Patents by Inventor Hao An

Hao An has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200021063
    Abstract: A connector includes a metal housing, an insulating body received in the metal housing, a conductive terminal held in the insulating body and electrically connected to a wire introduced into the metal housing, and a conductive shield mounted in the metal housing and sleeved on a conductive shielding layer of the wire. The conductive shield has a C-shaped ring adapted to electrically and elastically contact an inner wall of the metal housing and a plurality of elastic arms connected to a side of the C-shaped ring and adapted to electrically and elastically contact the conductive shielding layer.
    Type: Application
    Filed: September 23, 2019
    Publication date: January 16, 2020
    Applicant: Tyco Electronics (Shanghai) Co. Ltd.
    Inventors: Jiefeng Zhang, Hao Wang, Qijun Zhao, Ning Wang, Jianfei Yu, Bo Gao, Biao Pan
  • Publication number: 20200021993
    Abstract: Techniques for identity-based message integrity protection and verification between a user equipment (UE) and a wireless network entity, include use of signatures derived from identity-based keys. To protect against attacks from rogue network entities before activation of a security context with a network entity, the UE verifies integrity of messages by checking a signature using an identity-based public key PKID derived by the UE based on (i) an identity value (ID) of the network entity and (ii) a separate public key PKPKG of a private key generator (PKG) server. The network entity generates signatures for messages using an identity-based private key SKID obtained from the PKG server, which generates the identity-based private key SKID using (i) the ID value of the network entity and (ii) a private key SKPKG that is known only by the PKG server and corresponds to the public key PKPKG.
    Type: Application
    Filed: March 5, 2019
    Publication date: January 16, 2020
    Inventors: Xiangying YANG, Shu GUO, Lijia ZHANG, Qian SUN, Huarui LIANG, Fangli XU, Yuqin CHEN, Haijing HU, Dawei ZHANG, Hao DUO, Lanpeng CHEN
  • Publication number: 20200021420
    Abstract: This application discloses a resource configuration method, a method for determining a bandwidth part, a method for indicating a bandwidth part, and a device. The method for indicating a bandwidth part includes: determining, by a base station, the bandwidth part based on a mapping relationship between a first carrier bandwidth and a first bandwidth part set and/or a mapping relationship between a capability bandwidth of a terminal device and a second bandwidth part set, where the first bandwidth part set includes a plurality of bandwidth parts, the first bandwidth part set includes the bandwidth part, the second bandwidth part set includes a plurality of bandwidth parts, and the second bandwidth part set includes the bandwidth part; and indicating, by the base station, the bandwidth part to the terminal device.
    Type: Application
    Filed: September 24, 2019
    Publication date: January 16, 2020
    Inventors: Xinxian LI, Wenwen HUANG, Hao TANG, Zhenfei TANG, Zhongfeng LI, Guohua ZHOU
  • Publication number: 20200021624
    Abstract: Disclosed is a secure communication method of an IMS system based on a key file. The method includes obtaining an IMS account before sending the account and authentication information to a background server by a UE; generating an electronic work order by the background sever according to the received authentication information to enable customer service personnel to manually audit the authentication information and the IMS account according to a preset rule and the electronic work order; generating an encrypted key file and sending the file to the UE when determining the correctness of the authentication information and the IMS account; and activating the IMS account according to the key file and performing network communication according to the IMS account. The disclosure improves the communication security of the IMS system by using the activated IMS account for network communication.
    Type: Application
    Filed: September 14, 2018
    Publication date: January 16, 2020
    Inventors: Lihong Hao, Jiuchang Qin, Yuanlin Ma
  • Publication number: 20200018323
    Abstract: A blade, an impeller and a fan are provided. A trailing edge (12) of the blade (1) is provided with at least one concave arc segment (15). At least one end point of the at least one concave arc segment (15) is located between a radial outer edge (13) of the blade (1) and a radial inner edge (14) of the blade (1). The blade (1) is provided with at least one ridge structure protruding from a pressure surface (18) of the blade (1) toward a suction surface (17) of the blade (1). The blade is provided with at least one concave arc segment at a trailing edge thereof on the basis of a bionics principle, and is further provided with a ridge structure, thus improving an airflow pattern at the trailing edge of the blade by means of changing a shape of the blade, and reducing noise accordingly.
