Patents by Inventor Hao Ding

Hao Ding has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12151204
    Abstract: A catalytic oxidation system for efficient conversion and removal of volatile organic compounds (VOCs) in a coal chemical industry is provided. The catalytic oxidation system includes a reactor and a first temperature control system, where the reactor is provided with a waste gas inlet and a waste gas outlet and is provided with a preheating zone, a reaction zone, and a heat recovery zone sequentially in a flow direction of a waste gas, and a catalyst is filled in the reaction zone; and the first temperature control system includes a first serpentine pipe buried in the catalyst and a first steam drum arranged outside the reactor, the first steam drum and the first serpentine pipe are connected through a pipeline to form a circulation line, and a temperature in the reaction zone is adjusted to 150° C. to 350° C. by controlling a pressure of the first steam drum.
    Type: Grant
    Filed: May 8, 2024
    Date of Patent: November 26, 2024
    Assignees: Zhejiang University, Taizhou Institute of Zhejiang University
    Inventors: Shengyong Lu, Bing Zhou, Yaqi Peng, Minghui Tang, Kai Zhang, Hao Zhang, Jiamin Ding, Guanjie Wang
  • Publication number: 20240387274
    Abstract: A method according to the present disclosure includes providing a workpiece including a first fin-shaped structure and a second fin-shaped structure over a substrate, depositing a nitride liner over the substrate and sidewalls of the first fin-shaped structure and the second fin-shaped structure, forming an isolation feature over the nitride liner and between the first fin-shaped structure and the second fin-shaped structure, epitaxially growing a cap layer on exposed surfaces of the first fin-shaped structure and the second fin-shaped structure and above the nitride liner, crystalizing the cap layer, and forming a first source/drain feature over a first source/drain region of the first fin-shaped structure and a second source/drain feature over a second source/drain region of the second fin-shaped structure.
    Type: Application
    Filed: July 29, 2024
    Publication date: November 21, 2024
    Inventors: Szu-Chi Yang, Allen Chien, Tsai-Yu Huang, Chien-Chih Lin, Po-Kai Hsiao, Shih-Hao Lin, Chien-Chih Lee, Chih Chieh Yeh, Cheng-Ting Ding, Tsung-Hung Lee
  • Publication number: 20240387386
    Abstract: An embodiment interposer may include a plurality of first redistribution layers including first electrical interconnect structures having a first line width and a first line spacing embedded in a first dielectric material, and a plurality of second redistribution layers including second electrical interconnect structures having a second line width and a second line spacing embedded in a second dielectric material such that the second line width is greater than the first line width and such that the second line spacing is greater than the first line spacing. The first dielectric material may be one of polyimide, benzocyclobuten, or polybenzo-bisoxazole and second dielectric material may include an inorganic particulate material dispersed in an epoxy resin. The interposer may further include a protective layer, including the second dielectric material, formed over the first redistribution layers, and a surface layer, including the first dielectric material, formed as part of the second redistribution layers.
    Type: Application
    Filed: May 15, 2023
    Publication date: November 21, 2024
    Inventors: Shang-Yun Hou, Chien-Hsun Lee, Tsung-Ding Wang, Hao-Cheng Hou
  • Publication number: 20240379535
    Abstract: An embodiment semiconductor package includes a bare semiconductor chip, a packaged semiconductor chip adjacent the bare semiconductor chip, and a redistribution structure bonded to the bare semiconductor chip and the packaged semiconductor chip. The redistribution structure includes a first redistribution layer having a first thickness; a second redistribution layer having a second thickness; and a third redistribution layer between the first redistribution layer and the second redistribution layer. The third redistribution layer has a third thickness greater than the first thickness and the second thickness. The package further includes an underfill disposed between the bare semiconductor chip and the redistribution structure and a molding compound encapsulating the bare semiconductor chip, the packaged semiconductor chip, and the underfill.
    Type: Application
    Filed: July 22, 2024
    Publication date: November 14, 2024
    Inventors: Chung-Shi Liu, Chien-Hsun Lee, Jiun Yi Wu, Hao-Cheng Hou, Hung-Jen Lin, Jung Wei Cheng, Tsung-Ding Wang, Yu-Min Liang, Li-Wei Chou
  • Patent number: 12142560
    Abstract: An embodiment semiconductor package includes a bare semiconductor chip, a packaged semiconductor chip adjacent the bare semiconductor chip, and a redistribution structure bonded to the bare semiconductor chip and the packaged semiconductor chip. The redistribution structure includes a first redistribution layer having a first thickness; a second redistribution layer having a second thickness; and a third redistribution layer between the first redistribution layer and the second redistribution layer. The third redistribution layer has a third thickness greater than the first thickness and the second thickness. The package further includes an underfill disposed between the bare semiconductor chip and the redistribution structure and a molding compound encapsulating the bare semiconductor chip, the packaged semiconductor chip, and the underfill.
