Abstract: Embodiments of the present disclosure provide methods and apparatuses for updating a target wake time (TWT) service period and interval. The apparatuses include a communication device comprising a transceiver and a processor. The transceiver is configured to transmit and receive higher layer data packets in a TWT operation during a time period. The processor is configured to determine, based on PHY data rates during the time period, effective higher layer data rates, estimate an initial data transceiving time based on the effective higher layer data rates and total lengths of the data packets, adjust the initial data transceiving time to obtain a higher layer data transceiving time based on an estimated network congestion level, an estimated re-transmission rate, and a total amount of TWT overhead during the time period, and determine a new TWT service period and interval based on the higher layer data transceiving time.

Abstract: In an embodiment, a method includes: depositing a gate dielectric layer on a first fin and a second fin, the first fin and the second fin extending away from a substrate in a first direction, a distance between the first fin and the second fin decreasing along the first direction; depositing a sacrificial layer on the gate dielectric layer by exposing the gate dielectric layer to a self-limiting source precursor and a self-reacting source precursor, the self-limiting source precursor reacting to form an initial layer of a material of the sacrificial layer, the self-reacting source precursor reacting to form a main layer of the material of the sacrificial layer; annealing the gate dielectric layer while the sacrificial layer covers the gate dielectric layer; after annealing the gate dielectric layer, removing the sacrificial layer; and after removing the sacrificial layer, forming a gate electrode layer on the gate dielectric layer.

Abstract: A molding device and a molding method are disclosed. The molding device includes an upper mold, a lower mold and a middle mold. The lower mold is disposed below the upper mold. The middle mold is disposed between the upper mold and the lower mold. The middle mold is moveably attached to the lower mold through a position control mechanism.

Abstract: A measuring unit is used to measure a specific dimension of a product feature within a time segment to generate a measured dimension value. A processing unit compares the measured dimension value with a standard dimension value to generate an offset value. A control unit generates a control instruction based on the offset value, and transmits the control instruction to a machine on which machining member that is used to form the product feature is installed, so that the machine performs tool compensation on the machining member according to the control instruction.

Abstract: The transmission power at which to drive an antenna of a computing device is adjusted based on a peak transmission gain of the antenna for a current physical configuration mode in which the computing device is operating and on a maximum permitted radiation for the antenna. The antenna is driven at the adjusted transmission power when performing wireless communication using the antenna.

Abstract: An adjustable rack assembly and a cabinet using the same are disclosed. The adjustable rack assembly includes a rail and a sliding component. The rail is extended along a first direction, and includes a rail body, a bent portion and plural positioning grooves. The bent portion protrudes inwardly from an outer edge of the rail body, and the plural positioning grooves are disposed on the bent portion along the first direction. The sliding component includes a sliding body, a limiting portion and a guiding groove. The limiting portion is connected to the sliding body, and the guiding groove and the bent portion are mutually matched. When the sliding component is misaligned with the plural positioning grooves in the first direction, the sliding component is allowed to slide in the first direction. When the sliding component is engaged with the positioning groove, the sliding component is locked on the rail.

Abstract: The present disclosure discloses a display panel and a display device. The display panel includes: a base substrate, including a plurality of substrate via holes located in a display area of the display panel; and a plurality of driving signal lines and a plurality of bonding terminals, respectively located on different sides of the base substrate. At least one of the plurality of driving signal lines is electrically connected to at least one of the plurality of bonding terminals through the substrate via hole(s).

Abstract: A cleaning device for a floor mopping machine comprises a bucket body for containing water, wherein a water removal member and a water feeding mechanism for conveying water from the bucket body to a wiping object of a floor mopping machine are arranged in the bucket body. During cleaning, the water feeding mechanism runs to convey water to the wiping object; and when water is removed, the water feeding mechanism stops running, and the wiping object of the floor mopping machine is wiped with the water removal member. Power of the water feeding mechanism is used for water feeding, and a wiping head is automatically cleaned, and can be wiped dry without any other operation after being cleaned; and the cleaning device is simple in structure, portable to use, less prone to damage and can be freely switched between a cleaning mode and a wipe-drying mode.

Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above-mentioned memory device is also provided.

Abstract: A method for making a IC is provided, including: identifying, in a schematic, first and second edge elements, which edge elements including devices whose layout patterns are configured to conform to a first layout grid; identifying all the elements between the first and second edge elements, at least one of the identified elements including a device whose layout pattern is configured to conform to a second layout grid that is finer than the first layout grid; and calculating a spatial quantity of a combined layout pattern of the identified elements between the first and second edge elements to determine whether the combined layout pattern conforms to the first layout grid.

