Abstract: A semiconductor chip includes a substrate having a low-k material layer. An electrode pad is disposed the substrate. A first protection layer at least partially surrounds the electrode pad. The first protection layer includes a first opening at an upper portion thereof. A buffer pad is electrically connected to the electrode pad. A second protection layer at least partially surrounds the buffer pad. The second protection layer includes a second opening at an upper portion thereof. A pillar layer and a solder layer are sequentially stacked on the buffer pad. A thickness of the buffer pad is greater than a thickness of the electrode pad. A width of the first opening in a first direction parallel to an upper surface of the semiconductor substrate is equal to or greater than a width of the second opening in the first direction.

Abstract: A semiconductor chip includes a substrate. An electrode pad is disposed on the substrate. The electrode pad includes a low-k material layer. A first protection layer at least partially surrounds the electrode pad. The first protection layer includes a first opening at an upper portion thereof. A buffer pad is electrically connected to the electrode pad. A second protection layer at least partially surrounds the buffer pad. The second protection layer includes a second opening at an upper portion thereof. A pillar layer and a solder layer are sequentially stacked on the buffer pad. A thickness of the buffer pad is greater than a thickness of the electrode pad. A width of the first opening in a first direction parallel to an upper surface of the semiconductor substrate is equal to or greater than a width of the second opening in the first direction.

Abstract: A water level package includes a substrate, a plurality of semiconductor chips mounted on the substrate, and molding members that contact the substrate and the plurality of semiconductor chips and are formed on the substrate. The molding members include two or more molding members that have coefficients of thermal expansion (CTEs) different from each other.

Abstract: A water level package includes a substrate, a plurality of semiconductor chips mounted on the substrate, and molding members that contact the substrate and the plurality of semiconductor chips and are formed on the substrate. The molding members include two or more molding members that have coefficients of thermal expansion (CTEs) different from each other.

Abstract: A semiconductor package includes a light transmissive cover having a conductive pattern, a substrate having a cavity, a semiconductor chip in the cavity of the substrate and electrically connected to the conductive pattern arranged on the light transmissive cover, and a blocking pattern between the light transmissive cover and the substrate.

Abstract: A camera module includes an image sensor chip including a substrate having first and second opposite surfaces and a ground pad on the first surface, a housing surrounding the sides of the image sensor chip but which leaves the second surface of the image sensor chip exposed, an electromagnetic wave-shielding film united with the housing, and an electrical conductor electrically connected to the ground pad. The camera module also has an optical unit disposed on the first surface of the image sensor chip in the housing to guide light from an object to the image sensor chip. The electrical conductor extends through a side of the housing. The conductor also contacts the electromagnetic wave-shielding film to electrically connect the ground pad and the electromagnetic wave-shielding film.

Abstract: An image sensor includes an objective lens arranged on an optical axis; a substrate including a plurality of photoelectric conversion devices; and a micro lens layer including a plurality of micro lenses corresponding to each of the plurality of photoelectric conversion devices, respectively, wherein the plurality of micro lenses includes a central micro lens corresponding to a central portion of the objective lens, and an edge micro lens corresponding to an edge portion of the objective lens, and the plurality of micro lenses are configured such that focal lengths of the micro lenses increase from the central micro lens toward the edge micro lens.

Abstract: An image sensor includes an objective lens arranged on an optical axis; a substrate including a plurality of photoelectric conversion devices; and a micro lens layer including a plurality of micro lenses corresponding to each of the plurality of photoelectric conversion devices, respectively, wherein the plurality of micro lenses includes a central micro lens corresponding to a central portion of the objective lens, and an edge micro lens corresponding to an edge portion of the objective lens, and the plurality of micro lenses are configured such that focal lengths of the micro lenses increase from the central micro lens toward the edge micro lens.