    Type: Application
    Filed: September 28, 2017
    Publication date: January 16, 2020
    Inventors: Feng Cao, Jianhuang Zou, Zhongjie Liu, Binhua Long, Hao Liu
  • Publication number: 20200022158
    Abstract: This application provides a data transmission method, a terminal device, and an access network device. The data transmission method includes: receiving, by a terminal device, information, sent by an access network device, about a carrier corresponding to the terminal device; determining, based on the information about the carrier, a process quantity corresponding to the carrier; and transmitting data based on the process quantity corresponding to the carrier. In this way, the process quantity can be determined accurately and efficiently, thereby improving data transmission reliability.
    Type: Application
    Filed: September 23, 2019
    Publication date: January 16, 2020
    Inventors: Jinlin PENG, Pengpeng DONG, Hao TANG, Zhongfeng LI
  • Publication number: 20200022178
    Abstract: A method for determining time information is disclosed. The method includes: obtaining, by a network node, information sent by a terminal device; and determining, by the network node, at least one of the following based on the information: a first time interval between downlink scheduling and downlink data transmission, a second time interval between the downlink data transmission and a feedback message sent by the terminal device after the terminal device receives downlink data, and a third time interval between uplink scheduling and uplink data transmission, where the information may include at least one of a subcarrier spacing, an operating band, and a bandwidth that are supported by the terminal device, and further include a first smallest value and/or a second smallest value and/or a third smallest value corresponding to the at least one item. Therefore, flexibility and accuracy of determining the time information are improved.
    Type: Application
    Filed: September 23, 2019
    Publication date: January 16, 2020
    Inventors: Jinlin PENG, Javad ABDOLI, Hao TANG, Zhenfei TANG, Fan WANG
  • Publication number: 20200022090
    Abstract: A communication method, a terminal, and a network device are provided. The method includes: receiving, by a terminal, a downlink reference signal sent by a network device in a first cell, and determining a downlink path loss estimate between the terminal and the first cell based on the downlink reference signal; and sending, by the terminal, an uplink signal in a second cell, where uplink transmit power used by the terminal to send the uplink signal is determined based on the downlink path loss estimate.
    Type: Application
    Filed: September 23, 2019
    Publication date: January 16, 2020
    Inventors: Junchao LI, Hao TANG, Liwen ZHANG, Wei CHEN
  • Publication number: 20200022136
    Abstract: Methods, systems, and devices for wireless communication are described that provide for uplink channel multiplexing and waveform selection. Uplink channels to be transmitted from one or more user equipment (UEs) to a base station are multiplexed together or separately into an uplink subframe. Each UE is capable of using different waveforms to transmit different channels. Reference signals are communicated according to an RS pattern, which is symmetric across uplink and downlink channels.
    Type: Application
    Filed: September 23, 2019
    Publication date: January 16, 2020
    Inventors: Renqiu Wang, Hao Xu, Wei Zeng, Jing Jiang, Tingfang Ji
  • Patent number: 10535566
    Abstract: A semiconductor device and method of manufacture are provided in which a passivation layer is patterned. In embodiments, by-products from the patterning process are removed using the same etching chamber and at the same time as the removal of a photoresist utilized in the patterning process. Such processes may be used during the manufacturing of FinFET devices.
    Type: Grant
    Filed: January 31, 2017
    Date of Patent: January 14, 2020
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hung-Hao Chen, Che-Cheng Chang, Horng-Huei Tseng, Wen-Tung Chen, Yu-Cheng Liu
  • Patent number: 10535644
    Abstract: A manufacturing method of a package on package structure includes the following steps. A first package is provided on a tape carrier, wherein the first package includes an encapsulated semiconductor device, a first redistribution structure disposed on a first side of the encapsulated semiconductor device, and a plurality of conductive bumps disposed on the first redistribution structure and attached to the tape carrier. A second package is mounted on the first package through a plurality of electrical terminals by a thermo-compression bonding process, which deforms the conductive bumps into a plurality of deformed conductive bumps. Each of the deformed conductive bumps comprises a base portion connecting the first redistribution structure and a tip portion connecting the base portion, and a curvature of the base portion is substantially smaller than a curvature of the tip portion.
