Patents by Inventor Hao-Chun Ting

Hao-Chun Ting has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor packages and methods of forming the same
    Patent number: 10461023
    Abstract: Semiconductor package s and methods of forming the same are disclosed. The semiconductor package includes a chip, a redistribution circuit structure and a UBM pattern. The redistribution circuit structure is disposed over and electrically connected to the chip and includes a topmost conductive pattern. The UBM pattern is disposed over and electrically connected to the topmost conductive pattern, wherein the UBM pattern includes a set of vias and a pad on the set of vias, wherein the vias are arranged in an array and electrically connected to the pad and the topmost conductive pattern.
    Type: Grant
    Filed: January 30, 2018
    Date of Patent: October 29, 2019
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Mao-Yen Chang, Hao-Yi Tsai, Kuo-Lung Pan, Tin-Hao Kuo, Tzung-Hui Lee, Teng-Yuan Lo, Hao-Chun Ting
  • SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME
    Publication number: 20190131223
    Abstract: Semiconductor package s and methods of forming the same are disclosed. The semiconductor package includes a chip, a redistribution circuit structure and a UBM pattern. The redistribution circuit structure is disposed over and electrically connected to the chip and includes a topmost conductive pattern. The UBM pattern is disposed over and electrically connected to the topmost conductive pattern, wherein the UBM pattern includes a set of vias and a pad on the set of vias, wherein the vias are arranged in an array and electrically connected to the pad and the topmost conductive pattern.
    Type: Application
    Filed: January 30, 2018
    Publication date: May 2, 2019
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Mao-Yen Chang, Hao-Yi Tsai, Kuo-Lung Pan, Tin-Hao Kuo, Tzung-Hui Lee, Teng-Yuan Lo, Hao-Chun Ting