Abstract: A liquid cooling device includes a heat dissipation shell and a dual fin module. The heat dissipation shell includes a cooling cavity, and the dual fin module is fixed in the cooling cavity to separate the cooling cavity into an upper cooling space and a lower cooling space, so that a cooling fluid enters the cooling cavity and flows into the upper cooling space and the lower cooling space to cool a chip in the lower cooling space.

Abstract: A method that is disclosed that includes the operations outlined below. Dies are arranged on a test fixture, and each of the dies includes first antennas and at least one via array, wherein the at least one via array is formed between at least two of the first antennas to separate the first antennas. By the first antennas of the dies, test processes are sequentially performed on an under-test device including second antennas that positionally correspond to the first antennas, according to signal transmissions between the first antennas and the second antennas.

Abstract: A method includes scanning for registered fine-time measurement (FTM)-enabled Wi-Fi nodes to generate a list of the FTM-enabled Wi-Fi nodes. The method also includes performing a ranging operation by (i) selecting nodes to range with from the list of the FTM-enabled Wi-Fi nodes and (ii) processing ranging responses from the selected nodes to generate distance measurements. The method further includes estimating a position of a device based on the distance measurements generated from the ranging operation.

Abstract: In some examples, an antenna assembly includes a driven antenna element to communicate a signal over an antenna feed line, and a printed circuit including an electrically conductive pattern that is placed adjacent the driven antenna element. The printed circuit including the electrically conductive pattern provides a parasitic antenna element for the driven antenna element.

Abstract: A 5G outdoor unit having a heat dissipation function includes a main body and a support frame. The main body includes a housing, a cover, and an antenna, the cover is mounted on one side of the housing, and the antenna is disposed on an inner side of the cover. The support frame includes a first side plate, a second side plate, and a plurality of heat dissipation fins. The first side plate is mounted on an outer side of the cover, the fins are arranged between the first side plate and the second side plate at intervals, and a channel is formed between the two adjacent heat dissipation fins. As such, the main body and the support frame are two separate elements. The volume of the main body is reduced, and the weight of the main body is less.

Abstract: Semiconductor device and the manufacturing method thereof are disclosed. An exemplary semiconductor device comprises a first semiconductor stack and a second semiconductor stack over a substrate, wherein each of the first and second semiconductor stacks includes semiconductor layers stacked up and separated from each other; a dummy spacer between the first and second semiconductor stacks, wherein the dummy spacer contacts a first sidewall of each semiconductor layer of the first and second semiconductor stacks; and a gate structure wrapping a second sidewall, a top surface, and a bottom surface of each semiconductor layer of the first and second semiconductor stacks.

Abstract: A bonded assembly including a first structure and a second structure is provided. The first structure includes first metallic connection structures surrounded of which a passivation dielectric layer includes openings therein, and first metallic bump structures having a respective first horizontal bonding surface segment that is vertically recessed from a first horizontal plane including a distal horizontal surface of the passivation dielectric layer. The second structure includes second metallic bump structures having a respective second horizontal bonding surface segment that protrudes toward the first structure. The first metallic bump structures is bonded to the second metallic bump structures through solder material portions.

Abstract: A shift register (SR) includes a voltage control circuit (110) and a bias compensation circuit (120). The voltage control circuit (110) is configured to control a voltage at a first node (Output) to be a first voltage or a second voltage. The bias compensation circuit (120) is configured to: when the voltage at the first node (Output) is the first voltage, transmit a first signal received by a first signal terminal (VDD-A) to a first signal output terminal (EM1), and transmit a second signal received by a second signal terminal (VDD-B) to a second signal output terminal (EM2); and in response to the voltage at the first node (Output) being the second voltage, transmit a signal received by a first voltage terminal (LVGL1) to the first signal output terminal (EM1) and the second signal output terminal (EM2).

Abstract: A method includes the following steps: pre-processing chest X-ray films to obtain initial X-ray film images that meets format requirements; screening the initial X-ray film images to detect whether they are posteroanterior chest images; inputting the posteroanterior chest images into a binary classification model of the deep convolutional neural network for negative and positive classification; inputting the images presenting positive results into a detection model of the deep convolutional neural network to detect a disease type and label an outline of a lesion area in each image; and displaying the disease type and lesion area corresponding to the image.

Abstract: A method for training a deep learning network for face recognition includes: utilizing a face landmark detector to perform face alignment processing on at least one captured image, thereby outputting at least one aligned image; inputting the at least one aligned image to a teacher model to obtain a first output vector; inputting the at least one captured image a student model corresponding to the teacher module to obtain a second output vector; and adjusting parameter settings of the student model according to the first output vector and the second output vector.