    Type: Grant
    Filed: August 9, 2018
    Date of Patent: January 14, 2020
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Hsuan-Ting Kuo, Ching-Hua Hsieh, Cheng-Ting Chen, Hsiu-Jen Lin, Hao-Jan Pei, Yu-Peng Tsai, Chia-Lun Chang, Chih-Chiang Tsao, Philip Yu-shuan Chung
  • Patent number: 10535673
    Abstract: A memory device that includes: a memory controller; a control unit; and a memory cell array that includes memory blocks, each memory block comprising: memory cells, word lines respectively coupled to the memory cells, signal lines to transfer signals to perform programming operations to one or more memory cells of the memory cells, a first metal layer coupled to a first group of lines and configured to route the first group of the lines to the control unit, the lines comprising the word lines and the signal lines, and a second metal layer coupled to a second group of the lines and configured to route the second group of the lines to the control unit, wherein the memory controller is configured to: control the control unit to (i) select particular memory cells and (ii) program data to the particular memory cells is disclosed.
    Type: Grant
    Filed: June 4, 2018
    Date of Patent: January 14, 2020
    Assignee: Macronix International Co., Ltd.
    Inventors: Teng-Hao Yeh, Chih-Wei Hu, Hang-Ting Lue
  • Patent number: 10535727
    Abstract: A method includes forming a capacitor, which includes depositing a bottom electrode layer, depositing a capacitor insulator layer over the bottom electrode layer, depositing a top electrode layer over the capacitor insulator layer, and depositing a dielectric layer over the top electrode layer. The dielectric layer is etched using a process gas until the top electrode layer is exposed. In the etching of the dielectric layer, the dielectric layer has a first etching rate, and the top electrode layer has a second etching rate, and a ratio of the first etching rate to the second etching rate is higher than about 5.0.
    Type: Grant
    Filed: July 5, 2019
    Date of Patent: January 14, 2020
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hung-Hao Chen, Che-Cheng Chang, Wen-Tung Chen, Yu-Cheng Liu, Horng-Huei Tseng
  • Patent number: 10535614
    Abstract: A package includes a plurality of dies, a wall structure, an encapsulant, and a redistribution structure. The wall structure surrounds at least one of the dies. The encapsulant encapsulates the dies and the wall structure. A first portion of the encapsulant penetrates through the wall structure. The redistribution structure is disposed on the encapsulant and is electrically connected to the dies and the wall structure.
    Type: Grant
    Filed: April 29, 2019
    Date of Patent: January 14, 2020
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventor: Po-Hao Tsai
  • Patent number: 10536825
    Abstract: A method for vehicle-to-vehicle identification and detection and a system for the same are revealed. A plurality of radio frequency (RF) communication units with different communication directions is arranged at a vehicle body. Each RF communication unit sends identification information of the vehicle to nearby vehicles in response to communication requests from the nearby vehicles. The vehicle sends communication requests to the nearby vehicles in different communication directions by antennas of the RF communication units using time-sharing polling or simultaneous communication scheme. Thus RF communication between vehicles is achieved for identification and detection of the nearby vehicles. The precise and accurate positioning of the respective vehicle within the area is achieved to support vehicle active safety control or provide data required for autonomous driving for improving driving safety.
    Type: Grant
    Filed: February 1, 2019
    Date of Patent: January 14, 2020
    Assignee: BAIJIE TENG TECHNOLOGY CORPORATION
    Inventors: Bing Wang, Guo-Hao Wang, Chung-Ping Lai
  • Patent number: 10535241
    Abstract: Examples of systems and method track a location of an asset within a space using an asset tag location estimation system, track movement of a selected user, or user's mobile device, using a positioning system, and associate the tracked asset with the selected user, or user's mobile device, based on a determination of a trajectory of the asset and the mobile device. Trajectories of the user/mobile device and the asset tag may be determined by a backend server. The trajectory of the selected user/mobile device and the trajectory of the asset tag are compared by the backend server to determine a correspondence between the respective trajectories based on a predetermined correspondence criteria. The determined correspondence indicates that a user of the corresponding mobile device is moving the asset. In response to the determined correspondence, the backend server associates the asset tag to the selected user/mobile device in a database.