    Type: Grant
    Filed: August 23, 2021
    Date of Patent: November 12, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chung-Shi Liu, Chien-Hsun Lee, Jiun Yi Wu, Hao-Cheng Hou, Hung-Jen Lin, Jung Wei Cheng, Tsung-Ding Wang, Yu-Min Liang, Li-Wei Chou
  • Patent number: 12131728
    Abstract: The present application provides a method of training a natural language processing model, which relates to a field of artificial intelligence, and in particular to a field of natural language processing. A specific implementation scheme includes: performing a semantic learning for multi-tasks on an input text, so as to obtain a semantic feature for the multi-tasks, wherein the multi-tasks include a plurality of branch tasks; performing a feature learning for each branch task based on the semantic feature, so as to obtain a first output result for each branch task; calculating a loss for each branch task according to the first output result for the branch task; and adjusting a parameter of the natural language processing model according to the loss for each branch task. The present application further provides a method of processing a natural language, an electronic device, and a storage medium.
    Type: Grant
    Filed: May 31, 2022
    Date of Patent: October 29, 2024
    Assignee: BEIJING BAIDU NETCOM SCIENCE TECHNOLOGY CO., LTD.
    Inventors: Siyu Ding, Chao Pang, Shuohuan Wang, Yanbin Zhao, Junyuan Shang, Yu Sun, Shikun Feng, Hao Tian, Hua Wu, Haifeng Wang
  • Publication number: 20240356397
    Abstract: Systems and methods for an asymmetrical delta shape interior permanent magnet machine include rotor having a plurality of magnets arranged on an interior of the rotor. The plurality of magnets can include a first magnet having a first size, a second magnet having a second size, and a third magnet having a third size. The first magnet, the second magnet, and the third magnet can be arranged in a triangular shape. Each of the first size, the second size, and the third size can be different from one another.
    Type: Application
    Filed: April 24, 2023
    Publication date: October 24, 2024
    Inventors: Hao Ding, Khwaja Rahman, Fan Wu
  • Publication number: 20240336933
    Abstract: A plant sterility-related gene is disclosed, in particular to a dominant male sterility-related gene from rice and application of an encoding protein thereof in creating a rice dominant male sterile line. The present invention provides a rice dominant male sterile gene SMS and application thereof. The rice dominant male sterility-related gene SMS may be used for creating a new dominant male sterile line, thereby strengthening use of the advantages of a rice hybrid. The TO generation of transgenic plant line with overexpression of the rice dominant male sterility related gene SMS shows pollen abortion or no pollen, which indicates that the transgenic plant overexpressing this gene can obtain a new sterile material. Creation of the dominant male sterile line can promote wide application of a recurrent selection breeding method, enrich the genetic diversity of a new breeding variety, and solve the problem of a single variety of the rice.
    Type: Application
    Filed: February 2, 2024
    Publication date: October 10, 2024
    Inventors: YACHUN YANG, YONG DING, HAO LI, JIANBO YANG, CHENG ZHANG, HUI MA
  • Publication number: 20240327265
    Abstract: A large-scale in-situ dewatering treatment method and device for lake sludge are provided. The large-scale in-situ dewatering treatment method for lake sludge includes: step S1, sludge excavation: excavating sludge from a lake and transporting the sludge to a detention pond; step S2, in-situ detention: filtering the sludge in the detention pond to obtain filtered sludge; step S3, dewatering: transporting the filtered sludge to a dewatering workshop and performing deep dewatering on the filtered sludge to obtain mud blocks and wastewater; and step S4, environmental protection treatment: using the mud blocks to build an island near a dredging platform in the lake. The large-scale in-situ dewatering treatment method for lake sludge not only solves the problems of difficulty in selecting a temporary sludge disposal site and high capital investment costs in a traditional lake dredging operation, but also reduces the transportation cost of transporting sludge to a land.
    Type: Application
    Filed: March 28, 2024
    Publication date: October 3, 2024
    Inventors: Ziwu Fan, Rui Ding, Chen Xie, Dandan Li, Hao Liu, Yu Chen, Ji Wu, Xiaoyu Wang, Kai Yu, Qiupeng Cai
  • Patent number: 12104400
    Abstract: A cleaning robot for swimming pools includes a charging assembly, a floating assembly, a power assembly and a cleaning assembly. The charging assembly includes a charging mount provided with a first charging induction portion and a first magnet set. The floating assembly includes a floating body, and a second charging induction portion and a second magnet set are disposed on a lateral portion of the floating body. The floating assembly is attracted with the first magnet set of the charging assembly through the second magnet set, and the first charging induction portion and the second charging induction portion are arranged to charge the power assembly after being turned on. The floating assembly and the cleaning assembly are provided with a first and a second travel module for driving the floating assembly and the cleaning assembly respectively. The floating assembly is connected to the cleaning assembly through a power supply cable.
