Abstract: The invention refers to a procedure for etching of materials at the surface by focussed electron beam induced chemical reactions at said surface. The invention is characterized in that in a vacuum atmosphere the material which is to be etched is irradiated with at least one beam of molecules, at least one beam of photons and at least one beam of electrons, whereby the irradiated material and the molecules of the beam of molecules are excited in a way that a chemical reaction predetermined by said material and said molecules composition takes place and forms a reaction product and said reaction product is removed from the material surface-irradiation and removal step.

Abstract: The invention pertains to a process for the production of particle beam systems (10-10??, 12-12?), in which at least one first particle beam system (10-10??) is produced on a first substrate (14) by computer-guided particle beam-induced deposition, and the minimum of one first particle beam system (10-10??) is used to produce at least one second particle beam system (12-12?) on at least one second substrate (16) by computer-guided particle beam-induced deposition. The inventive process makes it possible to produce a large number of particle beam systems in a relatively short time.

Abstract: The invention relates to a procedure for etching of materials at the surface by focussed electron beam induced chemical reaction at the surface, with the following steps: a) in a vacuum atmosphere the material which is to be etched is irradiated with at least one beam of molecules and at least one first beam of electrons, whereby the irradiated material and the molecules of the beam of molecules are excited in a way that a chemical reaction takes place and forms a reaction product, which is not gaseous/not volatile—reaction step. The invention is characterized in that b) the reaction product is evaporated from said surface by an second beam of electrons, which heats the material locally to a temperature above the vaporisation temperature of the reaction product —removal step—.

Abstract: “A process for fabricating active and passive, polymer-based components for use in integrated optics. As a result of this process, active and passive optoelectronic components of a high quality having a high level of integration and high packing density are fabricated. A patternable polymer resist layer of a high quality is deposited onto an optoelectronic component. An etching mask is used in conjunction with a high-grade anisotropic deep etching to produce a pattern, which is filled with monomers through gas-phase or liquid-phase diffusion. The optical properties of the optical component can be selectively changed as a function of the type of monomers used for the diffusion, as well as of the temperature and application time. The process makes it possible to increase the packing density of future integrated monomode optics and simultaneously produce large quantities in a cost-effective manner.

Abstract: The invention refers to a procedure for etching of materials at the surface by focussed electron beam induced chemical reactions at said surface. The invention is characterized in that in a vacuum atmosphere the material which is to be etched is irradiated with at least one beam of molecules, at least one beam of photons and at least one beam of electrons, whereby the irradiated material and the molecules of the beam of molecules are excited in a way that a chemical reaction predetermined by said material and said molecules composition takes place and forms a reaction product and said reaction product is removed from the material surface-irradiation and removal step.

Abstract: A method for wavelength-selective mixing and/or distribution of polychromatic light. When mixing polychromatic light, lights having only one wavelength are successively fed to each member of a selective chain to form a partial spectrum, and when distributing chromatic light, one wavelength is filtered out of each member and the remaining spectrum is fed after reflection to the next member for being further decomposed. A chain of photonic crystals is used both for mixing and distributing and a wavelength-selective coupler/decoupler is associated to each crystal. Fields of application include the wavelength-selective mixture or distribution of polychromatic light and spectrometric measurements and environment monitoring.

Abstract: The invention refers to a procedure for etching of materials at the surface by focussed electron beam induced chemical reactions at said surface. The invention is characterized in that in a vacuum atmosphere the material which is to be etched is irradiated with at least one beam of molecules, at least one beam of photons and at least one beam of electrons, whereby the irradiated material and the molecules of the beam of molecules are excited in a way that a chemical reaction predetermined by said material and said molecules composition takes place and forms a reaction product and said reaction product is removed from the material surface —irradiation and removal step.

Abstract: The object of the process according to the present invention is to fabricate active and passive optoelectronic components of a high quality, and having a high level of integration and high packing density.

Abstract: A process which allows effective application or removal of materials to and from substrates using a scanning probe microscope operated at atmospheric pressure. The substrate is placed in a trough, located on the x-y table of a scanning probe microscope (SXM), and this trough is filled with a liquid and/or gaseous medium up to a level such that the top side of the substrate is covered with a thin layer, composed of at least one monolayer of the medium. For depositing a structured precipitate from the medium or for structuring etching of the surface of the substrate, the microtip of the SXM is then dipped into the layer and supplied with an electric voltage or with voltage pulses. The process can be used for applying or removing materials to and from substrates. The process is also usable for characterization of the geometry and for restoration or the production of microtips of SXM cantilevers, as well as for storing information, for reading information and for erasing information.

Abstract: In a test head for a scanning probe microscope for the contactless testing of integrated electronic circuits, a group of probes produced by three-dimensional additive lithography is disposed on a substrate. The probes are directed at a point situated centrally above the group of probes. The conducting probes as well as the base end of the capacitive probe are joined to printed circuit trace structures on the substrate for connection to a test circuit.

Abstract: A picture recording device includes at least one photodetector for each picture element to be recorded before which one focusing element is arranged for forming an image of each element of the picture to be recorded on the photodetector. The picture recording device is fabricated as a thin, preferably flexible sheet and, on the side facing away from the picture to be recorded, further focusing elements are arranged in such a way that light emitted from a screen having the picture recording device mounted thereon is focused in a plane situated inside or directly in front of the picture recording device, ensuring an undisturbed viewing of the picture.

Abstract: In a photon detector wherein material of light-dependent conductivity is disposed between electrically conductive connections, the material is nanocrystalline composite material, said nanocrystalline composite material, in the process of making it, being applied to a substrate by corpuscular-beam-induced deposition, organo-metallic compounds being used as starting materials, said organo-metallic compounds being adsorbed on the surface of the substrate owing to their high vapor pressure.

Abstract: Three-dimensional, patterned surfaces, which were produced by dry-etching technology and have zones with different degrees of polymerization, are subjected to a time-limited dry-etching process in fluorine-containing plasma, In this context, an ablation process is used, which proceeds as a function of time, from incompletely polymerized material to completely polymerized material. Weakly polymerized regions, in particular those resulting from the proximity effect, may be removed.