Patents by Inventor Hao-Chang Su

Hao-Chang Su has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11971844
    Abstract: A chiplet system and a positioning method thereof are provided. The positioning method of the chiplet system includes the following steps. Two end chiplets and a plurality of middle chiplets are classified. A quantity calculation packet is transmitted and accumulated from each of the end chiplets towards another end to analyze a quantity of middle chiplets. A serial number comparison packet is transmitted and accumulated from each of the middle chiplets connected to one of the end chiplets towards another end to set a starting point. An identify number setting packet is transmitted and accumulated from the middle chiplet set as the starting point towards another end to set a positioning number of each of the middle chiplets.
    Type: Grant
    Filed: November 29, 2022
    Date of Patent: April 30, 2024
    Assignee: SUNPLUS TECHNOLOGY CO., LTD.
    Inventors: Hsing-Sheng Huang, Hao-Chang Chang, Ming-Chang Su, Hwan-Rei Lee
  • Publication number: 20240071888
    Abstract: A package structure including a redistribution circuit structure, a wiring substrate, first conductive terminals, an insulating encapsulation, and a semiconductor device is provided. The redistribution circuit structure includes stacked dielectric layers, redistribution wirings and first conductive pads. The first conductive pads are disposed on a surface of an outermost dielectric layer among the stacked dielectric layers, the first conductive pads are electrically connected to outermost redistribution pads among the redistribution wirings by via openings of the outermost dielectric layer, and a first lateral dimension of the via openings is greater than a half of a second lateral dimension of the outermost redistribution pads. The wiring substrate includes second conductive pads. The first conductive terminals are disposed between the first conductive pads and the second conductive pads. The insulating encapsulation is disposed on the surface of the redistribution circuit structure.
    Type: Application
    Filed: August 28, 2022
    Publication date: February 29, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chien-Chang Lin, Yen-Fu Su, Chin-Liang Chen, Wei-Yu Chen, Hsin-Yu Pan, Yu-Min Liang, Hao-Cheng Hou, Chi-Yang Yu
  • Publication number: 20090264066
    Abstract: A circular polarized repeater includes a circular polarized receiving antenna for receiving a circular polarized signal, an amplifying circuit electrically connected to the circular polarized receiving antenna which is provided for amplifying the received signal, a circular polarized emitting antenna connected to the amplifying circuit for outputting the amplified signal. The circular polarized repeater is used for a transmission system and the signal is received and then outputted to a predetermined area by the circular polarized repeater so as to improve the quality and efficiency of the system.
    Type: Application
    Filed: April 17, 2008
    Publication date: October 22, 2009
    Inventors: Ta-Fu Cheng, Yueh-Pi Huang, Hao-Chang Su