    Type: Grant
    Filed: July 14, 2022
    Date of Patent: October 1, 2024
    Assignee: HUBEI YIMU ELECTRONIC TECHNOLOGY CO., LTD.
    Inventors: Yongchao Liu, Yanshan Han, Rong Xiang, Hao Ding
  • Publication number: 20240317745
    Abstract: The present disclosure is directed to a class of Sigma-1 receptor small molecule antagonists, their pharmaceutical compositions, preparation methods, and uses. The Sigma-1 receptor small molecule antagonists are shown in formula (I), with specific substituents and definitions described in the specification. These Sigma-1 receptor small molecule antagonists exhibit good binding and antagonistic activity with the Sigma-1 receptor. The invention includes these compounds or their pharmaceutical compositions and their use in treating and/or preventing pain disorders related to the Sigma-1 receptor.
    Type: Application
    Filed: March 14, 2024
    Publication date: September 26, 2024
    Inventors: Shuo Zhao, Subo Liao, Jun Yang, Hao Zhou, Zejian Ding, Yao He, Xiongjun Mou, Youjian Ning, Xin Zheng
  • Publication number: 20240317832
    Abstract: An unnatural amino acid may have a structure as shown in formula (1) or may be an enantiomer thereof: Such unnatural amino acid may be used, e.g., in recombinant proteins. A recombinant protein may contain such unnatural amino acid and a protein conjugate prepared from the recombinant protein. The unnatural amino acid can be simple and convenient to prepare, safe in nature, difficult to inactivate when inserted into a protein, and may have a high binding rate with a coupling moiety, and the obtained conjugate is higher in stability. The unnatural amino acid is applicable to numerous fields, especially in preparation of a recombinant protein or a recombinant protein conjugate.
    Type: Application
    Filed: July 29, 2021
    Publication date: September 26, 2024
    Applicant: NOVOCODEX BIOPHARMACEUTICALS CO., LTD.
    Inventors: Jinwei YANG, Chenghao YE, Gang XIA, Pengchao HUO, Wen DING, Longfei CHEN, Lin JIAO, Hao HUANG, Xin HENG, Jingjing ZHU, Yuebin YING, Xuejun LIANG
  • Publication number: 20240322425
    Abstract: An antenna and an electronic device are provided, and belong to the field of communication technology. The antenna includes: a first dielectric substrate, at least one sub-array and at least one first feed structure. Each sub-array includes at least one first radiation portion, at least one phase shifter, at least one second feed structure and a reference electrode layer. Each transmission component includes a first transmission structure and a second transmission structure; the at least one first radiation portion and the at least one second feed structure are on a side of the first dielectric substrate away from the at least one transmission component. The reference electrode layer is on the first dielectric substrate. Each first feed structure includes a first feed port and at least one second feed port; each second feed structure includes a third feed port and at least one fourth feed port.
    Type: Application
    Filed: March 29, 2022
    Publication date: September 26, 2024
    Inventors: Jing WANG, Yi DING, Haocheng JIA, Zhifeng ZHANG, Chuncheng CHE, Hao GUO, Yan LU, Weisi ZHOU, Wenxue MA
  • Publication number: 20240320020
    Abstract: Various examples relate to an apparatus, a device, a method, and a computer program for executing code written in a dynamic script language and to an apparatus, a device, a method, and a computer program for providing code of a dynamic scripting language. The apparatus for executing code written in a dynamic script language comprises processing circuitry con-figured to obtain code written in the dynamic script language, obtain one or more profiles for accelerating an execution of the code, with the one or more profiles being bundled with the code, and execute the code based on the one or more profiles.
    Type: Application
    Filed: December 14, 2021
    Publication date: September 26, 2024
    Inventors: Junyong DING, Qi ZHANG, Shiyu ZHANG, Yuan CHEN, Hao XU, Tao PAN
  • Publication number: 20240321759
    Abstract: A package structure includes an interposer including a front side and a back side opposite the front side, an upper molded structure on the front side of the interposer and including an upper molding layer and a semiconductor die in the upper molding layer, and a lower molded structure on the back side of the interposer and including a lower molding layer and a substrate portion in the lower molding layer, wherein the substrate portion includes conductive layers electrically coupled to the semiconductor die through the interposer.
