Patents by Inventor Hao Han
Hao Han has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240247820Abstract: An evaporative-cooling window fan is configured to draw air from outdoors to indoors such that it is cooled and filtered as it passes there-through.Type: ApplicationFiled: January 25, 2023Publication date: July 25, 2024Inventors: Chi Hsiang Wang, Hao Han Wang
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Publication number: 20240248672Abstract: The present application discloses an inter-device communication method, a camera, and a display, for use in providing a method for direct communication between a camera and a display. The camera comprises a controller, a camera body, a memory, and a communication module. The controller is configured to perform the following steps: acquiring an image from the camera body and performing image processing on the image to determine configuration information of the image; determining ID code information of the image according to identification information of the camera body and the configuration information, wherein the ID code information is used for representing the identification information of the camera body and the configuration information of the image; and sending the image and the ID code information to a display, so that the display performs image processing on the image according to the ID code information and then displays the image.Type: ApplicationFiled: May 26, 2021Publication date: July 25, 2024Inventors: Huidong HE, Peng HAN, Qianwen JIANG, Juanjuan SHI, Weihua DU, Xue DONG, Hao ZHANG, Lili CHEN, Yongzhong ZHANG
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Publication number: 20240250076Abstract: An electronic device includes a first curved module and a second curved module. The first curved module includes a first electronic element and a first curved unit. The second curved module is spliced to one side of the first curved module and includes a second electronic element and a second curved unit. The first curved unit and the second curved unit include curved surfaces.Type: ApplicationFiled: January 3, 2024Publication date: July 25, 2024Applicant: Innolux CorporationInventors: Kuang-Pin Chao, Min-Han Tsai, Hao-Jung Huang
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Patent number: 12045552Abstract: A layout method of a chip includes: determining a logic diagram corresponding to a chip to be laid out and a device list corresponding to the logic diagram; and determining a layout diagram of the chip to be laid out, according to the logic diagram, the device list, and a pre-trained layout mode. The layout diagram includes at least an arrangement position, in the chip to be laid out, of each device in the device list.Type: GrantFiled: August 6, 2021Date of Patent: July 23, 2024Assignees: BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.Inventors: Qianwen Jiang, Hao Zhang, Lili Chen, Peng Han, Huidong He, Juanjuan Shi
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Publication number: 20240194426Abstract: A high-voltage direct current relay includes an insulating housing, a contact mechanism and a driving mechanism. The insulating housing defines a contact chamber. The contact mechanism includes a pair of immovable contacts and a movable contact. One end of the immovable contact protrudes into the contact chamber, and another end of the immovable contact protrudes beyond the insulating housing. The movable contact is located in the contact chamber. A gap is formed between the immovable contact and the movable contact. The driving mechanism includes a driving source and a pushing assembly. The power consumption of the high voltage direct current relay can be reduced.Type: ApplicationFiled: July 20, 2023Publication date: June 13, 2024Applicant: Luxshare Intelligent Manufacture Technology (Changshu) Co., LtdInventors: Tao PENG, Huan WANG, Xiao SUN, Hao HAN
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Patent number: 11988408Abstract: A humidifier has a base and a housing. The housing has a steam exhaust vent and a vaporizer. The vaporizer includes a heating element surrounded by a removable porous sleeve that protrudes downwardly into water within a reservoir of the base. The sleeve wicks the water including its minerals and impurities into contact with the heating element wherein energization of the heating element causes the wicked water to convert to steam that rises through the exhaust vent and from the housing during a humidification mode.Type: GrantFiled: March 29, 2022Date of Patent: May 21, 2024Inventors: Chi Hsiang Wang, Hao Han Wang
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Patent number: 11966009Abstract: The present disclosure provides a display substrate, a method for preparing the same, and a flexible display device, and belongs to the technical field of display. Among them, the display substrate includes: a base substrate; a metal pattern located on the base substrate, and an anti-reflection pattern located on a surface of the metal pattern proximate to the base substrate; in which a material of the anti-reflection pattern includes molybdenum oxide doped with a refractory metal, and a melting point of the refractory metal is greater than a temperature threshold. The technical solution of the present disclosure is capable of reducing the reflection of ambient light by the display substrate.Type: GrantFiled: September 11, 2019Date of Patent: April 23, 2024Assignees: BEIJING BOE DISPLAY TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.Inventors: Xiaoxiang Zhang, Hao Han, Yihe Jia, Lianjie Yang, Xiangqian Ding, Yongzhi Song
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Patent number: 11826789Abstract: Provided is a package sorting method, a sorting area layout, a sorting system, and a path optimization method. The package sorting method includes: dividing a sorting area into at least a first logical partition close to a first item collecting area and a second logical partition close to a second item collecting area, where the first logical partition includes a first item dropping area, and the second logical partition includes a second item dropping area. By this method, a total path of package delivery is reduced.Type: GrantFiled: October 19, 2022Date of Patent: November 28, 2023Assignee: Beijing Geekplus Technology Co., Ltd.Inventor: Hao Han
