Patents by Inventor Hao An

Hao An has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9754870
    Abstract: A compound carrier board structure of Flip-Chip Chip-Scale Package and manufacturing method thereof provides a baseplate with a penetrating rectangular opening bonded to a non-conductive film then a carrier board in order to form a compound carrier board structure. The baseplate is constructed with a low Thermal Expansion Coefficient material.
    Type: Grant
    Filed: March 16, 2016
    Date of Patent: September 5, 2017
    Assignee: KINSUS INTERCONNECT TECHNOLOGY CORP.
    Inventors: Ting-Hao Lin, Yi-Fan Kao, Shuo-Hsun Chang, Yu-Te Lu, Kuo-Chun Huang
  • Patent number: 9755307
    Abstract: An antenna structure includes a feeding portion, a first grounding portion, a second grounding portion, a first radiating portion, a second radiating portion, a third radiating portion, and a fourth radiating portion. The feeding portion is configured to feed current signals. The first and second grounding portions are positioned at two opposite sides of the feeding portion respectively. The first, second and third radiating portions cooperatively form a first current path to excite a low-frequency resonate mode and a first high-frequency resonate mode; the first radiating portion resonates with the first grounding portion to excite a second high-frequency resonate mode; the second, third and fourth radiating portion cooperatively form a second current path to excite a third high-frequency resonate mode.
    Type: Grant
    Filed: August 27, 2014
    Date of Patent: September 5, 2017
    Assignee: FIH (HONG KONG) LIMITED
    Inventors: Chuan-chou Chi, Hao-Ying Chang
  • Patent number: 9755303
    Abstract: An antenna structure includes a feed unit, a grounding unit, a connecting unit, a radiating unit, and a resonating unit. The grounding unit is spaced apart from the feed unit. The connecting unit resists and is electrically connected to the feed unit and the grounding unit. The radiating unit is electrically connected to one side of the connecting unit so as to activate a first resonance mode. The resonating unit is electrically connected to another side of the connecting unit so as to activate a second resonance mode.
    Type: Grant
    Filed: April 9, 2015
    Date of Patent: September 5, 2017
    Assignee: FIH (HONG KONG) LIMITED
    Inventors: Cheng-Hung Ko, Chuan-Chou Chi, Hao-Ying Chang
  • Patent number: 9752643
    Abstract: A negative stiffness system for gravity compensation of a micropositioner of wafer table in lithography machine, characterized in that, the negative stiffness system includes at least three sets of quasi-zero stiffness units, each of the sets of quasi-zero stiffness units comprises a pair of negative stiffness springs and a positive stiffness spring, the positive stiffness spring is vertically positioned, the pair of negative stiffness springs are obliquely and symmetrically positioned at two sides of the positive stiffness spring, upper ends of the negative stiffness springs and the positive stiffness spring are connected together and fixed to the bottom surface of a rotor of the micropositioner, and lower ends of the negative stiffness springs and the positive stiffness spring are connected to a base, respectively. The system reduces the stiffness in vertical direction and prevents the influence of permanent magnet on its surroundings, while improving the bearing capacity.
    Type: Grant
    Filed: December 6, 2013
    Date of Patent: September 5, 2017
    Assignees: SHANGHAI MICRO ELECTRONICS EQUIPMENT CO., LTD., TSINGHUA UNIVERSITY
    Inventors: Yu Zhu, Ming Zhang, Zhao Liu, Rong Cheng, Jing Wang, Li Tian, Dengfeng Xu, Kaiming Yang, Jinchun Hu, Wensheng Yin, Haihua Mu, Hao Liu, Chuxiong Hu
  • Patent number: 9755807
    Abstract: Techniques for efficiently deriving uplink channel estimates without consuming much additional uplink resources are described. A user equipment (UE) may send a request for uplink resources on a request channel (REQCH) whenever the UE desires to transmit data on the uplink. The UE may send the REQCH on a set of subcarriers and from multiple antennas, e.g., send REQCH data on data subcarriers and pilot on pilot subcarriers. A Node B may receive the request, estimate the complex channel gains for the pilot subcarriers based on received pilot symbols, and coherently demodulate received data symbols based on the channel gain estimates. The Node B may estimate the complex channel gains for the data subcarriers based on demodulated data symbols and derive a channel estimate for each UE antenna based on the channel gain estimates for the pilot and data subcarriers. The Node B may use the channel estimates for MIMO scheduling, subband scheduling, and rate selection.
    Type: Grant
    Filed: June 29, 2015
    Date of Patent: September 5, 2017
    Assignee: QUALCOMM Incorporated
    Inventors: Byoung-Hoon Kim, Durga Prasad Malladi, Hao Xu
  • Patent number: 9754637
    Abstract: An erasing method and a memory device are provided. The memory device includes a plurality of memory blocks. Each of the memory blocks has n sub-blocks. The erasing method includes the following steps. A first erase region is selected from a first memory block of the memory blocks, and the first erase region includes at least one sub-block. A sub-block erase operation is performed on the first erase region of the first memory block.
