Abstract: An antenna module includes a first metal plate and a frame body. The frame body surrounds the first metal plate. The frame body includes a first antenna radiator, a second antenna radiator, a third antenna radiator, a first breakpoint and a second breakpoint. The first antenna radiator includes a first feeding end and excites a first frequency band. The second antenna radiator includes a second feeding end and excites a second frequency band. The third antenna radiator includes a third feeding end and excites a third frequency band. The first breakpoint is located between the first antenna radiator and the second antenna radiator. The second breakpoint is located between the second antenna radiator and the third antenna radiator. An electronic device including the above-mentioned antenna module is also provided.

Abstract: An electronic device including a bracket and an antenna is provided. The bracket includes first, second, third, and fourth surfaces. The antenna includes a radiator. The radiator includes first, second, third, and fourth portions. The first portion is located on the first surface and includes connected first and second sections. The second portion is located on the second surface and includes third, fourth, fifth, and sixth sections. The third section, the fourth section, and the fifth sections are bent and connected to form a U shape. The third portion is located on the third surface and is connected to the second section and the fourth section. The fourth portion is located on the fourth surface and is connected to the fifth section, the sixth section, and the third portion. The radiator is adapted to resonate at a low frequency band and a first high frequency band.

Abstract: A package structure including a semiconductor die, a redistribution circuit structure and an electronic device is provided. The semiconductor die is laterally encapsulated by an insulating encapsulation. The redistribution circuit structure is disposed on the semiconductor die and the insulating encapsulation. The redistribution circuit structure includes a colored dielectric layer, inter-dielectric layers and redistribution conductive layers embedded in the inter-dielectric layers. The electronic device is disposed over the colored dielectric layer and electrically connected to the redistribution circuit structure.

Abstract: The present disclosure provides a method of measuring a semiconductor device, including the following operations: obtaining a first image corresponding to a first layer in the semiconductor device; obtaining a second image corresponding to a second layer, below the first layer, in the semiconductor device, wherein the first layer includes at least one first structure and the second layer includes a plurality of second structures that are overlapped by the at least one first structure; generating a third image by combining the first image and the second image; and calculating an offset between the at least one first structure and the plurality of second structures based on the first image and the third image.

Abstract: A light-emitting device including a substrate, an insulating layer, an inner circuit structure, a plurality of light-emitting elements, an insulating encapsulation layer, and a transparent conductive layer is provided. The insulating layer is disposed on the substrate. The inner circuit structure is disposed on the insulating layer. The light-emitting elements are correspondingly disposed on the inner circuit structure. The insulating encapsulation layer is disposed on the inner circuit structure. The insulating encapsulating layer covers a portion of the inner circuit structure and encapsulates the light-emitting elements. The transparent conductive layer is disposed on the insulating encapsulating layer. The transparent conductive layer electrically connects the light-emitting elements, and serially connects the light-emitting elements.

Abstract: The present disclosure provides a method of measuring a semiconductor device, including the following operations: obtaining a first image corresponding to a first layer in the semiconductor device; obtaining a second image corresponding to a second layer, below the first layer, in the semiconductor device, wherein the first layer includes at least one first structure and the second layer includes a plurality of second structures that are overlapped by the at least one first structure; generating a third image by combining the first image and the second image; and calculating an offset between the at least one first structure and the plurality of second structures based on the first image and the third image.

Abstract: A light-emitting device including a substrate, an insulating layer, an inner circuit structure, a plurality of light-emitting elements, an insulating encapsulation layer, and a transparent conductive layer is provided. The insulating layer is disposed on the substrate. The inner circuit structure is disposed on the insulating layer. The light-emitting elements are correspondingly disposed on the inner circuit structure. The insulating encapsulation layer is disposed on the inner circuit structure. The insulating encapsulating layer covers a portion of the inner circuit structure and encapsulates the light-emitting elements. The transparent conductive layer is disposed on the insulating encapsulating layer. The transparent conductive layer electrically connects the light-emitting elements, and serially connects the light-emitting elements.

Abstract: The present invention provides a controlling apparatus and method for an image scanning system that includes a direct current (DC) motor and an image sensor driven by the DC motor to move. A position signal representative of the position associated of the image sensor is generated and the controlling apparatus and method is performed according to the position signal.

Abstract: The present invention provides a controlling apparatus and method for an image scanning system that includes a direct current (DC) motor and an image sensor driven by the DC motor to move. A position signal representative of the position associated of the image sensor is generated and the controlling apparatus and method is performed according to the position signal.