measuring cell (13), a transmission diaphragm housing (7), which comprises a jacket housing section, a transmission diaphragm (17) and a backplate (21) and having a fluid pressure chamber (19) situated on the measuring diaphragm side is distinguished by the following featuresthe jacket housing section of the transmission diaphragm housing (7) comprises a pressure chamber sleeve (33),the pressure chamber sleeve (33) and the backplate (21) consists of weldable steel,the transmission diaphragm housing (7) and thus the pressure chamber sleeve (33) are or can be inserted in an annular recess (31) in the connection housing (3) in a sealing manner,the connection housing (3) consists of a material which cannot be welded or cannot easily be welded, andthe pressure chamber sleeve (33) and the backplate (21) are permanently welded in a sealing manner so as to seal off the pressure transmission medium provided in th

Abstract: A manometer that is simply constructed and therefore economical to manufacture and that can, in particular, be utilized even in the case of abrupt changes in pressure and in humid and conductive media, in particular in hydraulic engineering. Provided for in accordance with the invention is that even when using a glass protective/scratch layer 15 covering over the measuring resistances of the manometric cell 9, this glass protective layer can be omitted or removed in the contact region of the connecting wires (leads) 23. In this region, a glass-free casting compound is cast to protect the connection regions. The manometric cell is fixed to a support 19 and protected by the glass-free casting compound 29.

Abstract: A measurement circuit for carrying out a method of compensation, in particular for a piezoresistive pressure transducer with a measurement bridge (7) and a following output/differential amplifier (15) further comprises a current supply circuit (13). To enable an optimal temperature compensation for the measurement bridge (7) with maximum resolution of the pressure measurement signal, a digitalized compensation circuit with an analog/digital converter (21), a memory (23) and at least one digital/analog converter (25, 27) is connected ahead of the output/differential amplifier (15). The temperature dependent voltage difference/input signal at the measurement bridge (7) is digitalized via the following converter (21) and converted to compensation values stored in the memory (23). These values are converted into an analog compensation signal in a converter (25, 27). For analog measured value determination per se, only error compensation is carried out in digitalized fashion (FIG. 2).

Abstract: A piezoresistive pressure measuring cell having a measuring membrane or diaphragm provided with resistance elements and with conductors extending from contact points on the resistance element to the measuring membrane, and wherein the connections between the pressure measuring cell and external components is accomplished through utilization of flexible circuitry.

Abstract: The pressure cell has a front end cell wall embodied by a metering diaphragm which contains at least one resistor applied by coating and passes over at its backside into an annular cylinder barrel which is closed by a rear cell wall cemented to the same by plastic material adapted to be stressed under elastic elongation and shear. The rear cell wall consists of a material which differs from that of the metering diaphragm. Yet the pressure cell is practically free of any external stress under normal ambient conditions because of the elasticity of the plastic material used for cementing. The pressure cell may be used, for example, in electronic sphygmo-manometers, in carburetors of internal combustion engines for automatic adjustment of the same, and the like. Absolute pressure and reference pressure measurements may be taken. By virtue of the small hysteresis, pressure variations in rapid succession can be measured. The preferred pressure measuring range lies between 0.

Abstract: A method for batch fabricating semiconductor stress sensors having the semiconductor material diaphragm rigidly joined to a support flange made of the same semi-conducting material. Two processed silicon slices, one to form diaphragms and the other to form support flanges, are rigidly joined. The joined slices are then partitioned to form individual stress sensors.