Abstract: A structure of semiconductor device includes a substrate. A first dielectric layer is disposed over the substrate, wherein the first dielectric layer has an air trench. A plurality of trench metal layers is disposed in the first dielectric layer, wherein the air trench is between adjacent two of the trench metal layers and without contacting to the trench metal layers. A liner layer is disposed on the first dielectric layer to cover the trench metal layers and a profile of the air trench. An etching stop layer is disposed on the liner layer, wherein the etching stop layer seals the air trench to form an air gap between the adjacent two of the trench metal layers.

Abstract: A solid-lubricated metal cutter and processing method relates to the technical field of metal cutters. A surface texture morphology is worked out on a metal cutter, a solid lubricant is filled into the surface texture morphology, and a convex dam is arranged on the cutter surface on which surface texture morphology is located at a chip flow side. The surface texture morphology has micro-pit and micro-boss features, and can exert antifriction effect of a solid lubricant and anti-adhesion effect of micro-protrusions. The convex dam is arranged at an end of the micro-texture region away from the cutting blade, so that a part of the solid lubricant flows back to the texture region and thereby the utilization efficiency and retentiveness of the solid lubricant are improved.

Abstract: An aroma diffuser includes a liquid storage means, an enclosure provided with a mounting cavity, a gas supply means and a seal. The enclosure is covered on a liquid storage mean. The gas supply means and the liquid storage means are both aranged in the mounting cavity and communicate with each other. The gas supply means, the liquid storage means and the enclosure cooperate to form a gas return passage. The seal is arranged between the liquid storage means and the gas supply means, located in the gas return passage and sealingly abuts on the enclosure. The gas return passage can be blocked by the seal, aroma gas produced by the aroma diffuser is prevented from flowing back from the gas return passage into the gas supply means to reduce the concentration of the aroma gas released into the environment and thus to affect the use effect of the aroma diffuser.

Abstract: A solid-lubricated metal cutter and processing method relates to the technical field of metal cutters. A surface texture morphology is worked out on a metal cutter, a solid lubricant is filled into the surface texture morphology, and a convex dam is arranged on the cutter surface on which surface texture morphology is located at a chip flow side. The surface texture morphology has micro-pit and micro-boss features, and can exert antifriction effect of a solid lubricant and anti-adhesion effect of micro-protrusions. The convex dam is arranged at an end of the micro-texture region away from the cutting blade, so that a part of the solid lubricant flows back to the texture region and thereby the utilization efficiency and retentiveness of the solid lubricant are improved.

Abstract: A biosensor device comprises a substrate base having a paper body, the substrate base supporting at least a first electrode having a growth nanomaterial surface on a portion thereof adapted to receive a sample fluid, and a contact end configured for connection to measuring equipment. A substrate cover has a paper body, the substrate cover defining a reaction zone in which the paper is exposed on both sides of the paper body, the substrate cover supporting at least a second electrode and at least a third electrode each having a connection end contacting the reaction zone and a contact end configured for connection to the measuring equipment, wherein the reaction zone is superposed on the growth nanomaterial surface during use for wicking of the sample fluid through the reaction zone.

Abstract: The present disclosure relates to a method for preparing high-performance melamine foam, comprising the following steps: preparing a primary polymer of waterborne melamine formaldehyde resin; uniformly mixing the primary polymer of the waterborne melamine formaldehyde resin, the polar solvent, the surfactant and the additive to obtain a mixture A; uniformly mixing the mixture A with the solid methylol melamine to obtain a mixture B; uniformly mixing the mixture B with the foaming agent to obtain a mixture C; uniformly mixing the mixture C with the curing agent to obtain a mixture D; and carrying out microwave radiation, foaming, curing, drying and quenching on the mixture D in a microwave foaming device to obtain the high-density melamine foam. The melamine foam described in the present invention has high density and high strength performance.