    Type: Application
    Filed: June 30, 2023
    Publication date: September 26, 2024
    Inventors: Tsung-Ding Wang, Chien-Hsun Lee, Shang-Yun Hou, Hao-Cheng Hou, Chin-Liang Chen
  • Publication number: 20240310733
    Abstract: A method includes forming a photoresist on a base structure, and performing a first light-exposure process on the photoresist using a first lithography mask. In the first light-exposure process, an inner portion of the photoresist is blocked from being exposed, and a peripheral portion of the photoresist is exposed. The peripheral portion encircles the inner portion. A second light-exposure process is performed on the photoresist using a second lithography mask. In the second light-exposure process, the inner portion of the photoresist is exposed, and the peripheral portion of the photoresist is blocked from being exposed. The photoresist is then developed.
    Type: Application
    Filed: June 14, 2023
    Publication date: September 19, 2024
    Inventors: Shang-Yun Hou, Chien-Hsun Lee, Tsung-Ding Wang, Hao-Cheng Hou
  • Publication number: 20240304975
    Abstract: Provided is a balun structure, including: a first dielectric layer, a second dielectric layer, a ground electrode, an unbalance electrode, and a balance electrode. The first dielectric layer, the ground electrode, the second dielectric layer are successively stacked, and the ground electrode has a coupling hole therein. The coupling hole extends from a surface facing the first dielectric layer to a surface facing the second dielectric layer. The unbalance electrode is disposed on a first side of the first dielectric layer, wherein the first side of the first dielectric layer is a side, distal from the ground electrode, of the first dielectric layer. The balance electrode is disposed on a first side of the second dielectric layer, wherein the first side of the second dielectric layer is a side, distal from the ground electrode, of the second dielectric layer.
    Type: Application
    Filed: February 28, 2022
    Publication date: September 12, 2024
    Applicants: Beijing BOE Sensor Technology Co., Ltd., BOE Technology Group Co., Ltd.
    Inventors: Haocheng JIA, Yi DING, Hao GUO, Yan LU, Xiaobo WANG, Weisi ZHOU, Wenxue MA, Jing WANG, Chuncheng CHE
  • Patent number: 12081136
    Abstract: An inverter module and an inverter are provided. The inverter module includes at least two capacitors and at least one power unit group. The at least one power unit group each comprises one or more power units. The capacitors are connected in series and parallel to form a capacitor head terminal, a capacitor end terminal and a capacitor midpoint, where capacitance between the capacitor midpoint and the capacitor head terminal is the same as capacitance between the capacitor midpoint and the capacitor end terminal. Positive poles of DC sides of the power units are equidistantly connected with the capacitor head terminal, negative poles of the DC sides of the power units are equidistantly connected with the capacitor end terminal, and midpoints of the DC sides of the power units are equidistantly connected with the capacitor midpoint.
    Type: Grant
    Filed: January 25, 2022
    Date of Patent: September 3, 2024
    Assignee: Sungrow Power Supply Co., Ltd.
    Inventors: Hao Zheng, Qiyao Zhu, Jun Tan, Jie Ding
  • Patent number: 12071849
    Abstract: A device for simulating gas intrusion and bullheading in a wellbore under different inclinations is provided, which includes a wellbore outer pipe with an inner pipe and an LED light source therein. An outer wall of the wellbore outer pipe is provided with one or more inlets. A bubble generator is arranged outside a lower plug, and extends through the lower plug via an air inlet needle into the inner cavity of the wellbore outer pipe. An input end of the bubble generator is connected to an air compressor. A lower outlet of the wellbore outer pipe is connected to an inlet of a formation unit through a pipeline and a back pressure valve. A simulating method using such device is also provided.
    Type: Grant
    Filed: March 28, 2024
    Date of Patent: August 27, 2024
    Assignee: CHINA UNIVERSITY OF PETROLEUM (EAST CHINA)
    Inventors: Bangtang Yin, Tianbao Ding, Baojiang Sun, Zhiyuan Wang, Yonghai Gao, Hao Li, Xiaohui Sun, Xuerui Wang
  • Publication number: 20240266704
    Abstract: A phase shifter is provided. The phase shifter includes a plurality of phase shift units coupled in sequence. At least one phase shift unit of the plurality of phase shift units includes: a first conductive structure and a second conductive structure. The first conductive structure includes at least one first transmission line, and a second transmission line connected to the at least one first transmission line, the second transmission line being configured as an inductive load. The second conductive structure includes at least one third transmission line, each third transmission line being configured to form a capacitor with a first transmission line. The first transmission line, the third transmission line and the capacitor constitute at least a portion of a phase shift communication path of the phase shifter.
    Type: Application
    Filed: February 17, 2022
    Publication date: August 8, 2024
    Inventors: Haocheng JIA, Yi DING, Xiaobo WANG, Hao GUO, Yan LU, Weisi ZHOU, Wenxue MA, Jing WANG, Chuncheng CHE