    Type: Grant
    Filed: July 18, 2016
    Date of Patent: September 5, 2017
    Assignee: MACRONIX INTERNATIONAL CO., LTD.
    Inventors: Yu-Ming Chang, Hsiang-Pang Li, Hsin-Yu Chang, Chien-Chung Ho, Yuan-Hao Chang
  • Patent number: 9755927
    Abstract: Embodiments of the present invention provide an intermediate node determining method and apparatus, where the method includes: collecting an original data flow used to acquire a target service; based on the original data flow, determining request nodes and response nodes that are in nodes, and determining a connection relationship between the nodes; combining the determined request nodes into a first composite node and the determined response nodes into a second composite node, and determining, based on the determined connection relationship between the nodes, a connection path between the first composite node and the second composite node; and determining, based on a selected optimization objective and from the connection paths, at least one preferred connection path, to acquire an intermediate node on the at least one preferred connection path.
    Type: Grant
    Filed: March 2, 2015
    Date of Patent: September 5, 2017
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Yingtao Li, Hao Wu
  • Patent number: 9755905
    Abstract: Embodiments of the disclosure provide a method for advertising link bandwidth information. The method comprises sending a link state advertisement (LSA) message, which comprises bandwidth information of a link, to a plurality of network nodes in a network. The bandwidth information comprises a plurality of link bandwidths and availabilities corresponding to the plurality of link bandwidths respectively. Each availability is a time scale that the corresponding link bandwidth is ensured.
    Type: Grant
    Filed: February 8, 2016
    Date of Patent: September 5, 2017
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Yanxing Luo, Hao Long, Min Yan
  • Patent number: 9755975
    Abstract: A bandwidth information notification method includes: obtaining bandwidth information of a microwave link; and sending a plurality of OAM messages carrying the bandwidth information to an endpoint, wherein first one or more OAM messages of the plurality of OAM messages are sent more quickly than at least one of the rest of the plurality of OAM messages.
    Type: Grant
    Filed: August 3, 2015
    Date of Patent: September 5, 2017
    Assignee: Huawei Technologies Co., Ltd.
    Inventor: Hao Long
  • Patent number: 9755104
    Abstract: A method of forming a rough surface includes: providing an article having a top surface, forming a plurality of agglomerated grains on the top surface by a deposition process, and patterning the top surface to form a rough surface by using the plurality of agglomerated grains as a mask.
    Type: Grant
    Filed: May 9, 2014
    Date of Patent: September 5, 2017
    Assignee: EPISTAR CORPORATION
    Inventors: Wei Jung Chung, Chi Hao Huang
  • Publication number: 20170248742
    Abstract: The present disclosure relates to articles and methods of making light redirecting film constructions comprising a microstructured optical film bonded in selected areas to another film. This type of assembly may serve various purposes. For example, the assembly may protect the structured film, provide additional functionality, such as diffusion, and/or facilitate attachment of the microstructured optical film to a mounting surface, such as a window.
    Type: Application
    Filed: October 16, 2015
    Publication date: August 31, 2017
    Applicant: 3M INNOVATIVE PROPERTIES COMPANY
    Inventors: MANOJ NIRMAL, JOHN P. BAETZOLD, ERIK A. AHO, SUMAN K. PATEL, SCOTT M. TAPIO, MIKHAIL L. PEKUROVSKY, JOHN J. STRADINGER, BING HAO
  • Publication number: 20170249346
    Abstract: A computer maps a literal in a database query to a digital representation, wherein the database query comprises a predicate, the literal is a part of the predicate, and the digital representation is predetermined based at least in part on external statistical data. The computer estimates a filter factor for the predicate based at least in part on the digital representation and compressed statistical data, wherein the compressed statistical data are prepared at least in part from the external statistical data.
    Type: Application
    Filed: May 17, 2017
    Publication date: August 31, 2017
    Inventors: Ke Wei Wei, Maryela E. Weihrauch, Hao Wu, Xin Ying Yang, Miao Zheng
  • Publication number: 20170250370
    Abstract: Embodiments of the disclosure provide interface integration and adhesion improvement methods used on a transparent substrate for OLED or thin film transistor applications. In one embodiment, a method of enhancing interface adhesion and integration in a film structure disposed on a substrate includes performing a plasma treatment process on an inorganic layer disposed on a substrate in a processing chamber to form a treated layer on the substrate, wherein the substrate includes an OLED structure, controlling a substrate temperature less than about 100 degrees Celsius, and forming an organic layer on the treated layer. Furthermore, an encapsulating structure for OLED applications includes an inorganic layer formed on an OLED structure on a substrate, an electron beam treated layer formed on the inorganic layer, and an organic layer formed on the electron beam treated layer.
