Abstract: Provided is a method of manufacturing a zinc-plated steel sheet. The method includes: coating a metal on the steel sheet on a steel sheet; annealing the metal coated steel sheet; and zinc plating the annealed steel sheet by dipping in a molten zinc plating bath. Further provided is a method of manufacturing a hot-press part including: coating a metal on the steel sheet on a steel sheet; annealing the metal coated steel sheet; zinc plating the annealed steel sheet by dipping in a molten zinc plating bath; heating the zinc-plated steel sheet; and press forming the heated steel sheet.

Abstract: A seat for a vehicle, includes a second row center seat and a second row side seat provided on a partition wall positioned rearward of a driver seat, the second row center seat may move leftward or rightward, and an interval between the seats may be increased in a state in which the second row center seat is moved in a right direction away from the second row side seat, which makes it possible to maximally prevent body contact between a passenger in the second row center seat and a passenger in the second row side seat.

Abstract: The present disclosure relates to a vehicle rear seat including: a center seat; and side seats located on the left and right of the center seat, wherein, the center seat is capable of protruding by moving the center seat forward with respect to the side seats, and in the state in which the center seat protrudes forward, it is possible to increase an inter-passenger distance so that physical contact between the passenger of the center seat and the passenger of each of the side seats can be prevented as much as possible.

Abstract: A drum pedal is characterized by including: a base part; a pair of support parts provided at the front side of the base part; a cam part that is axially coupled to the pair of support parts via a main shaft; a hitting part that is axially coupled to the pair of support parts via the main shaft and disposed to be adjacent to the cam part; a pedal part of which one end is coupled to the rear side of the base part and which is formed to extend in the direction of the front side of the base part; and a power transmission part that connects the cam part and the pedal part and rotates the main shaft and the cam part according to a load applied to the pedal part, wherein at least two different power transmission parts can be selectively coupled to the cam part.

Abstract: A drum pedal is characterized by including: a base part; a pair of support parts provided at the front side of the base part; a cam part that is axially coupled to the pair of support parts via a main shaft; a hitting part that is axially coupled to the pair of support parts via the main shaft and disposed to be adjacent to the cam part; a pedal part of which one end is coupled to the rear side of the base part and which is formed to extend in the direction of the front side of the base part; and a power transmission part that connects the cam part and the pedal part and rotates the main shaft and the cam part according to a load applied to the pedal part, wherein at least two different power transmission parts can be selectively coupled to the cam part.

Abstract: A fan-out sensor package includes: a redistribution portion having a through-hole and including a wiring layer and vias; a first semiconductor chip having an active surface having a sensing region of which at least a portion is exposed through the through-hole and first connection pads disposed in the vicinity of the sensing region; a second semiconductor chip disposed side by side with the first semiconductor chip in a horizontal direction and having second connection pads; dam members disposed in the vicinity of the first connection pads; an encapsulant encapsulating the redistribution portion, the first semiconductor chip, and the second semiconductor chip; and electrical connection structures electrically connecting the first connection pads and the second connection pads to the wiring layer or the vias of the redistribution portion.

Abstract: A fan-out sensor package includes: a sensor chip having a first connection pads and an optical layer; an encapsulant encapsulating at least portions of the sensor chip; a connection member disposed on the sensor chip and the encapsulant and including a redistribution layer electrically connected to the first connection pads; through-wirings penetrating through the encapsulant and electrically connected to the redistribution layer; and electrical connection structures disposed on the other surface of the encapsulant opposing one surface of the encapsulant on which the connection member is disposed and electrically connected to the through-wirings, wherein the sensor chip and the connection member are physically spaced apart from each other by a predetermined distance, and the first connection pads and the redistribution layer are electrically connected to each other through first connectors disposed between the sensor chip and the connection member.

Abstract: A fan-out semiconductor package includes: a core member having a first through-hole and including first and second wiring layer disposed on different levels; a first semiconductor chip disposed in the first through-hole; a second semiconductor chip disposed on the first semiconductor chip in the first through-hole so that a second inactive surface faces a first inactive surface; conductive wires disposed on the core member and a second active surface and electrically connecting second connection pads and the second wiring layer to each other; an encapsulant covering at least portions of the core member, the first semiconductor chip, the second semiconductor chip, and the conductive wires and filling at least portions of the first through-hole; and a connection member disposed on the core member and a first active surface and electrically connecting first connection pads and the first wiring layer to each other.

