Abstract: An integrated circuit structure includes a metal pad, a passivation layer including a portion over the metal pad, a first polymer layer over the passivation layer, and a first Post-Passivation Interconnect (PPI) extending into to the first polymer layer. The first PPI is electrically connected to the metal pad. A dummy metal pad is located in the first polymer layer. A second polymer layer is overlying the first polymer layer, the dummy metal pad, and the first PPI. An Under-Bump-Metallurgy (UBM) extends into the second polymer layer to electrically couple to the dummy metal pad.

Abstract: An integrated circuit structure includes a metal pad, a passivation layer including a portion over the metal pad, a first polymer layer over the passivation layer, and a first Post-Passivation Interconnect (PPI) extending into to the first polymer layer. The first PPI is electrically connected to the metal pad. A dummy metal pad is located in the first polymer layer. A second polymer layer is overlying the first polymer layer, the dummy metal pad, and the first PPI. An Under-Bump-Metallurgy (UBM) extends into the second polymer layer to electrically couple to the dummy metal pad.

Abstract: An integrated circuit structure includes a metal pad, a passivation layer including a portion over the metal pad, a first polymer layer over the passivation layer, and a first Post-Passivation Interconnect (PPI) extending into to the first polymer layer. The first PPI is electrically connected to the metal pad. A dummy metal pad is located in the first polymer layer. A second polymer layer is overlying the first polymer layer, the dummy metal pad, and the first PPI. An Under-Bump-Metallurgy (UBM) extends into the second polymer layer to electrically couple to the dummy metal pad.

Abstract: An integrated circuit structure includes a metal pad, a passivation layer including a portion over the metal pad, a first polymer layer over the passivation layer, and a first Post-Passivation Interconnect (PPI) extending into to the first polymer layer. The first PPI is electrically connected to the metal pad. A dummy metal pad is located in the first polymer layer. A second polymer layer is overlying the first polymer layer, the dummy metal pad, and the first PPI. An Under-Bump-Metallurgy (UBM) extends into the second polymer layer to electrically couple to the dummy metal pad.

Abstract: An inductor includes a plurality of first conductive lines, a plurality of second conductive lines and a plurality of contacts. Each of the first conductive lines is spaced apart from one another. Each of the second conductive lines is spaced apart from one another, and each of the second conductive lines crosses over each of the first conductive lines. Each of the contacts electrically interconnects one of the first conductive lines and one of the second conductive lines. These contacts are arranged in a way such that at least parts of the first conductive lines and at least parts of the second conductive lines form an electric current path serving as an inductor.

Abstract: An inductor includes a plurality of first conductive lines, a plurality of second conductive lines and a plurality of contacts. Each of the first conductive lines is spaced apart from one another. Each of the second conductive lines is spaced apart from one another, and each of the second conductive lines crosses over each of the first conductive lines. Each of the contacts electrically interconnects one of the first conductive lines and one of the second conductive lines. These contacts are arranged in a way such that at least parts of the first conductive lines and at least parts of the second conductive lines form an electric current path serving as an inductor.

Abstract: An inductor includes a plurality of first conductive lines, a plurality of second conductive lines and a plurality of contacts. Each of the first conductive lines is spaced apart from one another. Each of the second conductive lines is spaced apart from one another, and each of the second conductive lines crosses over each of the first conductive lines. Each of the contacts electrically interconnects one of the first conductive lines and one of the second conductive lines. These contacts are arranged in a way such that at least parts of the first conductive lines and at least parts of the second conductive lines form an electric current path serving as an inductor.

Abstract: An integrated circuit structure includes a metal pad, a passivation layer including a portion over the metal pad, a first polymer layer over the passivation layer, and a first Post-Passivation Interconnect (PPI) extending into to the first polymer layer. The first PPI is electrically connected to the metal pad. A dummy metal pad is located in the first polymer layer. A second polymer layer is overlying the first polymer layer, the dummy metal pad, and the first PPI. An Under-Bump-Metallurgy (UBM) extends into the second polymer layer to electrically couple to the dummy metal pad.

