Patents by Inventor Hans W. Piekaar

Hans W. Piekaar has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5354433
    Abstract: Method for providing a proportioned gas flow of triisobutylaluminum from liquid triisobutylaluminum having isobutene admixed therein. The liquid is preheated sufficiently to evaporate the isobutene therefrom but leaving the triisobutylaluminum substantially in liquid phase. The vaporized isobutene is separated from the liquid triisobutylaluminum, and subsequently the triisobutylaluminum from which isobutene has been removed is evaporated. Preheating is conducted at a temperature of 30.degree.-40.degree. C. The evaporation of liquid triisobutylaluminum is conducted at a temperature of 40.degree.-60.degree. C.
    Type: Grant
    Filed: November 19, 1991
    Date of Patent: October 11, 1994
    Assignee: ASM International N.V.
    Inventors: Ernst H. A. Granneman, Laurens F. T. Kwakman, Hans W. Piekaar, Boudewijn G. Sluijk
  • Patent number: 5294572
    Abstract: Method and apparatus for the batchwise simultaneous treatment of several substrates by chemical vapor deposition. The method is carried out in a closed system and before the deposition treatment, the substrates are subjected to a cleaning treatment in the same system.
    Type: Grant
    Filed: November 1, 1991
    Date of Patent: March 15, 1994
    Assignee: ASM International N.V.
    Inventors: Ernst H. A. Granneman, Hans W. Piekaar, Hubertus A. Corsius, Boudewijn G. Sluijk
  • Patent number: 5167761
    Abstract: A process for halide etching of a semi-conductor substrate in the presence of water. Etching is realized in a reaction vessel. The process steps comprise filling of the reaction vessel with a first gas to a first pressure and subsequently filling the reaction vessel with a second gas to a second pressure after which the substrate is left in the reaction vessel for several minutes to obtain the etching required. One of the gases is HF and the other of the gases is water vapor. The etching is conducted at sub-atmospheric pressure, preferably below 50 Torr.
    Type: Grant
    Filed: September 23, 1991
    Date of Patent: December 1, 1992
    Assignee: ASM International N.V.
    Inventors: Johannes F. M. Westendorp, Hans W. Piekaar