    Type: Grant
    Filed: June 10, 2019
    Date of Patent: January 14, 2020
    Assignee: ABL IP HOLDING LLC
    Inventors: Min-Hao Michael Lu, John England
  • Patent number: 10535572
    Abstract: An assembly includes a wafer having a top wafer surface and a wafer circumference and a device arrangement structure. The device arrangement structure includes a first surface having a perimeter, the perimeter being encircled by the wafer circumference in a plan view. The device arrangement structure also includes an array of devices, each device of the array of devices having an electrical contact on the first surface. The assembly has an adhesive element that affixes the device arrangement structure in a stationary position relative to the wafer.
    Type: Grant
    Filed: June 27, 2016
    Date of Patent: January 14, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chun Hao Liao, Chu Fu Chen, Mingo Liu, Chiou Jun Yean
  • Patent number: 10535532
    Abstract: Methods for patterning in a semiconductor process are described. A dummy layer is formed having a cut therein. A first sacrificial layer is formed over the dummy layer, and at least a portion of the first sacrificial layer is disposed in the cut. A second sacrificial layer is formed over the first sacrificial layer. The second sacrificial layer is patterned to have a first pattern. Using the first pattern of the second sacrificial layer, the first sacrificial layer is patterned to have the first pattern. The second sacrificial layer is removed. Thereafter, a second pattern in the first sacrificial layer is formed comprising altering a dimension of the first pattern of the first sacrificial layer. Using the second pattern of the first sacrificial layer, the dummy layer is patterned. Mask portions are formed along respective sidewalls of the patterned dummy layer. The mask portions are used to form a mask.
    Type: Grant
    Filed: July 1, 2019
    Date of Patent: January 14, 2020
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Cheng-Li Fan, Chih-Hao Chen, Wen-Yen Chen
  • Patent number: 10536966
    Abstract: Techniques for wireless communication are described. One method includes assigning a downlink subframe that is a first occurring downlink subframe in a data frame; and transmitting an encoded control signal during a first transmission opportunity, the encoded control signal including a common portion for receiving devices, the common portion indicating a structure of the data frame, the encoded control signal further including a device specific portion for a specific receiving device, the device specific portion indicating uplink grants and downlink grants during the data frame for the specific receiving device, where at least the common portion of the encoded control signal is transmitted during the selected downlink subframe.
    Type: Grant
    Filed: November 13, 2017
    Date of Patent: January 14, 2020
    Assignee: QUALCOMM Incorporated
    Inventors: Chih-Hao Liu, Tamer Kadous, Srinivas Yerramalli, Chirag Sureshbhai Patel, Alberto Rico Alvarino
  • Patent number: 10534276
    Abstract: Techniques are provided for fabricating and utilizing optically opaque non-planar alignment structures in non-die areas (e.g., kerf areas) of a wafer to align photomasks to die areas on the wafer. For example, an insulating layer is formed over non-die and die areas of the wafer. A non-planar alignment feature is formed in the insulating layer in the non-die area. An optically opaque layer stack is formed in the die and non-die areas of the wafer, which conformally covers the non-planar alignment feature to form an optically opaque non-planar alignment structure in the non-die area. A lithographic patterning process is performed to pattern the optically opaque layer stack in the die area, wherein the optically opaque non-planar alignment structure in the non-die area is utilized to align a photomask to the die area. The optically opaque non-planar alignment structure can include any type of non-planar structure having a stepped sidewall surface.
    Type: Grant
    Filed: March 27, 2019
    Date of Patent: January 14, 2020
    Assignee: International Business Machines Corporation
    Inventors: Chih-Chao Yang, Hao Tang, Dominik Metzler, Cornelius Brown Peethala