Abstract: Embodiments include apparatuses, methods, and systems including an electronic apparatus including an inductor within a circuit package affixed to a printed circuit board (PCB) having a ground layer, where the ground layer includes a mesh area that is substantially void along a contour of the inductor. An electronic apparatus may include a circuit package with an inductor, and a PCB, where the circuit package may be affixed to the PCB. The PCB may have a plurality of layers including a ground layer and a power layer, where the ground layer may be between the power layer and the inductor. The ground layer may include a mesh area that may be substantially void along a contour of the inductor within the circuit package. Other embodiments may also be described and claimed.

Abstract: A method of fabricating tantalum nitride barrier layer in an ultra low threshold voltage semiconductor device is provided. The method includes forming a high-k dielectric layer over a semiconductor substrate. Subsequently, a tantalum nitride barrier layer is formed on the high-k dielectric layer. The tantalum nitride barrier layer has a Ta:N ratio between 1.2 and 3. Next, a plurality of first metal gates is formed on the tantalum nitride barrier layer. The first metal gates are patterned, and then a second metal gate is formed on the tantalum nitride barrier layer.

Abstract: A shielded SODIMM system for reducing RF emissions of a SODIMM connector is disclosed herein. SODIMM connector RFI presently interferes with connectivity and is also an obstacle for higher speed memory applications. The shielded SODIMM system includes a SODIMM connector that is at least partially housed by a SODIMM connector shield, to partially and/or substantially reduce or block RF emissions from the SODIMM connector. The SODIMM connector shield is at least partially conductive and is coupled to landing pads on a surface of a motherboard printed circuit board (“PCB”). The landing pads of the motherboard PCB that are coupled to the SODIMM connector shield are coupled to ground, which grounds the SODIMM connector shield. Grounding the SODIMM connector shield that at least partially houses the SODIMM connector reduces RF emissions from the SODIMM connector during information transfer operations.

Abstract: Particular embodiments described herein provide for a connector shield that can include a main body, a shield portion to shield electromagnetic radiation from a connector, and a support portion. The main body can be removably secured to the connector. The shield portion includes lossy material and the shield portion is not grounded. The connector can include connection lines and the connection lines are at least partially inside a cavity of the shield portion.

Abstract: The techniques discussed herein reduce the power consumption of a Wi-Fi tethering device by switching the Wi-Fi functionality of the Wi-Fi tethering device from a normal operational mode to a sleep mode during idle intervals. The techniques implement a sleep protocol where a Wi-Fi tethering device and the Wi-Fi client device coordinate and establish a sleep schedule. Moreover, the techniques describe a sleep interval adaptation algorithm to establish sleep duration intervals based on data packet exchange patterns associated with different applications executing on the Wi-Fi client device and/or different operations being performed by the Wi-Fi client device.

Abstract: A method of fabricating tantalum nitride barrier layer in an ultra low threshold voltage semiconductor device is provided. The method includes forming a high-k dielectric layer over a semiconductor substrate. Subsequently, a tantalum nitride barrier layer is formed on the high-k dielectric layer. The tantalum nitride barrier layer has a Ta:N ratio between 1.2 and 3. Next, a plurality of first metal gates is formed on the tantalum nitride barrier layer. The first metal gates are patterned, and then a second metal gate is formed on the tantalum nitride barrier layer.

Abstract: Embodiments herein may relate to a package with one or more layers. A silicon die may be coupled with the one or more layers via an adhesive. A package stiffener may also be coupled with the adhesive adjacent to the die. A magnetic thin film may be coupled with the package stiffener. Other embodiments may be described and/or claimed.

Abstract: Techniques for focusing the energy radiated by a wireless power transmitting unit are described. An example power transmitting unit includes a transmit coil configured to generate a magnetic field to wirelessly power a device within an active wireless charging area. The power transmitting unit also includes a power generating circuitry to deliver current to the transmit coil to generate the magnetic field. The power transmitting unit also includes a ferrite structure disposed below the transmit coil, the ferrite structure comprising a flat sheet and a projection of ferrite material projecting above the flat sheet.

Abstract: Particular embodiments described herein provide for a connector shield that can include a main body, a shield portion to shield electromagnetic radiation from a connector, and a support portion. The main body can be removably secured to the connector. The shield portion includes lossy material and the shield portion is not grounded. The connector can include connection lines and the connection lines are at least partially inside a cavity of the shield portion.

Abstract: An apparatus is provided which comprises: an oscillator circuit to generate a clock signal and transmit the clock signal over a signal line; a ground reference plane associated with the signal line; and one or more patterns formed in the ground reference plane, wherein the one or more patterns in the ground reference plane is to filter out noise from the clock signal transmitted over the signal line.