Abstract: A display substrate structure includes a substrate, at least one chip, and a plurality of conductive lines. A display region and a periphery region are defined on the substrate. The periphery region is disposed around the display region, and the chip is disposed in the periphery region. The conductive lines are disposed in the periphery region and at least between the chip and the display region. Each conductive line has a fan-out portion and at least one adjustment portion. Each adjustment portion is electrically connected to the fan-out portion of the same conductive line. The adjustment portion of each conductive line has a winding wire, and at least one of the adjustment portions of the conductive lines has a straight wire, which is electrically connected to and at least partially overlaps the winding wire of the same conductive line.

Abstract: A method for forming patterns for semiconductor device includes following steps. A substrate including a hard mask layer and a sacrificial layer is provided. A plurality of mandrel patterns are formed on the substrate. A spacer is respectively formed on sidewalls of the mandrel patterns. The mandrel patterns are removed to form a plurality of spacer patterns directly formed on the sacrificial layer. A plurality of first blocking layers are formed in the sacrificial layer after forming the spacer patterns. A plurality of second blocking layers exposing at least a portion of the sacrificial layer and at least a portion of the first blocking layers are formed on the substrate. The sacrificial layer and the hard mask layer are etched with the spacer patterns, the first blocking layers, and the second blocking layers serving as etching masks to form a patterned hard mask layer on the substrate.

Abstract: The present disclosure relates to a method for preparing high-performance melamine foam, comprising the following steps: preparing a primary polymer of waterborne melamine formaldehyde resin; uniformly mixing the primary polymer of the waterborne melamine formaldehyde resin, the polar solvent, the surfactant and the additive to obtain a mixture A; uniformly mixing the mixture A with the solid methylol melamine to obtain a mixture B; uniformly mixing the mixture B with the foaming agent to obtain a mixture C; uniformly mixing the mixture C with the curing agent to obtain a mixture D; and carrying out microwave radiation, foaming, curing, drying and quenching on the mixture D in a microwave foaming device to obtain the high-density melamine foam. The melamine foam described in the present invention has high density and high strength performance.

Abstract: A method for forming patterns for semiconductor device includes following steps. A substrate including a hard mask layer and a sacrificial layer is provided. A plurality of mandrel patterns are formed on the substrate. A spacer is respectively formed on sidewalls of the mandrel patterns. The mandrel patterns are removed to form a plurality of spacer patterns directly formed on the sacrificial layer. A plurality of first blocking layers are formed in the sacrificial layer after forming the spacer patterns. A plurality of second blocking layers exposing at least a portion of the sacrificial layer and at least a portion of the first blocking layers are formed on the substrate. The sacrificial layer and the hard mask layer are etched with the spacer patterns, the first blocking layers, and the second blocking layers serving as etching masks to form a patterned hard mask layer on the substrate.

Abstract: A method for forming patterns for semiconductor device includes following steps. A substrate is provided. The substrate includes a hard mask layer and a sacrificial layer formed thereon. A plurality of spacer patterns parallel with each other are formed on the substrate. A plurality of first blocking layers are formed in the sacrificial layer after forming the spacer patterns. A plurality of second blocking layers exposing at least a portion of the sacrificial layer and at least a portion the first blocking layer are formed on the substrate after forming the first blocking layer. Next, the sacrificial layer and the hard mask layer are etched with the spacer patterns, the first blocking layers and the second blocking layer being used as etching masks to form a patterned hard mask layer on the substrate.

Abstract: A method for forming patterns for semiconductor device includes following steps. A substrate is provided. The substrate includes a hard mask layer and a sacrificial layer formed thereon. A plurality of spacer patterns parallel with each other are formed on the substrate. A plurality of first blocking layers are formed in the sacrificial layer after forming the spacer patterns. A plurality of second blocking layers exposing at least a portion of the sacrificial layer and at least a portion the first blocking layer are formed on the substrate after forming the first blocking layer. Next, the sacrificial layer and the hard mask layer are etched with the spacer patterns, the first blocking layers and the second blocking layer being used as etching masks to form a patterned hard mask layer on the substrate.

Abstract: The present invention discloses high-density melamine foam, which comprises the following raw materials; a primary polymer of waterborne melamine formaldehyde resin, solid methylol melamine, a polar solvent, a surfactant, a foaming agent, a curing agent and an additive.

