Abstract: The present invention relates to a packaging structure for high-power light emitting diode (LED) chip, comprising a metal plate, insulators and a cover plate. The metal plate comprises a containing slot and isolating slots formed on the surface by working, and the insulators can be embedded in the isolating slot. After forming a hollow slot and notches on the surface of the cover plate by working, the cover plate is combined with the metal plate and insulators and at the same time, the hollow slot and the notches are corresponding to the containing slot and the isolating slots on the metal plate to form a hollowness state, followed by application of surface treatment to form soldering portions and an anti-soldering layer at the bottom of the metal plate.

Abstract: A high power LED (light-emitting diode) chip package carrier structure is disclosed and comprises a circuit board, a metal plate and a lid. The circuit board has a perforate groove for positioning a chip, and an electrode contact area formed at two sides or border of the perforate groove. The metal plate is positioned beneath the circuit board. The lid is positioned above the circuit board, and has a through groove with a width larger than the width of the perforate groove of the circuit board such that the electrode contact area can be exposed out in the through groove of the lid. Thus, the manufacturing process can be simplified and helpful to the mass production.