Patents by Inventor Hao-Che LIU
Hao-Che LIU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11935804Abstract: In an embodiment, a device includes: an integrated circuit die; an encapsulant at least partially surrounding the integrated circuit die, the encapsulant including fillers having an average diameter; a through via extending through the encapsulant, the through via having a lower portion of a constant width and an upper portion of a continuously decreasing width, a thickness of the upper portion being greater than the average diameter of the fillers; and a redistribution structure including: a dielectric layer on the through via, the encapsulant, and the integrated circuit die; and a metallization pattern having a via portion extending through the dielectric layer and a line portion extending along the dielectric layer, the metallization pattern being electrically coupled to the through via and the integrated circuit die.Type: GrantFiled: April 10, 2023Date of Patent: March 19, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Tzu-Sung Huang, Ming Hung Tseng, Yen-Liang Lin, Hao-Yi Tsai, Chi-Ming Tsai, Chung-Shi Liu, Chih-Wei Lin, Ming-Che Ho
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Publication number: 20230375419Abstract: There is provided a force sensor including a substrate and a polymer material layer. The substrate has a circuit layout that includes a first electrode and a second electrode configured to form a capacitor therebetween. The polymer material layer covers at least on a space between the first electrode and the second electrode, and is used to change capacitance of the capacitor while being pressed. The force sensor is arranged inside a stem of an earphone for detecting the user input.Type: ApplicationFiled: August 4, 2023Publication date: November 23, 2023Inventors: YEN-PO CHEN, HAO-CHE LIU, YEN-CHANG CHU, CHIH-MING SUN
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Patent number: 11761830Abstract: There is provided a force sensor including a substrate and a polymer material layer. The substrate has a circuit layout that includes a first electrode and a second electrode configured to form a capacitor therebetween. The polymer material layer covers at least on a space between the first electrode and the second electrode, and is used to change capacitance of the capacitor while being pressed. The force sensor is arranged inside a stem of an earphone for detecting the user input.Type: GrantFiled: April 20, 2021Date of Patent: September 19, 2023Assignee: PIXART IMAGING INC.Inventors: Yen-Po Chen, Hao-Che Liu, Yen-Chang Chu, Chih-Ming Sun
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Publication number: 20220102418Abstract: An image transducer and a 3D image capturing system having the image transducer are provided. The image transducer includes a microlens, first function layer, first photosensitive layer, second function layer, second photosensitive layer, first read circuit and second read circuit; thus, the image transducer includes two photosensitive layers and is vertically structured. The two photosensitive layers greatly increase sensing waveband. The 3D image capturing system uses the image transducer to enhance pixel screen fineness of a 3D screen.Type: ApplicationFiled: September 23, 2021Publication date: March 31, 2022Inventor: HAO-CHE LIU
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Patent number: 11095834Abstract: A living organism image monitoring system is provided, relating to the technical field of medical equipment. The living organism image monitoring system comprises a display module, a processor and a CIGS chip, the CIGS chip, the processor and the display module being electrically connected, the CIGS chip being used for detecting a near infrared light signal of a living organism and generating a current signal after having detected the near infrared light signal, the processor being used for generating a first pulse signal according to the current signal, and the display module being used for displaying an image according to the first pulse signal. The living organism image monitoring system provided by the present disclosure has the advantages of being capable of synchronously transmitting the images of a living organism to the display module for display and enabling the images to be clearer.Type: GrantFiled: November 6, 2018Date of Patent: August 17, 2021Assignee: PIONEER MATERIALS INC. CHENGDUInventors: Chien-Chun Liu, Liu-Yuh Lin, Liang-Chih Weng, Tzu-Huan Cheng, Chen-Hsin Wu, Hao-Che Liu, Chien-Yao Huang, Leon A Chiu, Sau-Mou Wu, Ti-Hsien Tai, Yu-Hsiang Pan
