Abstract: A package structure including a photonic, an electronic die, an encapsulant and a waveguide is provided. The photonic die includes an optical coupler. The electronic die is electrically coupled to the photonic die. The encapsulant laterally encapsulates the photonic die and the electronic die. The waveguide is disposed over the encapsulant and includes an upper surface facing away from the encapsulant. The waveguide includes a first end portion and a second end portion, the first end portion is optically coupled to the optical coupler, and the second end portion has a groove on the upper surface.

Abstract: A package includes a photonic layer on a substrate, the photonic layer including a silicon waveguide coupled to a grating coupler; an interconnect structure over the photonic layer; an electronic die and a first dielectric layer over the interconnect structure, where the electronic die is connected to the interconnect structure; a first substrate bonded to the electronic die and the first dielectric layer; a socket attached to a top surface of the first substrate; and a fiber holder coupled to the first substrate through the socket, where the fiber holder includes a prism that re-orients an optical path of an optical signal.

Abstract: A semiconductor package including a first semiconductor die, a second semiconductor die, a first insulating encapsulation, a dielectric layer structure, a conductor structure and a second insulating encapsulation is provided. The first semiconductor die includes a first semiconductor substrate and a through silicon via (TSV) extending from a first side to a second side of the semiconductor substrate. The second semiconductor die is disposed on the first side of the semiconductor substrate. The first insulating encapsulation on the second semiconductor die encapsulates the first semiconductor die. A terminal of the TSV is coplanar with a surface of the first insulating encapsulation. The dielectric layer structure covers the first semiconductor die and the first insulating encapsulation. The conductor structure extends through the dielectric layer structure and contacts with the through silicon via.

Abstract: A transflective liquid crystal display is provided. The electric fields of reflective regions are adjusted by arranging resistors between transmissive electrodes and reflectors or by disposing reflectors floating on the transmissive electrodes and ground electrodes so that the phase shift of liquid crystal layer in the reflective region and transmissive region can be controlled. Accordingly, the transmissive area and reflective area can be kept substantially identical in thickness and the complex process for manufacturing double gap structure is thus not required.

Abstract: A transflective liquid crystal display is provided. The electric fields of reflective regions are adjusted by arranging resistors between transmissive electrodes and reflectors or by disposing reflectors floating on the transmissive electrodes and ground electrodes so that the phase shift of liquid crystal layer in the reflective region and transmissive region can be controlled. Accordingly, the transmissive area and reflective area can be kept substantially identical in thickness and the complex process for manufacturing double gap structure is thus not required.