Patents by Inventor Hao-Chih HSIEH
Hao-Chih HSIEH has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11776863Abstract: A semiconductor device package includes a carrier, a first interposer disposed and a second interposer. The second interposer is stacked on the first interposer, and the first interposer is mounted to the carrier. The combination of the first interposer and the second interposer is substantially T-shaped.Type: GrantFiled: August 17, 2021Date of Patent: October 3, 2023Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Hao-Chih Hsieh, Tun-Ching Pi, Sung-Hung Chiang, Yu-Chang Chen
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Publication number: 20220415810Abstract: A semiconductor device package includes a number of interposers mounted to the carrier, wherein the number of interposers may be arranged in an irregular pattern.Type: ApplicationFiled: September 6, 2022Publication date: December 29, 2022Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Hao-Chih HSIEH, Tun-Ching PI, Sung-Hung CHIANG, Yu-Chang CHEN
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Publication number: 20220367308Abstract: A semiconductor device package includes a carrier and an encapsulant disposed on the carrier. At least one portion of the encapsulant is spaced from the carrier by a space.Type: ApplicationFiled: July 28, 2022Publication date: November 17, 2022Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Tun-Ching PI, Yen-Chi HUANG, Hao-Chih HSIEH, Jin Han SHIH
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Patent number: 11437322Abstract: A semiconductor device package includes a number of interposers mounted to the carrier, wherein the number of interposers may be arranged in an irregular pattern.Type: GrantFiled: September 4, 2019Date of Patent: September 6, 2022Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Hao-Chih Hsieh, Tun-Ching Pi, Sung-Hung Chiang, Yu-Chang Chen
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Publication number: 20220238457Abstract: A semiconductor device package includes a first substrate, a second substrate, a first electronic component, a second electronic component and a shielding layer. The second substrate is disposed over the first substrate. The first electronic component is disposed between the first substrate and the second substrate. The second electronic component is disposed between the first substrate and the second substrate and adjacent to the second substrate than the first electronic component. The shielding element electrically connects the second electronic component to the second substrate. The second electronic component and the shielding element define a space accommodating the first electronic component.Type: ApplicationFiled: April 12, 2022Publication date: July 28, 2022Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Hao-Chih HSIEH, Tzu-Cheng LIN, Chun-Jen CHEN
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Patent number: 11302646Abstract: A semiconductor device package includes a first substrate, a second substrate, a first electronic component, a second electronic component and a shielding layer. The second substrate is disposed over the first substrate. The first electronic component is disposed between the first substrate and the second substrate. The second electronic component is disposed between the first substrate and the second substrate and adjacent to the second substrate than the first electronic component. The shielding element electrically connects the second electronic component to the second substrate. The second electronic component and the shielding element define a space accommodating the first electronic component.Type: GrantFiled: February 14, 2020Date of Patent: April 12, 2022Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Hao-Chih Hsieh, Tzu-Cheng Lin, Chun-Jen Chen
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Publication number: 20210375706Abstract: A semiconductor device package includes a carrier, a first interposer disposed and a second interposer. The second interposer is stacked on the first interposer, and the first interposer is mounted to the carrier. The combination of the first interposer and the second interposer is substantially T-shaped.Type: ApplicationFiled: August 17, 2021Publication date: December 2, 2021Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Hao-Chih HSIEH, Tun-Ching PI, Sung-Hung CHIANG, Yu-Chang CHEN
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Publication number: 20210257311Abstract: A semiconductor device package includes a first substrate, a second substrate, a first electronic component, a second electronic component and a shielding layer. The second substrate is disposed over the first substrate. The first electronic component is disposed between the first substrate and the second substrate. The second electronic component is disposed between the first substrate and the second substrate and adjacent to the second substrate than the first electronic component. The shielding element electrically connects the second electronic component to the second substrate. The second electronic component and the shielding element define a space accommodating the first electronic component.Type: ApplicationFiled: February 14, 2020Publication date: August 19, 2021Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Hao-Chih HSIEH, Tzu-Cheng LIN, Chun-Jen CHEN
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Patent number: 11094602Abstract: A semiconductor device package includes a carrier, a first interposer disposed and a second interposer. The second interposer is stacked on the first interposer, and the first interposer is mounted to the carrier. The combination of the first interposer and the second interposer is substantially T-shaped.Type: GrantFiled: August 9, 2019Date of Patent: August 17, 2021Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Hao-Chih Hsieh, Tun-Ching Pi, Sung-Hung Chiang, Yu-Chang Chen
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Publication number: 20210043527Abstract: A semiconductor device package includes a carrier, a first interposer disposed and a second interposer. The second interposer is stacked on the first interposer, and the first interposer is mounted to the carrier. The combination of the first interposer and the second interposer is substantially T-shaped.Type: ApplicationFiled: August 9, 2019Publication date: February 11, 2021Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Hao-Chih HSIEH, Tun-Ching PI, Sung-Hung CHIANG, Yu-Chang CHEN
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Publication number: 20200083172Abstract: A semiconductor device package includes a number of interposers mounted to the carrier, wherein the number of interposers may be arranged in an irregular pattern.Type: ApplicationFiled: September 4, 2019Publication date: March 12, 2020Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Hao-Chih HSIEH, Tun-Ching PI, Sung-Hung CHIANG, Yu-Chang CHEN
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Publication number: 20200083132Abstract: A semiconductor device package includes a carrier and an encapsulant disposed on the carrier. At least one portion of the encapsulant is spaced from the carrier by a space.Type: ApplicationFiled: May 10, 2019Publication date: March 12, 2020Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Yen-Chi HUANG, Hao-Chih HSIEH, Jin Han SHIH, Yung I. YEH, Tun-Ching PI
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Patent number: 10083911Abstract: A semiconductor device package includes a flexible substrate, an electronic component, at least one flexible member, and a package body. The electronic component is disposed on the flexible substrate. The at least one flexible member is disposed on the flexible substrate. The package body encapsulates the electronic component and has a first part and a second part separated from the first part by the at least one flexible member.Type: GrantFiled: February 8, 2017Date of Patent: September 25, 2018Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Hao-Chih Hsieh, Tun-Ching Pi
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Publication number: 20180226348Abstract: A semiconductor device package includes a flexible substrate, an electronic component, at least one flexible member, and a package body. The electronic component is disposed on the flexible substrate. The at least one flexible member is disposed on the flexible substrate. The package body encapsulates the electronic component and has a first part and a second part separated from the first part by the at least one flexible member.Type: ApplicationFiled: February 8, 2017Publication date: August 9, 2018Inventors: Hao-Chih HSIEH, Tun-Ching PI