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Publication number: 20210239544Abstract: There is provided a force sensor including a substrate and a polymer material layer. The substrate has a circuit layout that includes a first electrode and a second electrode configured to form a capacitor therebetween. The polymer material layer covers at least on a space between the first electrode and the second electrode, and is used to change capacitance of the capacitor while being pressed. The force sensor is arranged inside a stem of an earphone for detecting the user input.Type: ApplicationFiled: April 20, 2021Publication date: August 5, 2021Inventors: YEN-PO CHEN, HAO-CHE LIU, YEN-CHANG CHU, CHIH-MING SUN
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Patent number: 10880540Abstract: A 3D depth image acquiring method and apparatus, and an image acquisition device are provided. The method is applied to an image acquisition device comprising a VIS-NIR picture sensor and an infrared structured light projection component. The VIS-NIR picture sensor comprises a plurality of dot matrix units each having a blue light photosensitive component, a green light photosensitive component, a red light photosensitive component and an NIR photosensitive component distributed thereon. The method comprises: controlling the blue light photosensitive component, the green light photosensitive component, the red light photosensitive component, the NIR photosensitive component and the infrared structured light projection component to operate, to obtain an optimum NIR image and an optimum VIS image; and processing the optimum VIS image and a depth image which is obtained by performing calculation on the optimum NIR image using a 3D depth mode, to obtain a 3D depth image.Type: GrantFiled: November 27, 2018Date of Patent: December 29, 2020Assignee: PIONEER MATERIALS INC. CHENGDUInventors: Hao-Che Liu, Liu-Yuh Lin, Liang-Chih Weng, Tzu-Huan Cheng, Chen-Hsin Wu, Chien-Chun Liu, Chien-Yao Huang, Leon A Chiu, Sau-Mou Wu, Ti-Hsien Tai, Yu-Hsiang Pan
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Patent number: 10692907Abstract: Disclosed are a CMOS image sensor encapsulation structure and a method for manufacturing the same, including the steps of: firstly, a transparent substrate material is fixed to a surface of a first insulating layer having a micro convex lens, a dummy wafer is fixed on a surface of the transparent substrate material, and then a wafer is thinned by grinding, and in this process, the transparent substrate material provides more mechanical support force for the wafer, therefore, the wafer can become thinner by grinding, thus the CMOS image sensor encapsulation structure is characterized by being formed in a thin shape. Besides, a second installation area has a protection glue layer which can prevent oxygen and moisture from entering internal elements and absorb scattered light.Type: GrantFiled: November 29, 2018Date of Patent: June 23, 2020Assignee: Pioneer Materials inc. ChengduInventors: Chen-Hsin Wu, Liu-Yuh Lin, Liang-Chih Weng, Tzu-Huan Cheng, Hao-Che Liu, Chien-Chun Liu, Chien-Yao Huang, Leon A. Chiu, Sau-Mou Wu, Ti-Hsien Tai, Yu-Hsiang Pan
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Patent number: 10692908Abstract: A CMOS image sensor encapsulation structure and its manufacturing method, including: forming a blind hole in a combined layer formed by a first insulating layer and a wafer, a surface of the first insulating layer facing away from the wafer having a micro convex lens; forming a second insulating layer on a hole wall of the blind hole, then filling an electrically conductive material in the blind hole having the second insulating layer, and making a conductor in the combined layer in signal connection with the micro convex lens and an IC extend to a surface of the first insulating layer and electrically connecting the conductor to the electrically conductive material; fixing the transparent substrate material on a surface of the first insulating layer having the micro convex lens, forming a dummy wafer on a surface of the transparent substrate material, and then thinning the wafer by grinding.Type: GrantFiled: November 29, 2018Date of Patent: June 23, 2020Assignee: Pioneer Materials Inc. ChengduInventors: Chen-Hsin Wu, Ti-Hsien Tai, Yu-Hsiang Pan, Liu-Yuh Lin, Liang-Chih Weng, Tzu-Huan Cheng, Hao-Che Liu, Chien-Chun Liu, Chien-Yao Huang, Leon A Chiu, Sau-Mou Wu