Abstract: A camera module includes an image sensor chip including a substrate having first and second opposite surfaces and a ground pad on the first surface, a housing surrounding the sides of the image sensor chip but which leaves the second surface of the image sensor chip exposed, an electromagnetic wave-shielding film united with the housing, and an electrical conductor electrically connected to the ground pad. The camera module also has an optical unit disposed on the first surface of the image sensor chip in the housing to guide light from an object to the image sensor chip. The electrical conductor extends through a side of the housing. The conductor also contacts the electromagnetic wave-shielding film to electrically connect the ground pad and the electromagnetic wave-shielding film.

Abstract: A camera module includes an image sensor chip including a substrate having first and second opposite surfaces and a ground pad on the first surface, a housing surrounding the sides of the image sensor chip but which leaves the second surface of the image sensor chip exposed, an electromagnetic wave-shielding film united with the housing, and an electrical conductor electrically connected to the ground pad. The camera module also has an optical unit disposed on the first surface of the image sensor chip in the housing to guide light from an object to the image sensor chip. The electrical conductor extends through a side of the housing. The conductor also contacts the electromagnetic wave-shielding film to electrically connect the ground pad and the electromagnetic wave-shielding film.

Abstract: A semiconductor package includes a light transmissive cover having a conductive pattern, a substrate having a cavity, a semiconductor chip in the cavity of the substrate and electrically connected to the conductive pattern arranged on the light transmissive cover, and a blocking pattern between the light transmissive cover and the substrate.

Abstract: An image sensor includes an objective lens arranged on an optical axis; a substrate including a plurality of photoelectric conversion devices; and a micro lens layer including a plurality of micro lenses corresponding to each of the plurality of photoelectric conversion devices, respectively, wherein the plurality of micro lenses includes a central micro lens corresponding to a central portion of the objective lens, and an edge micro lens corresponding to an edge portion of the objective lens, and the plurality of micro lenses are configured such that focal lengths of the micro lenses increase from the central micro lens toward the edge micro lens.

Abstract: Provided is a camera module providing EMS shielding, so that electromagnetic waves generated in the camera module are prevented from radiating to the outside and external electromagnetic waves or noise are prevented from flowing into the camera module. The camera module includes: a lens unit comprising at least one lens; an image sensor package including an image sensor chip having an image area where an image is formed in response to light passing through the lens unit; a housing surrounding the lens unit and the image sensor package, wherein the housing is electrically connected to the image sensor package and is formed of a conductive material; and a connection terminal disposed below the image sensor package and electrically connecting the image sensor package and a main board of an electronic device including the camera module.

Abstract: A camera module includes an image sensor package including an image sensor chip and a chip cover layer protecting the image sensor chip, a first lens disposed above the image sensor package to be coupled with an upper surface of the chip cover layer, a second lens disposed over the first lens, and an infrared blocking film formed in direct contact with the upper surface of the chip cover layer or an upper surface of the second lens.

Abstract: A camera module includes an image sensor chip including a substrate having first and second opposite surfaces and a ground pad on the first surface, a housing surrounding the sides of the image sensor chip but which leaves the second surface of the image sensor chip exposed, an electromagnetic wave-shielding film united with the housing, and an electrical conductor electrically connected to the ground pad. The camera module also has an optical unit disposed on the first surface of the image sensor chip in the housing to guide light from an object to the image sensor chip. The electrical conductor extends through a side of the housing. The conductor also contacts the electromagnetic wave-shielding film to electrically connect the ground pad and the electromagnetic wave-shielding film.

Abstract: Provided is a camera module providing EMS shielding, so that electromagnetic waves generated in the camera module are prevented from radiating to the outside and external electromagnetic waves or noise are prevented from flowing into the camera module. The camera module includes: a lens unit comprising at least one lens; an image sensor package including an image sensor chip having an image area where an image is formed in response to light passing through the lens unit; a housing surrounding the lens unit and the image sensor package, wherein the housing is electrically connected to the image sensor package and is formed of a conductive material; and a connection terminal disposed below the image sensor package and electrically connecting the image sensor package and a main board of an electronic device including the camera module.