Abstract: A blood pressure measurement module includes a top cover, a micro pump, a driving circuit board, and a pressure sensor. The top cover has a gas inlet hole, an accommodation trough, and an outlet channel. An inner wall of the accommodation trough is recessed to form a gas collection chamber in communication with the gas inlet hole, and the outlet channel is connected to a gas bag. The pressure sensor is electrically connected to the driving circuit board. The driving circuit board covers the accommodation trough of the top cover. The operation of the micro pump is controlled by the driving circuit board. The gas is continuously guided to the outlet channel and is converged at the gas bag by the micro pump. When the pressure of the gas in the gas bag measured by the pressure sensor reaches a valve value, the micro pump stops its operation.

Abstract: An external gas detecting device is provided. The external gas detecting device includes a casing, a gas detection module and an external connector. The gas detection module is disposed in the casing and detects a gas transported into the casing to generate a gas information. The external connector is connected to and disposed on the casing. The external connector is used to be connected to an external power supply so as to enable the gas detection module, and is used to transmit the gas information so as to achieve the outward transmission of the gas information.

Abstract: A wafer structure is disclosed and includes a chip substrate and plural inkjet chips having plural ink-drip generators. Each ink-drop generator includes a thermal-barrier layer, a resistance heating layer and a protective layer. The thermal-barrier layer is formed on the chip substrate, the resistance heating layer is formed on the thermal-barrier layer, a part of the protective layer is formed on the resistance heating layer, and the barrier layer is formed on the protective layer. The ink-supply chamber has a bottom in communication with the protective layer, and a top in communication with the nozzle. The thermal-barrier layer has a thickness of 500˜5000 angstroms, the protective layer has a thickness of 150˜3500 angstroms, the resistance heating layer has a thickness of 100˜500 angstroms, the resistance heating layer has a length of 5˜30 microns, and the resistance heating layer has a width of 5˜10 microns.

Abstract: A wafer structure is disclosed and includes a chip substrate and a plurality of inkjet chips. The chip substrate is a silicon substrate fabricated by a semiconductor process. At least one inkjet chip is directly formed on the chip substrate by the semiconductor process and diced into the at least one inkjet chip for inkjet printing. Each of the inkjet chip includes a plurality of ink-drop generators produced by a semiconductor process and formed on the chip substrate. Each of the ink-drop generators includes a thermal-barrier layer, a resistance heating layer, a conductive layer, a protective layer, a barrier layer, an ink-supply chamber and a nozzle.

Abstract: A wafer structure is disclosed and includes a chip substrate and at least one inkjet chip. The chip substrate is a silicon substrate fabricated by a semiconductor process. The inkjet chip is directly formed on the chip substrate by the semiconductor process, whereby the wafer structure is diced, and the inkjet chip is produced, to be implemented for inkjet printing. The inkjet chip includes a plurality of ink-drop generators produced by the semiconductor process and formed on the chip substrate. Each of the ink-drop generators includes a barrier layer, an ink-supply chamber and a nozzle, and the ink-supply chamber and the nozzle are integrally formed in the barrier layer.

Abstract: A wafer structure is disclosed and includes a chip substrate and a plurality of inkjet chips. The chip substrate is a silicon substrate fabricated by a semiconductor process on a wafer of at least 12 inches. The inkjet chips include at least one first inkjet chip and at least one second inkjet chip directly formed on the chip substrate by the semiconductor process, respectively, and the plurality of inkjet chips are diced into the at least one first inkjet chip and the at least one second inkjet chip for inkjet printing. Each of the first inkjet chip and the second inkjet chip includes a plurality of ink-drop generators produced by a semiconductor process and formed on the chip substrate. Each of the ink-drop generators includes a thermal-barrier layer, a resistance heating layer, a conductive layer, a protective layer, a barrier layer, an ink-supply chamber and a nozzle.