Abstract: A display substrate structure includes a substrate, at least one chip, and a plurality of conductive lines. A display region and a periphery region are defined on the substrate. The periphery region is disposed around the display region, and the chip is disposed in the periphery region. The conductive lines are disposed in the periphery region and at least between the chip and the display region. Each conductive line has a fan-out portion and at least one adjustment portion. Each adjustment portion is electrically connected to the fan-out portion of the same conductive line. The adjustment portion of each conductive line has a winding wire, and at least one of the adjustment portions of the conductive lines has a straight wire, which is electrically connected to and at least partially overlaps the winding wire of the same conductive line.

Abstract: A display panel including plural wiring sets is provided. Each of the wiring sets includes plural wires extending substantially along a straight direction. Each of the wiring sets has a first part and a second part respectively located at two opposite sides of a sealant. The first part is located between the sealant and an active region of the display panel, and a shortest distance of two adjacent wire segments of the first part is larger than a shortest distance of two adjacent wire segments of the second part. In addition, the shortest distance of two adjacent wire segments of the first part may be limited from about 15 ?m to about 35 ?m. The configuration of wiring set can reduce crosstalk of electric field between two adjacent wires to prevent light leakage and improve display quality.

Abstract: A fan-out circuit electrically connected to a driver and a plurality of signal lines is provided. The fan-out circuit includes a first fan-out trace including a first and a second conductive line, and a second fan-out trace including a third and a fourth conductive line. The second conductive line is connected between the first conductive line and one of the signal lines. The length of the second and fourth conductive lines are L1? and L2? respectively. An obtuse included angle is formed between the first and second conductive lines. The width of the first and third conductive lines is W1. The fourth conductive line is electrically connected to the third conductive line and another one of the signal lines. The obtuse included angle is formed between the third and fourth conductive lines. The width of the second and fourth conductive lines is W2, and (W2/L1?)>(W2/L2?) and L1?<L2?.

Abstract: A display panel having a display region and a sealant region is provided. The display panel includes a first substrate, a second substrate, a sealant and a display medium. The sealant is disposed between the first and second substrates and within the sealant region. The display medium is disposed between the first and second substrates and within the display region. The second substrate includes pixel units and wires electrically connected to the pixel units. The pixel units are disposed within the display region, the wires extend to the sealant region from the display region, and at least a portion of the wires in the sealant region has slots. In particular, each of the slots has a side edge adjacent to the edge of the wire which the slot is disposed therein, and the distances from the side edge to the edge of the wire are not equal.

Abstract: A bi-directional fiber optical subassembly, including a laser diode, a photodiode and an optical fiber, an optical transceiver including the same, and methods of making and using the same are provided. An antireflection unit is added to a position facing the photodiode within the transceiver. The antireflection unit is configured to decrease or eliminate reflected light interference within the transceiver. The present subassembly, transceiver, and methods can reduce, minimize, or prevent interference, and the performance of the optical subassembly can also be enhanced by decreasing or eliminating reflected light interference within the transceiver.

Abstract: A display panel having a display region and a non-display region is described. The display panel includes a pixel array, at least one driving device and a plurality of lead lines. The pixel array is disposed in the display region. The driving device is disposed in the non-display region. The lead lines are disposed in the non-display region and are electrically connected to the pixel array and the driving device. The lead lines are arranged into at least one fan-out structure between the pixel array and the driving device. In particular, the (n-1)th lead line has a pitch Pn-1=Wn-1+S, n is an integer larger than 1, Wn-1 represents a line width of the (n-1)th lead line, S represents a space between the adjacent lead lines, and the pitches P1˜Pn-1 of the plurality of lead lines are not completely the same.

Abstract: A light source module includes a casing, at least one reflective layer, a light bar, and at least one light source. The casing has a first side wall and a second side wall, and the first side wall and the second side wall define an opening. The opening faces a light incident surface of a light guide plate, and the first side wall and the second side wall are respectively positioned on two opposite sides of the opening. The reflective layer is formed inside the casing and adjacent to one of the first side wall and the second side wall. The light bar is disposed inside the casing and forms an angle with the light incident surface of the light guide plate.