Abstract: A transfer sleeve is disclosed, wherein the transfer sleeve is detachably set on a supporting unit for mounting a supporting arm. The transfer sleeve comprises a first tube body and a second tube body. The supporting unit is accommodated in the first tube body and the second tube body when the transfer sleeve is set on the supporting unit; the first tube body penetrates through the supporting arm when the supporting arm is set on the transfer sleeve.

Abstract: A wireless communication device is provided and includes a communication module, a dust and moisture resistant adhesive, and a nano-metallic layer. The communication module includes a circuit board, a communication chip and a plurality of passive components mounted on a carrying surface of the circuit board, and an insulating sheet that is disposed on the passive components and that has a thickness smaller than or equal to 150 ?m. The dust and moisture resistant adhesive covers any electrically conductive portions of the communication module on the carrying surface. The nano-metallic layer covers the dust and moisture resistant adhesive, the communication chip, the passive components, and the insulating sheet, and is electrically coupled to a grounding portion of the circuit board. The wireless communication device does not include any grounding metal housing mounted on the circuit board.

Abstract: A miniature cooling system includes a base metal sheet, a flow channel layer, a piezoelectrically actuated metal sheet, a piezoelectric boundary compression layer and two piezoelectric ceramic vibrators. The flow channel layer is located on the base metal sheet and includes a first chamber, a second chamber, an inlet channel, a linking channel and an outlet channel. The inlet channel links the outside environment to the first chamber. The linking channel links the first chamber and the second chamber. The outlet channel links the second chamber to the outside environment. The piezoelectrically actuated metal sheet is located on the flow channel layer. The piezoelectric boundary compression layer is located on the piezoelectrically actuated metal sheet. The piezoelectric boundary compression layer includes two containing areas, and the two containing areas are respectively located above the first chamber and the second chamber.

Abstract: Manufacturing method of semiconductor package includes following steps. Bottom package is provided. The bottom package includes a die and a redistribution structure electrically connected to die. A first top package and a second top package are disposed on a surface of the redistribution structure further away from the die. An underfill is formed into the space between the first and second top packages and between the first and second top packages and the bottom package. The underfill covers at least a side surface of the first top package and a side surface of the second top package. A hole is opened in the underfill within an area overlapping with the die between the side surface of the first top package and the side surface of the second top package. A thermally conductive block is formed in the hole by filling the hole with a thermally conductive material.

Abstract: The present invention discloses a drive system of a scraper conveyor and a control method. The drive system includes a nose sprocket, a tail sprocket, a nose sprocket drive mechanism, and a tail sprocket drive mechanism, where the nose sprocket drive mechanism is a hydraulic motor I, and the tail sprocket drive mechanism is a hydraulic motor II; and a hydraulic system that drives the hydraulic motor I and a hydraulic system that drives the hydraulic motor II include same hydraulic elements, and both include a three-position four-way solenoid directional valve, a two-position two-way solenoid directional valve, a two-position three-way solenoid directional valve, an accumulator, and an oil supplement valve group. The present invention is applicable to rapid starting and stopping of the scraper conveyor in a heavy load status while adjusting chain tension in real time, thereby resolving a power imbalance problem in a dual-drive system, and has a simple structure and a long service life.

Abstract: A flexible display module and a manufacturing method thereof are disclosed. The flexible display module includes a first flexible material layer and a second flexible material layer stacked on the first flexible layer, a sealing layer disposed between the first flexible material layer and the second flexible material layer, and a module layer disposed in the hollow of the sealing layer. The sealing layer has a hollow defined in a middle of the sealing layer. The area of the bottom area of the hollow is larger than the area of the module layer.

Abstract: A method for structuring transmissible data of various types with universal applicability as between devices of various types includes a data content, a first data header, and a second data header. The first data header signifies numerical data or control/command data. The second data header is a description of a data group to which the collected data belongs. The data further can include a third data header configured to describe production process information of the data. The data further can include a fourth data header to describe a product type, an industrial field, a company name, and a company address.

Abstract: A coolant distribution unit includes a casing, a control module, a power supply module, a heat exchange module, and a fluid driving module. The power supply module is electrically connected to the control module, the fluid driving module is electrically connected to the control module and the power supply module, and the fluid driving module is in fluid communication with the heat exchange module. The control module, power supply module, heat exchange module, and fluid driving module are all arranged in the casing. In addition, the control module controls the power supply module to output a corresponding electrical power to the fluid driving module according to an operation status of the fluid driving module.

Abstract: A file saving method and an electronic device are provided. The file saving method includes: obtaining at least one to-be-processed file in a social circle, where the to-be-processed file is a file uploaded by another user in the social circle other than a user of the electronic device; filtering the at least one to-be-processed file according to a preset rule, to obtain a target file that complies with the preset rule; and saving the target file.