Abstract: A wafer structure is disclosed and includes a chip substrate and at least one inkjet chip. The chip substrate is a silicon substrate which is fabricated by a semiconductor process on a wafer of at least 12 inches. The at least one inkjet chip is directly formed on the chip substrate by the semiconductor process, and the wafer is diced into the at least one inkjet chip, to be implemented for inkjet printing.

Abstract: A driving system for driving piezoelectric pump includes one or more mechanical devices and a driving circuit system electrically connected to the at least one mechanical device. The driving circuit system includes a pump-driving unit, a linear voltage-stabilizing unit, a microcontroller unit, a current-sensing unit, and a connection unit. The microcontroller unit generates a first signal, a second signal, and a third signal, and the pump-driving unit receives these signals to drive the mechanical device. The current-sensing unit receives a fourth signal transmitted by the pump-driving unit to obtain an actuation current value of the mechanical device. The linear voltage-stabilizing unit, the current-sensing unit, and the microcontroller unit are coupled to each other through a fifth signal and a sixth signal. The connection unit and the microcontroller unit are coupled to each other through a reset signal, a seventh signal, and an eighth signal provided by the microcontroller unit.

Abstract: A method for intelligently preventing and handling indoor air pollution is adapted to be implemented in an indoor space and includes providing a cloud processing device to receive and intelligently compare an outdoor gas detection data, an indoor gas detection data, and device gas detection data with each other. Then, the cloud processing device remotely transmits a control signal to the communication relay station and further to an indoor gas exchange system, so that the indoor gas exchange system is capable of intelligently enabling the gas processing device and controlling the operation time of the gas processing device for exchanging a polluted gas in the indoor space with the outdoor gas. Moreover, the gas exchanger can perform purification for the polluted gas at the location of the gas exchanger, thereby allowing the polluted gas in the indoor space to be exchanged into a clean, safe, and breathable gas.

Abstract: A monitoring and gas detection information notification system includes monitoring devices and a cloud data processing device. The monitoring devices are respectively disposed at corresponding fixed positions, each of the monitoring devices includes a monitoring module and an actuator-sensor module. The monitoring module captures an image and converts the image into an image data. The actuator-sensor module is disposed in the monitoring module and includes one or more actuators for guiding a gas into the monitoring module and includes one or more sensors for generating a gas detecting data. The cloud data processing device stores and intelligently analyzes the image data and the gas detecting data to generate a processed data, and the cloud data processing device transmits the processed data to a notification processing system so as to conduct a notification of monitoring information and gas detecting information.

Abstract: A wafer structure is disclosed and includes a chip substrate and a plurality of inkjet chips. The chip substrate is a silicon substrate which is fabricated by a semiconductor process. The plurality of inkjet chips include at least one first inkjet chip and at least one second inkjet chip. The plurality of inkjet chips are directly formed on the chip substrate by the semiconductor process, respectively, and diced into the at least one first inkjet chip and the at least one second inkjet chip, to be implemented for inkjet printing. Each of the first inkjet chip and the second inkjet chip includes a plurality of ink-drop generators produced by the semiconductor process and formed on the chip substrate. Each ink-drop generator includes a barrier layer, an ink-supply chamber and a nozzle. The ink-supply chamber and the nozzle are integrally formed in the barrier layer.

Abstract: A range hood for preventing air pollution is disclosed and includes a main body, a gas guider, a filtration and purification component and at least one gas detection module. The main body is configured to form a diversion path. The gas guider is disposed in the diversion path for guiding an air convection. The filtration and purification component is disposed in the diversion path for filtering and purifying an air pollution source contained in the air convection guided by the gas guider. The at least one gas detection module is disposed in the diversion path for detecting the air pollution source and transmitting a gas detection datum.