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Patent number: 11804454Abstract: A semiconductor package and a packaged electronic device are described. The semiconductor package has a foundation layer and a planar filtering circuit. The circuit is formed in the foundation layer to provide EMI/RFI mitigation. The circuit has one or more conductive traces that are patterned to form an equivalent circuit of inductors and capacitors. The one or more conductive traces include planar metal shapes, such as meanders, loops, inter-digital fingers, and patterned shapes, to reduce the z-height of the package. The packaged electronic device has a semiconductor die, a foundation layer, a motherboard, a package, and the circuit. The circuit removes undesirable interferences generated from the semiconductor die. The circuit has a z-height that is less than a z-height of solder balls used to attach the foundation layer to the motherboard. A method of forming a planar filtering circuit in a foundation layer is also described.Type: GrantFiled: March 5, 2021Date of Patent: October 31, 2023Assignee: Tahoe Research, Ltd.Inventors: Hao-Han Hsu, Dong-Ho Han, Steven C. Wachtman, Ryan K. Kuhlmann
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Patent number: 11784029Abstract: A method for atomic layer etching may include a step of providing a substrate on which a material to be etched is formed, a modifying step of controlling the substrate at a first temperature and modifying a surface layer of the material to be removed by supplying a modifying gas to the substrate, and an etching step of controlling the substrate at a second temperature different from the first temperature and removing the modified surface layer by supplying an etching gas to the substrate.Type: GrantFiled: July 2, 2021Date of Patent: October 10, 2023Assignee: WONIK IPS CO., LTD.Inventors: Kwang Seon Jin, Sang Jun Park, Byung Chul Cho, Jun Hyuck Kwon, Jong Ki An, Tian Hao Han
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Publication number: 20230283309Abstract: The present invention discloses a signal receiving apparatus having phase compensation mechanism. A first and a second receiving path of a receiving circuit perform frequency down-conversion and analog-to-digital conversion on an input signal to generate a first and a second receiving signals. The first and the second receiving paths uses a RF training signal generated by a RF training signal generation circuit as the input signal when a phase compensation is performed, and use a data signal from an antenna circuit as the input signal when a beamforming signal receiving is performed. A phase difference calculation circuit of the receiving circuit performs cross-correlation operation on the first and the second receiving signals to generate a compensation signal according to a phase difference between the first and the second receiving paths.Type: ApplicationFiled: December 6, 2022Publication date: September 7, 2023Inventors: HAO-HAN HSU, CHUAN-HU LIN, CHUNG-YAO CHANG
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Patent number: 11732130Abstract: The present application relates to a flame retardant impact-modified polycarbonate composition and shaped parts as well as articles made therefrom. The polycarbonate composition comprises the following components: an aromatic polycarbonate, a rubber-modified vinyl (co)polymer, and a flame retardant combination. The shaped article made from the polycarbonate composition according to the present invention has a good balance among heat resistance, flame retardance and impact strength.Type: GrantFiled: November 27, 2020Date of Patent: August 22, 2023Assignee: Covestro Intellectual Property GmbH & Co. KGInventors: Zhenyu Huang, Hao Han
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Patent number: 11718749Abstract: The present invention relates to a polycarbonate composition and the process for the production thereof and molded articles. The polycarbonate composition provided in the present invention comprises A) 8-70 wt. % of a polycarbonate component, B) 25-90 wt. % of a polysiloxane-polycarbonate copolymer component, C) a flame retardant component, which comprises 0.5-6 wt. % of a cyclic phosphazene of formula (X) and D) an impact modifier component, which comprises 0.5-6 wt. % of methyl methacrylate-butadiene-styrene, with the above weight percentages based on said polycarbonate composition as 100 wt. %. The polycarbonate composition provided in the present invention has a high flame-retardant level, an excellent low-temperature impact-resistant property and good heat resistance, and is suitable for the use requirement of casings for electrical devices which have relatively high flame-retardant levels (such as UL94 5VB) and require an excellent low-temperature impact-resistant property.Type: GrantFiled: August 31, 2018Date of Patent: August 8, 2023Assignee: Covestro Deutschland AGInventors: Zhenyu Huang, Hao Han
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Patent number: 11708455Abstract: The present invention relates to a flame-retardant polycarbonate composition comprising the following components, relative to the total weight of the composition: A) 30-70 wt. % of at least one aromatic polycarbonate, B) 20-60 wt. % of at least one polysiloxane-polycarbonate block condensate, C) 0.5-5 wt. % of at least one cyclic phosphazene, D) 1-5 wt. % of at least one silicone-acrylate rubber based impact modifier, E) 0.3-3 wt % of kaolin, F) 0.1-1 wt. % of at least one anti-dripping agent, and G) 0.1-1 wt. % of at least one UV absorber. The present invention also relates to a shaped article produced from the composition. The polycarbonate composition according to the present invention has a good combination of low-temperature impact performance, flame-retardancy, hydrolytic stability, anti-UV performance, and heat resistance.Type: GrantFiled: May 14, 2021Date of Patent: July 25, 2023Assignee: Covestro Deutschland AGInventors: Zhenyu Huang, Hao Han
