Patents by Inventor Hans-Willi Losensky

Hans-Willi Losensky has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6589606
    Abstract: A process is described in which a nonconductive molding is electrostatically coated with a thermoplastic or crosslinkable copolyamide hot-melt adhesive. The hot-melt adhesive may be used as a fine powder with a particle size between 1 and 200 &mgr;m and have a melting point up to 160° C.
    Type: Grant
    Filed: June 29, 2001
    Date of Patent: July 8, 2003
    Assignee: Degussa AG
    Inventors: Paul-Ludwig Waterkamp, Ulrich Simon, Hans-Willi Losensky
  • Publication number: 20020031614
    Abstract: A process is described which permits the electrostatic coating of nonconducting moldings with thermoplastic or crosslinkable copolyamide hot-melt adhesives.
    Type: Application
    Filed: June 29, 2001
    Publication date: March 14, 2002
    Inventors: Paul-Ludwig Waterkamp, Ulrich Simon, Hans-Willi Losensky
  • Patent number: 6300413
    Abstract: A crosslinkable hot-melt adhesive composition, comprising a reactive powder mixed with a crosslinking component of a crosslinking agent bound in a polyolefin matrix, wherewith the components of the composition do not react by crosslinking until the mixture is melted, said composition being useful for the coating and/or lamination of sheet-like structures.
    Type: Grant
    Filed: March 3, 1999
    Date of Patent: October 9, 2001
    Assignee: Degussa-Huels Aktiengesellschaft
    Inventors: Ulrich Simon, Thorsten Gurke, Hans-Willi Losensky