Abstract: A liquid cooling device for multiple electronic components has two liquid blocks, a heat-dissipating plate, a pump and a heat sink. The two liquid blocks and the heat sink are connected and communicated with other via tubing. The pump operates to make a coolant circulate among the two liquid blocks and the heat sink. The heat-dissipating plate is integrally formed with one liquid block. The heat-dissipating plate is disposed on another separate electronic component for absorbing heat. Therefore, the liquid cooling device has only two liquid blocks, but can dissipate heat generated by three electronic components.

Abstract: A liquid cooling device includes a liquid block, a heat-dissipating plate, a thermal-conductive pipe, a pump and a heat sink. The liquid block, the pump, and the heat sink are connected by ducts. The pump drives a coolant to circulate among them. The thermal-conductive pipe is mounted on the heat-dissipating plate. Both ends of the thermal-conductive pipe are connected to the liquid block for the coolant to flow through. The liquid block and the heat sink are respectively mounted on the corresponding electronic devices to absorb heat using the circulating coolant. The heat sink is used to dissipate heat from another heat-generating electronic device. Therefore, one less liquid block is required, and the production cost becomes lower.

Abstract: A liquid cooling device has a main liquid block, a pump, a heat sink, and at least one auxiliary liquid block that are in fluid communications. The auxiliary liquid block has a body and a partition that separates the body into a reservoir and a heat-absorbing chamber. The reservoir and the heat-absorbing chamber communicate with and other via a through hole on the partition. Since the heat-absorbing chamber is mounted to be adjacent to an electronic component that generates heat, the fluid in the heat-absorbing chamber absorbs the heat. When the fluid in the heat-absorbing chamber vaporizes and decreases the fluid in the reservoir has a higher level and thus flows to the heat-absorbing chamber via the through hole. Therefore, the heat-dissipating ability of the liquid cooling device is increased.

Abstract: A vehicle lamp has a lamp holder, an LED array, an interior heat sink and a heat exchanger. The lamp holder is hollow and has a heat conductive portion. The LED array is mounted in the lamp holder. The interior heat sink is mounted on the LED array and has an inner conductor being attached between the LED array and the heat conductive portion. The heat exchanger is mounted on an outer side of the heat conductive portion. Therefore, the vehicle lamp can efficiently dissipate heat generated by the LED array by the interior heat sink and the heat exchanger with little or no dust entering the lamp holder and accumulating on the LED array for improved lifespan and constant heat dissipating performance.

Abstract: A heat-dissipating device includes a housing, a partitioning member, a finned structure, and a high thermal-conductivity strip. The housing defines an inner space, and has a top surface formed with a retaining groove, and an inlet and an outlet. The partitioning member is disposed in the inner space so as to divide the inner space into first and second compartments that are respectively connected to the inlet and the outlet. The finned structure includes a plurality of partitioning plates disposed in the first compartment so as to divide the first compartment into a plurality of partitioned sections that are connected to form a continuous meandering fluid path, and a plurality of heat-dissipating fins disposed in each of the partitioned sections. The conductive strip is secured in the retaining groove in the top surface of the housing and has a thermal conductivity higher than that of the housing.

Abstract: A heat-dissipating device includes a planar plate, a cap-like cover, a finned structure, and a discharge pipe. The cap-like cover includes a base wall, and a surrounding wall that interconnects the planar plate and the base wall, that cooperates with the planar plate and the base wall to define an inner space thereamong, and that defines an inlet. The finned structure includes a plurality of partitioning plates that form a continuous meandering fluid path, and a plurality of heat-dissipating fins that are disposed in the meandering fluid path. The discharge pipe is connected to the surrounding wall of the cap-like cover, is in fluid communication with the second compartment, and has an open end disposed adjacent to the base wall of the cap-like cover.

Abstract: A heat dissipating device includes a heat sink, a pump connected to the heat sink, and a radiator connected to the heat sink and the pump. The radiator includes spaced apart first and second side tanks. The second side tank defines an inner space therein and is formed with a coolant-refilling opening in fluid communication with the inner space. The radiator further includes a cap mounted removably on the second side tank for closing sealingly the coolant-refilling opening, a plurality of conduits interconnecting and in fluid communication with the first and second side tanks, and a fin structure disposed between the first and second side tanks and connected to the first and second side tanks and the conduits.

Abstract: A liquid cooled heat sink includes: a casing defining an inner space and provided with a partitioning wall dividing the inner space into upper and lower chambers and formed with a fluid passage in fluid communication with the upper and lower chambers, the casing being formed with a fluid inlet in fluid communication with the upper chamber and adapted to be connected to an external cooling device; a fin unit provided in the lower chamber; and a pump mounted on the casing and having a suction end disposed in the upper chamber, extending through the partitioning wall, and in fluid communication with the lower chamber, and a discharging end disposed in the upper chamber and adapted to be connected to an external cooling device.

Abstract: A heat dissipating device includes: a heat sink including a casing having upper and lower chambers, the casing being formed with a fluid inlet in fluid communication with the upper chamber, and a fin unit provided in the lower chamber; a pump mounted on the casing for withdrawing fluid from the lower chamber; and an external cooling unit including a radiator mounted on the casing and including first and second side tanks, conduits connected to the first and second side tanks, and a fin structure connected to the first and second side tanks and the conduits. The first side tank is in fluid communication with the pump. The second side tank is in fluid communication with the fluid inlet of the casing. A cooling fan faces toward the fin structure of the radiator.

Abstract: A liquid cooled heat sink includes: a casing defining an inner space and provided with a partitioning wall dividing the inner space into upper and lower chambers and formed with a fluid passage in fluid communication with the upper and lower chambers, the casing being formed with a fluid inlet in fluid communication with the upper chamber and adapted to be connected to an external cooling device; a fin unit provided in the lower chamber; and a pump mounted on the casing and having a suction end disposed in the upper chamber, extending through the partitioning wall, and in fluid communication with the lower chamber, and a discharging end disposed in the upper chamber and adapted to be connected to an external cooling device.

Abstract: A heat dissipating device is adapted to be connected to a heat sink and includes: a radiator including first and second side tanks adapted to store a coolant therein, a fin structure disposed between and interconnecting the first and second side tanks, and connecting conduits connected to the fin structure and interconnecting and in fluid communication with the first and second side tanks, the radiator further including a buffer tank that is mounted on and that is in fluid communication with the first side tank and that has a coolant outlet adapted to be connected to the heat sink, the second side tank having a coolant inlet adapted to be connected to the heat sink; and a pump mounted directly on the buffer tank.

Abstract: A liquid cooled heat sink includes: a casing having a liquid inlet and a liquid outlet; and a fin unit provided in the casing and having a wave-like structure of a multi-fold sheet that defines a plurality of fluid paths which are aligned in series in a transverse direction relative to the fluid paths. The liquid inlet of the casing is in fluid communication with the liquid outlet of the casing through the fluid paths.