Abstract: An apparatus and method for placing the die of a die-down configured integrated circuit package in an upright orientation. The first board has electrical receptors peripherally surrounding a first hole formed through the first board. A die-down configured integrated circuit package with the die thereof exposed is inserted into a test socket having a second hole formed through the bottom thereof. The exposed die is located over the second hole in the bottom surface of the test socket. The test socket is placed onto the top surface of the first board. The test socket is positioned on the first board such that the pins of the test socket engage the electrical receptors and such that the exposed die of the die-down configured integrated circuit package is disposed over the first hole. The first board is coupled to a second board having electrical connectors extending from the bottom surface thereof.