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Publication number: 20190199942Abstract: A living organism image monitoring system is provided, relating to the technical field of medical equipment. The living organism image monitoring system comprises a display module, a processor and a CIGS chip, the CIGS chip, the processor and the display module being electrically connected, the CIGS chip being used for detecting a near infrared light signal of a living organism and generating a current signal after having detected the near infrared light signal, the processor being used for generating a first pulse signal according to the current signal, and the display module being used for displaying an image according to the first pulse signal. The living organism image monitoring system provided by the present disclosure has the advantages of being capable of synchronously transmitting the images of a living organism to the display module for display and enabling the images to be clearer.Type: ApplicationFiled: November 6, 2018Publication date: June 27, 2019Inventors: Chien-Chun LIU, Liu-Yuh LIN, Liang-Chih WENG, Tzu-Huan CHENG, Chen-Hsin WU, Hao-Che LIU, Chien-Yao HUANG, Leon A CHIU, Sau-Mou WU, Ti-Hsien TAI, Yu-Hsiang PAN
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Publication number: 20190198544Abstract: Disclosed are a CMOS image sensor encapsulation structure and a method for manufacturing the same, including the steps of: firstly, a transparent substrate material is fixed to a surface of a first insulating layer having a micro convex lens, a dummy wafer is fixed on a surface of the transparent substrate material, and then a wafer is thinned by grinding, and in this process, the transparent substrate material provides more mechanical support force for the wafer, therefore, the wafer can become thinner by grinding, thus the CMOS image sensor encapsulation structure is characterized by being formed in a thin shape. Besides, a second installation area has a protection glue layer which can prevent oxygen and moisture from entering internal elements and absorb scattered light.Type: ApplicationFiled: November 29, 2018Publication date: June 27, 2019Applicant: Pioneer Materials Inc. ChengduInventors: Chen-Hsin WU, Liu-Yuh LIN, Liang-Chih WENG, Tzu-Huan CHENG, Hao-Che LIU, Chien-Chun LIU, Chien-Yao HUANG, Leon A. CHIU, Sau-Mou WU, Ti-Hsien TAI, Yu-Hsiang PAN
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Publication number: 20190198545Abstract: A CMOS image sensor encapsulation structure and its manufacturing method, including : forming a blind hole in a combined layer formed by a first insulating layer and a wafer, a surface of the first insulating layer facing away from the wafer having a micro convex lens; forming a second insulating layer on a hole wall of the blind hole, then filling an electrically conductive material in the blind hole having the second insulating layer, and making a conductor in the combined layer in signal connection with the micro convex lens and an IC extend to a surface of the first insulating layer and electrically connecting the conductor to the electrically conductive material; fixing the transparent substrate material on a surface of the first insulating layer having the micro convex lens, forming a dummy wafer on a surface of the transparent substrate material, and then thinning the wafer by grinding.Type: ApplicationFiled: November 29, 2018Publication date: June 27, 2019Applicant: Pioneer Materials Inc. ChengduInventors: Chen-Hsin WU, Liu-Yuh LIN, Liang-Chih WENG, Tzu-Huan CHENG, Hao-Che LIU, Chien-Chun LIU, Chien-Yao HUANG, Leon A. CHIU, Sau-Mou WU, Ti-Hsien TAI, Yu-Hsiang PAN
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Publication number: 20190200002Abstract: A 3D depth image acquiring method and apparatus, and an image acquisition device are provided. The method is applied to an image acquisition device comprising a VIS-NIR picture sensor and an infrared structured light projection component. The VIS-NIR picture sensor comprises a plurality of dot matrix units each having a blue light photosensitive component, a green light photosensitive component, a red light photosensitive component and an NIR photosensitive component distributed thereon. The method comprises: controlling the blue light photosensitive component, the green light photosensitive component, the red light photosensitive component, the NIR photosensitive component and the infrared structured light projection component to operate, to obtain an optimum NIR image and an optimum VIS image; and processing the optimum VIS image and a depth image which is obtained by performing calculation on the optimum NIR image using a 3D depth mode, to obtain a 3D depth image.Type: ApplicationFiled: November 27, 2018Publication date: June 27, 2019Inventors: Hao-Che Liu, Liu-Yuh Lin, Liang-Chih Weng, Tzu-Huan Cheng, Chen-Hsin Wu, Chien-Chun Liu, Chien-Yao Huang, Leon A. Chiu, Sau-Mou Wu, Ti-Hsien Tai, Yu-Hsiang Pan