Abstract: A semiconductor package includes a conductive pillar and a solder. The conductive pillar has a first sidewall and a second sidewall opposite to the first sidewall, wherein a height of the first sidewall is greater than a height of the second sidewall. The solder is disposed on and in direct contact with the conductive pillar, wherein the solder is hanging over the first sidewall and the second sidewall of conductive pillar.

Abstract: An integrated circuit package including electrically floating metal lines and a method of forming are provided. The integrated circuit package may include integrated circuit dies, an encapsulant around the integrated circuit dies, a redistribution structure on the encapsulant, a first electrically floating metal line disposed on the redistribution structure, a first electrical component connected to the redistribution structure, and an underfill between the first electrical component and the redistribution structure. A first opening in the underfill may expose a top surface of the first electrically floating metal line.

Abstract: A magnetic component includes a core, a winding, a lead frame and a conductive material. The winding is disposed in the core. A winding end of the winding extends to an outer periphery of the core. The lead frame is disposed on the outer periphery of the core. At least one hole is formed on the lead frame and corresponds to the winding end. The conductive material is disposed in the at least one hole. The conductive material is in contact with the winding end.

Abstract: A semiconductor package is provided. The semiconductor package includes a heat dissipation substrate including a first conductive through-via embedded therein; a sensor die disposed on the heat dissipation substrate; an insulating encapsulant laterally encapsulating the sensor die; a second conductive through-via penetrating through the insulating encapsulant; and a first redistribution structure and a second redistribution structure disposed on opposite sides of the heat dissipation substrate. The second conductive through-via is in contact with the first conductive through-via. The sensor die is located between the second redistribution structure and the heat dissipation substrate. The second redistribution structure has a window allowing a sensing region of the sensor die receiving light. The first redistribution structure is electrically connected to the sensor die through the first conductive through-via, the second conductive through-via and the second redistribution structure.

Abstract: A stacked electronic structure, comprising a substrate, wherein electronic devices are disposed on the substrate, and a molding body encapsulates the electronic devices, wherein a first thermal conductive layer is disposed on a first electronic device, and a second thermal conductive layer is disposed on a second electronic device, wherein a magnetic device comprising a magnetic body is disposed over a top surface of the molding body, wherein at least one third thermal conductive layer is disposed on the magnetic body, and the first thermal conductive layer and the second thermal conductive layer are respectively connected with the at least one third thermal conductive layer for dissipating heat.

Abstract: A magnetic device comprising a magnetic body, a coil disposed in the magnetic body and at least one thermal conductive layer, wherein a first portion of the at least one thermal conductive layer encapsulates at least one portion of the coil and a second portion of the at least one thermal conductive layer is exposed from the magnetic body, wherein the at least one thermal conductive layer forms a continuous thermal conductive path from the coil to the outside of the magnetic body for dissipating heat generated from the coil.

Abstract: A communication system, a data transmission method thereof, and a user device thereof are provided. The data transmission method includes the following steps. A first transmitting Radio Link Control (Tx RLC) entity of a first base station transmits a first Protocol Data Unit (PDU) to a first receiving Radio Link Control (Rx RLC) entity of a user equipment via a first leg. A second Tx RLC entity of a second base station transmits a second PDU to a second Rx RLC entity of the user equipment via a second leg. If the first Rx RLC entity successfully receives the first PDU or the second Rx RLC entity successfully receives the second PDU, the first Rx RLC entity and the second RLC entity return Acknowledgement (ACK) messages.

Abstract: A communication system, a data transmission method thereof, and a user device thereof are provided. The data transmission method includes the following steps. A first transmitting Radio Link Control (Tx RLC) entity of a first base station transmits a first Protocol Data Unit (PDU) to a first receiving Radio Link Control (Rx RLC) entity of a user equipment via a first leg. A second Tx RLC entity of a second base station transmits a second PDU to a second Rx RLC entity of the user equipment via a second leg. If the first Rx RLC entity successfully receives the first PDU or the second Rx RLC entity successfully receives the second PDU, the first Rx RLC entity and the second RLC entity return Acknowledgement (ACK) messages.

Abstract: A magnetic device comprising a magnetic body, a coil disposed in the magnetic body and at least one thermal conductive layer, wherein a first portion of the at least one thermal conductive layer encapsulates at least one portion of the coil and a second portion of the at least one thermal conductive layer is exposed from the magnetic body, wherein the at least one thermal conductive layer forms a continuous thermal conductive path from the coil to the outside of the magnetic body for dissipating heat generated from the coil.

Abstract: A locking device for a panel is provided for a single board computer for fixing onto the chassis of an industrial personal computer. The locking device includes a handle, a locking element, a first spring, a seat and a second spring. The handle has a concave groove at the front-end thereof for receiving the locking element. The first spring is placed in an inner of the locking element for abutting against an inner portion of the handle. The pin penetrates through the seat and the handle and fixes them together. The second spring is mounted on the pin and has an end hooked to the locking element. The locking element has a pressing portion. When the pressing portion is pressed, the handle and the locking element move back together through the pin as an axis.

Abstract: A locking device for a panel is provided for a single board computer for fixing onto the chassis of an industrial personal computer. The locking device includes a handle, a locking element, a first spring, a seat and a second spring. The handle has a concave groove at the front-end thereof for receiving the locking element. The first spring is placed in an inner of the locking element for abutting against an inner portion of the handle. The pin penetrates through the seat and the handle and fixes them together. The second spring is mounted on the pin and has an end hooked to the locking element. The locking element has a pressing portion. When the pressing portion is pressed, the handle and the locking element move back together through the pin as an axis.