Abstract: An integrated circuit structure includes a metal pad, a passivation layer including a portion over the metal pad, a first polymer layer over the passivation layer, and a first Post-Passivation Interconnect (PPI) extending into to the first polymer layer. The first PPI is electrically connected to the metal pad. A dummy metal pad is located in the first polymer layer. A second polymer layer is overlying the first polymer layer, the dummy metal pad, and the first PPI. An Under-Bump-Metallurgy (UBM) extends into the second polymer layer to electrically couple to the dummy metal pad.

Abstract: An inductor includes a plurality of first conductive lines, a plurality of second conductive lines and a plurality of contacts. Each of the first conductive lines is spaced apart from one another. Each of the second conductive lines is spaced apart from one another, and each of the second conductive lines crosses over each of the first conductive lines. Each of the contacts electrically interconnects one of the first conductive lines and one of the second conductive lines. These contacts are arranged in a way such that at least parts of the first conductive lines and at least parts of the second conductive lines form an electric current path serving as an inductor.

Abstract: An integrated circuit structure includes a metal pad, a passivation layer including a portion over the metal pad, a first polymer layer over the passivation layer, and a first Post-Passivation Interconnect (PPI) extending into to the first polymer layer. The first PPI is electrically connected to the metal pad. A dummy metal pad is located in the first polymer layer. A second polymer layer is overlying the first polymer layer, the dummy metal pad, and the first PPI. An Under-Bump-Metallurgy (UBM) extends into the second polymer layer to electrically couple to the dummy metal pad.

Abstract: A method for reducing EM radiation comprises at least one first resonance line disposed on one of electric surfaces, which is disposed at a side of a transmission line structure on one of the electric surface. The resonance line crosses over a slot of another electric surface. The slot is etched on a corresponding electric surface. In addition, the transmission line structure crosses over the slot of the electric surface. Then, the first resonance line connects the electric surface having the slot with another electric surface. It can adjust at least one of a length, a width and a shape of the first resonance line, to make an input impedance seen from a crossed point between the transmission line structure and the slot approximately 0.

Abstract: A transmission line with a structure which is capable of forming a passive equalizer and an electrical apparatus using the same are illustrated. The transmission line has a substrate, a ground plane, a defect ground structure, a pair of transmission conducting lines, and at least one stub. The substrate has a plurality of surfaces. The ground plane is located on at least one of the surfaces. The defect ground structure is formed on the ground plane. The pair of transmission conducting lines is located on one of the surfaces, and stretching over the defect ground structure. The at least one stub is located above a plane of the defect ground structure, extending along with at least one side of two sides of the pair of the transmission conducting lines, and electrically coupled to the pair of the transmission conducting lines and the ground plane.

Abstract: A transmission line with a structure which is capable of forming a passive equalizer and an electrical apparatus using the same are illustrated. The transmission line has a substrate, a ground plane, a defect ground structure, a pair of transmission conducting lines, and at least one stub. The substrate has a plurality of surfaces. The ground plane is located on at least one of the surfaces. The defect ground structure is formed on the ground plane. The pair of transmission conducting lines is located on one of the surfaces, and stretching over the defect ground structure. The at least one stub is located above a plane of the defect ground structure, extending along with at least one side of two sides of the pair of the transmission conducting lines, and electrically coupled to the pair of the transmission conducting lines and the ground plane.

Abstract: A method for reducing EM radiation comprises at least one first resonance line disposed on one of electric surfaces, which is disposed at a side of a transmission line structure on one of the electric surface. The resonance line crosses over a slot of another electric surface. The slot is etched on a corresponding electric surface. In addition, the transmission line structure crosses over the slot of the electric surface. Then, the first resonance line connects the electric surface having the slot with another electric surface. It can adjust at least one of a length, a width and a shape of the first resonance line, to make an input impedance seen from a crossed point between the transmission line structure and the slot approximately 0.