    Type: Application
    Filed: February 26, 2016
    Publication date: August 31, 2017
    Inventors: Jrjyan Jerry CHEN, Soo Young CHOI, Helinda NOMINANDA, Wen-Hao WU
  • Publication number: 20170250286
    Abstract: A fin field effect transistor (FinFET) device structure and method for forming FinFET device structure are provided. The FinFET structure includes a substrate and a fin structure extending above the substrate. The FinFET structure includes an epitaxial structure formed on the fin structure, and the epitaxial structure has a first height. The FinFET structure also includes fin sidewall spacers formed adjacent to the epitaxial structure. The sidewall spacers have a second height and the first height is greater than the second height, and the fin sidewall spacers are configured to control a volume and the first height of the epitaxial structure.
    Type: Application
    Filed: May 15, 2017
    Publication date: August 31, 2017
    Inventors: Zhe-Hao Zhang, Tung-Wen Cheng, Chang-Yin Chen, Che-Cheng Chang, Yung-Jung Chang
  • Publication number: 20170249493
    Abstract: A fingerprint sensor package and method are provided. The fingerprint sensor package comprises a fingerprint sensor along with a fingerprint sensor surface material and electrical connections from a first side of the fingerprint sensor to a second side of the fingerprint sensor. A high voltage chip is connected to the fingerprint sensor and then the fingerprint sensor package with the high voltage chip are connected to a substrate, wherein the substrate has an opening to accommodate the presence of the high voltage chip.
    Type: Application
    Filed: May 9, 2016
    Publication date: August 31, 2017
    Inventors: Chen-Hua Yu, Yu-Feng Chen, Chih-Hua Chen, Hao-Yi Tsai, Chung-Shi Liu
  • Publication number: 20170250534
    Abstract: A system for regulating energy provided to an electricity grid from an energy source, the system includes a converter configured to receive the energy from the source. The converter is configured to dynamically predict real-time maximum reactive power capability as a function of at least one from the group including (i) a direct current link maximum voltage, (ii) an instantaneous grid network voltage, and (iii) a line current. The predicted maximum reactive power capability is configured for optimizing regulation of the energy.
    Type: Application
    Filed: May 28, 2014
    Publication date: August 31, 2017
    Applicant: GE ENERGY POWER CONVERSION TECHNOLOGY LTD.
    Inventors: Hao YU, David SMITH
  • Publication number: 20170249495
    Abstract: A method, a device, and computer-readable medium are provided for verifying an identity of a user, which pertains to computer technology. In some aspects, the method includes generating a dynamic fingerprint while the user moves a finger along a trajectory of movement in a fingerprint collection area of a fingerprint reader, and comparing the dynamic fingerprint with a referential fingerprint. The method also includes verifying the identity of the user based on the comparison, and generating a report indicating the identity verified.
    Type: Application
    Filed: December 14, 2016
    Publication date: August 31, 2017
    Applicant: Beijing Xiaomi Mobile Software Co., Ltd.
    Inventors: Ning HAO, Wei SUN, Yizhen YANG
  • Publication number: 20170250635
    Abstract: A braking torque closed-loop control system and method for a switch reluctance motor. The closed-loop control system comprises a torque regulator, a mode selector, a current regulator, an angle optimization controller and a torque estimator. On the basis of the rotating speed of the motor, the mode selector implements a phase current soft chopper control in a low rotating speed region and an angle position control in a high rotating speed region. The current regulator performs soft chopper hysteretic current regulation. The angle optimization controller optimizes a turn-on angle and a turn-off angle of a power converter master switch to reduce torque pulsation and improve braking energy feedback efficiency. The torque estimator conducts an on-line estimation of an actual braking torque estimated value of the motor based on an actual phase voltage and current of the motor to achieve braking torque signal feedback.
    Type: Application
    Filed: November 30, 2015
    Publication date: August 31, 2017
    Inventors: Hao CHEN, He CHENG, Zhou YANG, Qing WANG, Qianlong WANG, Xing WANG
  • Patent number: D796507
    Type: Grant
    Filed: September 26, 2016
    Date of Patent: September 5, 2017
    Assignee: SZ DJI Technology Co., Ltd.
    Inventors: Hao Chen, Dengfeng Hu
  • Patent number: D796684
    Type: Grant
    Filed: March 18, 2014
    Date of Patent: September 5, 2017
    Assignee: BIO-MEDICAL CARBON TECHNOLOGY CO., LTD.
    Inventors: Tse-Hao Ko, Jui-Hsiang Lin, Pei-Hsun Chou, Yen-Ju Su, Wei-Shan Hsu