Abstract: A semiconductor package includes a first semiconductor die, an encapsulant, a high-modulus dielectric layer and a redistribution structure. The first semiconductor die includes a conductive post in a protective layer. The encapsulant encapsulates the first semiconductor die, wherein the encapsulant is made of a first material. The high-modulus dielectric layer extends on the encapsulant and the protective layer, wherein the high-modulus dielectric layer is made of a second material. The redistribution structure extends on the high-modulus dielectric layer, wherein the redistribution structure includes a redistribution dielectric layer, and the redistribution dielectric layer is made of a third material. The protective layer is made of a fourth material, and a ratio of a Young's modulus of the second material to a Young's modulus of the fourth material is at least 1.5.

Abstract: A package structure and a method of forming the same are provided. The package structure includes a first die, a second die, a first encapsulant, and a buffer layer. The first die and the second die are disposed side by side. The first encapsulant encapsulates the first die and the second die. The second die includes a die stack encapsulated by a second encapsulant encapsulating a die stack. The buffer layer is disposed between the first encapsulant and the second encapsulant and covers at least a sidewall of the second die and disposed between the first encapsulant and the second encapsulant. The buffer layer has a Young's modulus less than a Young's modulus of the first encapsulant and a Young's modulus of the second encapsulant.

Abstract: Embodiments provide a method of performing a carrier switch for a device wafer, attaching a second wafer and removing a first wafer. A buffer layer is deposited over the device wafer, buffer layer reducing the topography of the surface of the device wafer. After the carrier switch a film-on-wire layer is removed from the buffer layer and then the buffer layer is at least in part removed.

Abstract: A first polymer layer is formed across a package region and a test region. A first metal pattern is formed in the package region and a first test pattern is simultaneously formed in the test region. The first metal pattern has an upper portion located on the first polymer layer and a lower portion penetrating through the first polymer layer, and the first test pattern is located on the first polymer layer and has a first opening exposing the first polymer layer. A second polymer layer is formed on the first metal pattern in the package region and a second test pattern is simultaneously formed on the first test pattern in the test region. The second polymer layer has a second opening exposing the upper portion of the first metal pattern, and the second test pattern has a third opening greater than the first opening of the first test pattern.

Abstract: A method for preventing BadUSB attack from an external USB device to a host computer is disclosed. The method includes the steps of: a) obtaining a device description from a USB (universal serial bus) device; b) judging if the device description is reasonable; c) loading a driver for the USB device when yes in step b); d) filtering a command from the USB device after step c); and e) disabling the USB device when no in step b) or the command filtered in step d) is malicious.

Abstract: The invention provides a method for changing a touch control function when a smartphone is connected to a computer with a touchscreen. The method includes the steps: a) operationally connecting the desktop computer to the handheld touchscreen computer to project a screen picture of the handheld touchscreen computer on the touchscreen, wherein the screen picture contains a first item, and a second item corresponding to the first item is shown on the touchscreen; b) pressing and holding the second item for more than one second; c) sending a touch event about the operation to the second item from the desktop computer to the handheld touchscreen computer; and d) performing a pressing-and-holding operation to the first item by the handheld touchscreen computer according to the touch event.

Abstract: A method for inputting text to a handheld computer by way of using the keyboard on a personal computer connected thereto. The method includes the steps of: a) establishing an ADK connection between a handheld computer and a personal computer with a keyboard; b) opening a WINDOWS input mode under an editing mode in the personal computer; c) inputting text and/or symbols by using the keyboard and the WINDOWS input mode; d) converting the text and/or symbols into a format acceptable by the handheld computer; and e) transferring the converted text and/or symbols to the handheld computer.