Abstract: A polymeric composite coating includes a drug release retardant polymer matrix, and pH-responsive nanoparticulate pore former. The pH-responsive pore formers function to modulate the permeability of the coating in response to pH changes which can compensate any changes in drug solubility with negligible leaching of the pore formers. The pH-responsive nanoparticulate pore formers may also function as alcohol-resistant component to the overall composite coating to resist increased solubility and permeability in presence of alcohol at 40% ethanol concentration in aqueous media. In one embodiment, the drug release retardant polymer is made of cellulose derivatives.

Abstract: Embodiments herein may relate to a package with one or more layers. A silicon die may be coupled with the one or more layers via an adhesive. A package stiffener may also be coupled with the adhesive adjacent to the die. A magnetic thin film may be coupled with the package stiffener. Other embodiments may be described and/or claimed.

Abstract: A computing device includes a charging coil for producing a charging current when placed in a magnetic field of a wireless power transmitter. A wireless charging operating frequency is associated with wireless charging of a battery of the computing device by the charging coil and the wireless power transmitter. An electrically conductive substrate has a plurality of gaps for reducing eddy currents when the electrically conductive substrate is disposed between the charging coil and the wireless power transmitter during charging of the battery. A plurality of filters each electrically bridge a respective one of the gaps. Each filter attenuates signals within a range of frequencies including the wireless charging operating frequency.

Abstract: Techniques and mechanisms for providing a reference potential with a flexible circuit device. In an embodiment, the flexible circuit device includes a first interconnect to exchange a signal and a second interconnect to exchange a reference potential that facilitates shielding of the signal. The first and second interconnects are variously coupled to a printed circuit board (PCB) via a first contact and a second contact of a hardware interface. During such coupling, a maximum height of the second interconnect from a side of the PCB at the hardware interface is greater than a maximum height of the first interconnect from the side of the PCB at the hardware interface. In another embodiment, a distance of the first contact from an end of the flexible circuit device is different than a distance of the second contact from the end of the flexible circuit device.

Abstract: Orally dissolving films including a pharmaceutically active ingredient having a low bioavailability due to first-pass metabolism and/or low water solubility upon oral administration and a pharmaceutically acceptable excipient, and a medical application thereof.

Abstract: Described herein are techniques related to near field communication and wireless power transfers. A portable device may include a modular antenna that offers consistent characteristics independent of integration environment. The modular antenna may include a continuous loop of coil antenna and a ferrite material that are encapsulated by a shield. The shield may form a “U” shape configuration to encapsulate the top layer coil antenna and the middle layer ferrite material in all three sides, which are defined by a bottom portion, an outer wall, and an inner wall. Furthermore, the shield may include an outer rim and an inner rim to maintain the same coil antenna characteristics in the modular antenna.

Abstract: In accordance with some embodiments, a high speed connection may be implemented using pogo-pins. The use of pogo-pins may be advantageous because accurate alignment is not required, connection force is generally lower than with other connections and appearance is often highly advantageous. Through the use of a moveable metal shield, an advantageous high speed connection for high speed signaling may be implemented between the two devices.

Abstract: Described herein are techniques related one or more systems, apparatuses, methods, etc. for integrating a near field communications (NFC) coil antenna in a portable device. For example, the NFC antenna is integrated under a metal chassis of the portable device. The metal chassis and a conductive coating—that is integrated underneath the full metal chassis—are designed to include one or more slots to provide high impedance to Eddy current induced in the conductive coating.

Abstract: A retention apparatus for a shielded cable is described. In one embodiment, the apparatus comprises a substrate having a ground; a connector coupled to the substrate; a cable shielded with a conductive material and having an end connectable to the connector to electrically connect with the connector; an electrically conductive material coupled to the ground of the substrate; and a grounding retention mechanism to cause the electrically conductive material to electrically connect the cable to the ground of the substrate by applying a force to the cable shield.

Abstract: A method of fabricating tantalum nitride barrier layer in an ultra low threshold voltage semiconductor device is provided. The method includes forming a high-k dielectric layer over a semiconductor substrate. Subsequently, a tantalum nitride barrier layer is formed on the high-k dielectric layer. The tantalum nitride barrier layer has a Ta:N ratio between 1.2 and 3. Next, a plurality of first metal gates is formed on the tantalum nitride barrier layer. The first metal gates are patterned, and then a second metal gate is formed on the tantalum nitride barrier layer.