Abstract: A fan-out sensor package includes: a redistribution portion having a through-hole and including a wiring layer and vias; a first semiconductor chip having an active surface having a sensing region of which at least a portion is exposed through the through-hole and first connection pads disposed in the vicinity of the sensing region; a second semiconductor chip disposed side by side with the first semiconductor chip in a horizontal direction and having second connection pads; dam members disposed in the vicinity of the first connection pads; an encapsulant encapsulating the redistribution portion, the first semiconductor chip, and the second semiconductor chip; and electrical connection structures electrically connecting the first connection pads and the second connection pads to the wiring layer or the vias of the redistribution portion.

Abstract: A fan-out sensor package includes: a sensor chip having a first connection pads and an optical layer; an encapsulant encapsulating at least portions of the sensor chip; a connection member disposed on the sensor chip and the encapsulant and including a redistribution layer electrically connected to the first connection pads; through-wirings penetrating through the encapsulant and electrically connected to the redistribution layer; and electrical connection structures disposed on the other surface of the encapsulant opposing one surface of the encapsulant on which the connection member is disposed and electrically connected to the through-wirings, wherein the sensor chip and the connection member are physically spaced apart from each other by a predetermined distance, and the first connection pads and the redistribution layer are electrically connected to each other through first connectors disposed between the sensor chip and the connection member.

Abstract: A fan-out semiconductor package includes: a core member having a first through-hole and including first and second wiring layer disposed on different levels; a first semiconductor chip disposed in the first through-hole; a second semiconductor chip disposed on the first semiconductor chip in the first through-hole so that a second inactive surface faces a first inactive surface; conductive wires disposed on the core member and a second active surface and electrically connecting second connection pads and the second wiring layer to each other; an encapsulant covering at least portions of the core member, the first semiconductor chip, the second semiconductor chip, and the conductive wires and filling at least portions of the first through-hole; and a connection member disposed on the core member and a first active surface and electrically connecting first connection pads and the first wiring layer to each other.

Abstract: Disclosed relates to a method and an apparatus for measuring fluorescence polarization FP in a lab-on-a-chip and, more concretely, to a method and an apparatus that measure quantitatively interactions between biomolecules and fluorescently labeled biomaterials and enzyme activities using the measurement of fluorescence polarization FP. The method and the apparatus of the invention provide rapid assays with minute amounts of samples using an automated device compared to conventional methods. Accordingly, the method and the apparatus of the invention can be usefully applied to the measurement of interactions between biomolecules and to the protease assays using a protein substrate.

Abstract: Disclosed relates to a method and an apparatus for measuring fluorescence polarization FP in a lab-on-a-chip and, more concretely, to a method and an apparatus that measure quantitatively interactions between biomolecules and fluorescently labeled biomaterials and enzyme activities using the measurement of fluorescence polarization FP. The method and the apparatus of the invention provide rapid assays with minute amounts of samples using an automated device compared to conventional methods. Accordingly, the method and the apparatus of the invention can be usefully applied to the measurement of interactions between biomolecules and to the protease assays using a protein substrate.

Abstract: An implantable left ventricular assist device using a cylindrical cam is provided, which is produced in a compact and module form and implanted in a patient who suffers from an acute cardiac insufficiency, to thereby enable oxygen to be supplied smoothly toward the heart of the patient and reconstruct the declined function of the heart. The implantable left ventricular assist device includes an actuator for generating a linearly reciprocating driving force, a pusher plate which performs a linearly reciprocating motion by the actuator, a blood sac which is contracted and expanded due to compression by reciprocating the pusher plate and the restoration of a sac itself, and a chamber for accommodating the blood sac, the pusher plate and the actuator, combining the same physically, and protecting the same within the body of a patient.

Abstract: A six-degree-of-freedom parallel mechanism is provided for expanding a grade of a spindle. The parallel mechanism has a spindle that turns round a workpiece at a tilting angle of 90.degree. in a workspace, to thereby allow a machining for both vertical and horizontal planes of the workpiece, and a vertical turning process, by a single machining center. A six-axis multi-machining type machining center embodying the parallel mechanism of the present invention is also disclosed. An over-actuated multi-machining type machining center further including over-actuated actuators is presented to solve a problem of driving joints' singularity caused by the parallel mechanism.