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Patent number: 11705934Abstract: A wireless communication chip includes an analog front-end circuit and a baseband circuit. The analog front-end circuit includes a first transceiver circuit and a second transceiver circuit, wherein the first transceiver circuit is arranged to transmit or receive signals through a first antenna, and the second transceiver circuit is arranged to transmit or receive signals through a second antenna. The baseband circuit is arranged to control the first transceiver circuit to use a first band or a second band for communication, and/or to control the second transceiver circuit to use the first band or the second band for communication. The baseband circuit controls the first transceiver circuit and the second transceiver circuit so that the analog front-end circuit alternately performs 2T2R in the first band and 2T2R in the second band.Type: GrantFiled: November 23, 2021Date of Patent: July 18, 2023Assignee: Realtek Semiconductor Corp.Inventors: Hao-Han Hsu, Chung-Yao Chang
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Publication number: 20230212389Abstract: The present invention relates to a flame-retardant polycarbonate composition comprising the following components: A) 50-90 parts by weight of aromatic polycarbonate, B) 3-20 parts by weight of non-core-shell impact modifier, C) 2-15 parts by weight of at least one cyclic phosphazene of formula (V): where k is an integer from 1 to 10, the trimer content (k=1) being more than 98 mol %, based on component C, and where R are in each case identical or different and are an amine radical, C1-C8-alkyl in each case optionally halogenated, C1-C8-alkoxy, C5-C6-cycloalkyl in each case optionally substituted by alkyl and/or halogen, C6-C20-aryloxy in each case optionally substituted by alkyl and/or halogen, and/or hydroxyl, C7-C12-aralkyl in each case optionally substituted by alkyl and/or halogen, a halogen radical, or an OH radical, D) 0-30 parts by weight of filler, E) 0.Type: ApplicationFiled: May 5, 2021Publication date: July 6, 2023Inventors: Qing Guo, Hao Han, Shoujun Li, Zhenyu Huang
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Publication number: 20230167296Abstract: The present invention relates to a flame-retardant polycarbonate composition comprising the following components, relative to the total weight of the composition: A) 40-60 wt. % of at least one aromatic polycarbonate, B) 30-50 wt. % of at least one polysiloxane-polycarbonate condensate, C) 0.5-5 wt. % of at least one cyclic phosphazene, D) 1-5 wt. % of at least one silicone-acrylate rubber based impact modifier, E) 0.3-3 wt % of aluminium hydroxide oxide, F) 0.1-1 wt. % of at least one anti-dripping agent, and G) 0.1-1 wt. % of at least one UV absorber. The present invention also relates to a shaped article produced from the composition. The polycarbonate composition according to the present invention has a good combination of low-temperature impact performance, flame-retardancy, hydrolytic stability, anti-UV performance, and heat resistance.Type: ApplicationFiled: May 14, 2021Publication date: June 1, 2023Inventors: Zhenyu Huang, Hao Han
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Patent number: 11639454Abstract: An adhesive for joining metals and resins is disclosed. The adhesive comprises 0.0001˜3 wt. % of amino silane, 0.0001˜1 wt. % of a crosslinker and 0.0001˜3 wt. % of an organometallic compound. In particular, the adhesive forms an adhesive layer that has a metal atomic ratio less than 50%.Type: GrantFiled: October 7, 2020Date of Patent: May 2, 2023Assignee: CJ TECHNOLOGY CO., LTD.Inventors: Tse Wei Yu, Hao-Han Fan
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Publication number: 20230125361Abstract: The present invention relates to a flame-retardant polycarbonate composition comprising the following components, relative to the total weight of the composition: A) 30-70 wt. % of at least one aromatic polycarbonate, B) 20-60 wt. % of at least one polysiloxane-polycarbonate block condensate, C) 0.5-5 wt. % of at least one cyclic phosphazene, D) 1-5 wt. % of at least one silicone-acrylate rubber based impact modifier, E) 0.3-3 wt % of kaolin, F) 0.1-1 wt. % of at least one anti-dripping agent, and G) 0.1-1 wt. % of at least one UV absorber. The present invention also relates to a shaped article produced from the composition. The polycarbonate composition according to the present invention has a good combination of low-temperature impact performance, flame-retardancy, hydrolytic stability, anti-UV performance, and heat resistance.Type: ApplicationFiled: May 14, 2021Publication date: April 27, 2023Inventors: Zhenyu Huang, Hao Han
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Publication number: 20230074049Abstract: Differential signal skew compensation techniques for radio frequency interference (RFI) mitigation with no reflection penalty and associated apparatus and methods. A differential pair of signal traces are formed on or in a PCB having at least two changes in direction, with a first signal trace having a first routing path defining a first length and a second signal trace adjacent to the first signal trace including one or more tuning structures that are configured such that the length of the second signal trace matches the first length. Segments of the first signal trace adjacent to the one or more tuning structures of the second signal trace are widened relative to other segments of the first signal trace. The tuning structures may comprise sawtooth structures, accordion structures and other serpentine or meander structures. The solution mitigates RFI without a reflection penalty.Type: ApplicationFiled: November 15, 2022Publication date: March 9, 2023Inventors: Yingern HO, Hao-Han HSU, Boon Ping KOH