Abstract: An inference operation method and a controlling circuit of a 3D NAND artificial intelligence accelerator are provided. The 3D NAND artificial intelligence accelerator includes a plurality of memory cells, a plurality of bit lines, a plurality of word lines and a plurality of string selecting line groups each of which includes at least one string selecting line. The inference operation method includes the following steps: The patterns are inputted to the bit lines. The word lines are switched to switch the filters. The string selecting line groups are switched to switch the filters. In a word line pioneering scheme and a string selecting line group pioneering scheme, when the patterns inputted to each of the bit lines are switched, any one of the word lines is not switched and any one of the string selecting line groups is not switched.

Abstract: A package structure and a method of manufacturing the same are provided. The package structure includes a die, a redistribution layer (RDL) structure, a through integrated fan-out via (TIV) and a conductive terminal. The RDL structure is disposed on and electrically connected to the die. The TIV is laterally aside the die and extends to contact a bottom surface and a sidewall of a redistribution layer of the RDL structure. The conductive terminal is electrically connected to the die through the RDL structure and the TIV.

Abstract: A control method of a single live line charging circuit, a control circuit of a single live line charging circuit, and a single live line charging circuit are provided. The single live line charging circuit includes a first switch, a first conduction element, a first inductor, a second switch, a second conduction element, a third switch, a first input end and a second input end; the first input end is connected to a first end of the first switch through the second conduction element; the first switch, the first conduction element and the first inductor constitute a buck circuit; the first input end is connected to a reference ground through the second switch, the second input end is connected to the reference ground through the third switch, and an alternating current input is connected to the first input end through a load circuit.

Abstract: A permanent magnet electric motor includes a shaft extending along a longitudinal axis and a rotor mounted on the shaft. The rotor is rotatable concomitantly with the shaft about the longitudinal axis, the rotor defines an innermost rotor edge. The innermost rotor edge is sized to receive the shaft. The permanent magnet electric motor further includes a stator. The shaft defines a jacket configured to receive a coolant. The jacket is disposed about the longitudinal axis. The jacket is elongated in a first direction. The first direction is parallel to the longitudinal axis. The rotor defines a plurality of longitudinal channels. Each of the plurality of longitudinal channel is elongated along the first direction, and each of the plurality of longitudinal channels is in fluid communication with the jacket to allow fluid flow between the jacket and the plurality of the longitudinal channels.

Abstract: Various semiconductor chips with solder capped probe test pads are disclosed. In accordance with one aspect of the present invention, a semiconductor chip is provided that includes a substrate, plural input/output (I/O) structures on the substrate and plural test pads on the substrate. Each of the test pads includes a first conductor pad and a first solder cap on the first conductor pad.

Abstract: A method for cleaning is provided. The method includes: removing a pellicle frame from a top surface of a photomask by debonding an adhesive between the photomask and the pellicle frame, wherein a first portion of the adhesive is remained on the top surface of the photomask, and removing the first portion of the adhesive on the top surface of the photomask, including applying an alkaline solution to the top surface of the photomask, and performing a mechanical impact to the photomask.

Abstract: The application relates to an apparatus and method used in Wireless Local Area Networks (WLANs). The apparatus includes: a wireless interface; and processor circuitry coupled to the wireless interface and configured to: generate a Physical layer Protocol Data Unit (PPDU) with a Low Density Parity Check (LDPC) coding scheme; and provide the PPDU to the wireless interface for transmitting, wherein the PPDU comprises one special codeword and more than one regular codeword and does not comprise a padding bit before Forward Error Correction (FEC) codes, and the regular codeword has a fixed codeword size, which can be different from a codeword size of the special codeword.

Abstract: A lamp includes a lamp holder, a lampshade combined with the lamp holder, and at least one diffuser. The lamp holder includes a base, a circuit board arranged on the base, and a plurality of light-emitting elements arranged on the circuit board. The diffuser is used to cover the light-emitting elements, and a sufficient distance between the diffuser and the light-emitting elements is maintained so that the light of the light-emitting elements are diffused uniformly, which can reduce the light spots caused by the special shape of the lampshade or the excessive distance between the light-emitting elements and improve the light uniformity of the lamp.

Abstract: The present disclosure is drawn to covers for electronic devices, methods of making the covers, and electronic devices. In one example, a cover for an electronic device comprising: a metal cover substrate having at least a top surface and a bottom surface; a transparent passivation layer on the top surface of the metal cover substrate; a water-borne graphene coating layer on the transparent passivation layer; and an electrophoretic deposition coating layer on the water-borne graphene coating layer.

Abstract: A semiconductor device and method of fabricating thereof where the device includes a fin structure between a first isolation region and a second isolation region. A first source/drain feature is formed over a recessed portion of the first fin structure. The first source/drain feature interfaces a top surface of the first isolation region for a first distance and interfaces the top surface of the second isolation region for a second distance. The first distance is different than the second distance. The source/drain feature is offset in a direction.