Abstract: An air conditioner for air pollution prevention includes a main body, a blower, a filtering and cleaning assembly, and a gas detection module. The blower is disposed in the main body to guide air convection and generate a flow-guiding path. The filtering and cleaning assembly is disposed in the flow-guiding path to filter and clean the air pollution source in the air guided by the blower. The gas detection module is disposed in the flow-guiding path of the main body to detect the air pollution source and transmit a gas detection data.

Abstract: An exhaust fan for preventing air pollution includes a main body and at least one gas detection module. The main body is configured to form an airflow-guiding path and includes a gas guider and a filtration and purification component disposed in the airflow-guiding path. The gas guider introduces an air convection for guiding an air pollution source contained in an air to pass through the filtration and purification component so as to filter and purify the air pollution source. The at least one gas detection module is disposed in the airflow-guiding path for detecting the air pollution source and transmitting gas detection data.

Abstract: A vacuum cleaner for air pollution prevention includes a main body, a blower, a filtering and cleaning assembly, and a gas detection module. The main body is configured to form a flow-guiding path. The blower is disposed in the flow-guiding path to guide air convection. The filtering and cleaning assembly is disposed in the flow-guiding path to filter and clean the air pollution source in the air guided by the blower. The gas detection module is disposed in the flow-guiding path to detect the air pollution source and transmits a gas detection data.

Abstract: A fan for air pollution prevention includes a main body, a blower, a filtering and cleaning assembly, and a gas detection module. The main body is configured to form a flow-guiding path. The blower is disposed in the flow-guiding path to guide air convection. The filtering and cleaning assembly is disposed in the flow-guiding path to filter and clean the air pollution source in the air guided by the blower. The gas detection module is disposed in the flow-guiding path to detect the air pollution source and transmit an gas detection data.

Abstract: An air purifier for preventing air pollution is disclosed and includes a main body, a gas guider, a filtration and purification component and at least one gas detection module. The main body is configured to form a diversion path. The gas guider is disposed in the diversion path for guiding an air convection. The filtration and purification component is disposed in the diversion path for filtering and purifying an air pollution source contained in the air convection guided by the gas guider. The at least one gas detection module is disposed in the diversion path for detecting the air pollution source and transmitting a gas detection datum.

Abstract: A thin gas transportation device is provided and includes a shell, a check valve and a gas pump. The shell includes a shell surface, an accommodation slot and an outlet slot. The accommodation slot is recessed from the shell surface and includes an accommodation bottom surface. The outlet slot is recessed from the accommodation bottom surface. The check valve is disposed within the accommodation slot and includes a barrier plate and a valve plate. The barrier plate is disposed on the accommodation bottom surface and covers the outlet slot. The barrier plate includes a first surface, a second surface, a protruding part and a plurality of perforations. The protruding part is protruding from the second surface and located at the outlet slot. The valve plate is coupled to the second surface, and the protruding part abuts against the valve part and seals the valve hole.

Abstract: A wafer structure is disclosed and includes a chip substrate and a plurality of inkjet chips. The chip substrate is a silicon substrate which is fabricated by a semiconductor process on a wafer of at least 12 inches. The plurality of inkjet chips include at least one first inkjet chip and at least one second inkjet chip. The plurality of inkjet chips are directly formed on the chip substrate by the semiconductor process, respectively, and diced into the at least one first inkjet chip and the at least one second inkjet chip, to be implemented for inkjet printing.

Abstract: A wearable display device is disclosed and includes a main body and a driving module. The main body includes a frame, two temple arms and at least one monitor. The two temple arms are respectively connected with two ends of the frame, and the monitor is disposed on the frame. The driving module is disposed within the frame and includes a microprocessor, an optical display module and a heat dissipation component. The optical display module is electrically coupled with the microprocessor and configured for displaying an optical image on the at least one monitor. The heat dissipation component includes a heat dissipation base and two heat pipes. The two heat pipes are disposed on the heat dissipation base adjacent to the microprocessor. When the heat generated by the microprocessor is conducted to the heat dissipation base, the two heat pipes perform heat exchange with the heat dissipation base.