Abstract: The present disclosure is at least directed to utilizing air curtain devices to form air curtains to separate and isolate areas in which respective workpieces are stored from a transfer compartment within a workpiece processing apparatus. The transfer compartment of the workpiece processing apparatus includes a robot configured to transfer or transport ones of the workpieces to and from these respective storage areas through the transfer compartment and to and from a tool compartment. A tool is present in the tool compartment for processing and refining the respective workpieces. Clean dry air (CDA) may be circulated through the respective storage areas. The air curtains formed by the air curtain devices and the circulation of CDA through the respective storage areas reduces the likelihood of the generation of defects, damages, and degradation of the workpieces when present within the workpiece processing apparatus.

Abstract: A semiconductor package including a first semiconductor die, a second semiconductor die, a first insulating encapsulation, a dielectric layer structure, a conductor structure and a second insulating encapsulation is provided. The first semiconductor die includes a first semiconductor substrate and a through substrate via (TSV) extending from a first side to a second side of the semiconductor substrate. The second semiconductor die is disposed on the first side of the semiconductor substrate. The first insulating encapsulation on the second semiconductor die encapsulates the first semiconductor die. A terminal of the TSV is coplanar with a surface of the first insulating encapsulation. The dielectric layer structure covers the first semiconductor die and the first insulating encapsulation. The conductor structure extends through the dielectric layer structure and contacts with the through substrate via.

Abstract: Disclosed is a touch control device, comprising a substrate, a plurality of sensing units, an insulating layer, an electric bridge, a protection layer, a supporting part, an element layer and a glue part. A plurality of sensing units are disposed on the substrate in an interval between two of sensing units to expose portions of the substrate. The insulating layer covers the exposed substrate. The electric bridge covers the insulating layer, and two ends of the electric bridge are respectively connected to two sensing units among the plurality of sensing units. The protection layer covers the electric bridge and the sensing unit. The supporting part covers the protection layer. The element layer is disposed on the supporting part. As a result, an accommodating space is formed therebetween. The accommodating space is filled up with the glue part to glue the protection layer and the element layer.