Patents by Inventor Hao-Juin Liu
Hao-Juin Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9287191Abstract: An embodiment is a structure. The structure comprises a substrate, a chip, and a reinforcement component. The substrate has a first surface, and the first surface comprises depressions. The chip is over and attached to the first surface of the substrate. The reinforcement component is over a first area of the first surface of the substrate. The first area is not under the chip. The reinforcement component has a portion disposed in at least some of the depressions in the first area.Type: GrantFiled: October 12, 2011Date of Patent: March 15, 2016Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Hao-Juin Liu, Chita Chuang, Chen-Cheng Kuo, Chen-Shien Chen
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Patent number: 9257412Abstract: A structure comprises a plurality of connectors formed on a top surface of a first semiconductor die, a second semiconductor die formed on the first semiconductor die and coupled to the first semiconductor die through the plurality of connectors and a first dummy conductive plane formed between an edge of the first semiconductor die and the plurality of connectors, wherein an edge of the first dummy conductive plane and a first distance to neutral point (DNP) direction form a first angle, and wherein the first angle is less than or equal to 45 degrees.Type: GrantFiled: September 12, 2012Date of Patent: February 9, 2016Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Yao-Chun Chuang, Yu-Chen Hsu, Hao-Juin Liu, Chita Chuang, Chen-Cheng Kuo, Chen-Shien Chen
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Publication number: 20150371964Abstract: The embodiments described provide elongated bonded structures near edges of packaged structures free of solder wetting on sides of copper posts substantially facing the center of the packaged structures. Solder wetting occurs on other sides of copper posts of these bonded structures. The elongated bonded structures are arranged in different arrangements and reduce the chance of shorting between neighboring bonded structures. In addition, the elongated bonded structures improve the reliability performance.Type: ApplicationFiled: August 31, 2015Publication date: December 24, 2015Inventors: Ming-Hong Cha, Chen-Shien Chen, Chen-Cheng Kuo, Tsung-Hsien Chiang, Hao-Juin Liu, Yao-Chun Chuang, Chita Chuang
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Publication number: 20150318188Abstract: A structure comprises a plurality of top pads protruding over a top surface of a package substrate, wherein a top pad comprises a first half-circle portion, a second half-circle portion and a first rectangular portion between the first half-circle portion and the second half-circle portion, a plurality of bottom pads embedded in the package substrate, wherein a bottom pad comprises a third half-circle portion, a fourth half-circle portion and a second rectangular portion between the third half-circle portion and the fourth half-circle portion and a plurality of vias coupled between the top pads and their respective bottom pads.Type: ApplicationFiled: July 10, 2015Publication date: November 5, 2015Inventors: Hao-Juin Liu, Chita Chuang, Yao-Chun Chuang, Ming Hung Tseng, Chen-Shien Chen
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Patent number: 9123788Abstract: The embodiments described provide elongated bonded structures near edges of packaged structures free of solder wetting on sides of copper posts substantially facing the center of the packaged structures. Solder wetting occurs on other sides of copper posts of these bonded structures. The elongated bonded structures are arranged in different arrangements and reduce the chance of shorting between neighboring bonded structures. In addition, the elongated bonded structures improve the reliability performance.Type: GrantFiled: September 8, 2014Date of Patent: September 1, 2015Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Ming-Hong Cha, Chita Chuang, Yao-Chun Chuang, Hao-Juin Liu, Tsung-Hsien Chiang, Chen-Cheng Kuo, Chen-Shien Chen
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Patent number: 9117825Abstract: A structure comprises a first pad protruding over a top surface of a package substrate, wherein the first pad is of a first elongated shape, a second pad embedded in the package substrate, wherein the second pad is of a second elongated shape and a via coupled between the first pad and the second pad.Type: GrantFiled: December 6, 2012Date of Patent: August 25, 2015Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Hao-Juin Liu, Chita Chuang, Yao-Chun Chuang, Ming Hung Tseng, Chen-Shien Chen
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Patent number: 9040350Abstract: A method includes placing a plurality of bottom units onto a jig, wherein the plurality of bottom units is not sawed apart and forms an integrated component. Each of the plurality of bottom units includes a package substrate and a die bonded to the package substrate. A plurality of upper component stacks is placed onto the plurality of bottom units, wherein solder balls are located between the plurality of upper component and the plurality of bottom units. A reflow is performed to join the plurality of upper component stacks with respective ones of the plurality of bottom units through the solder balls.Type: GrantFiled: May 14, 2014Date of Patent: May 26, 2015Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Hao-Juin Liu, Chita Chuang, Ching-Wen Hsiao, Chen-Shien Chen, Chen-Cheng Kuo, Chih-Hua Chen
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Publication number: 20140377946Abstract: The embodiments described provide elongated bonded structures near edges of packaged structures free of solder wetting on sides of copper posts substantially facing the center of the packaged structures. Solder wetting occurs on other sides of copper posts of these bonded structures. The elongated bonded structures are arranged in different arrangements and reduce the chance of shorting between neighboring bonded structures. In addition, the elongated bonded structures improve the reliability performance.Type: ApplicationFiled: September 8, 2014Publication date: December 25, 2014Inventors: Ming-Hong Cha, Chita Chuang, Yao-Chun Chuang, Hao-Juin Liu, Tsung-Hsien Chiang, Chen-Cheng Kuo, Chen-Shien Chen
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Patent number: 8829673Abstract: The embodiments described provide elongated bonded structures near edges of packaged structures free of solder wetting on sides of copper posts substantially facing the center of the packaged structures. Solder wetting occurs on other sides of copper posts of these bonded structures. The elongated bonded structures are arranged in different arrangements and reduce the chance of shorting between neighboring bonded structures. In addition, the elongated bonded structures improve the reliability performance.Type: GrantFiled: November 2, 2012Date of Patent: September 9, 2014Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Ming-Hong Cha, Chita Chuang, Yao-Chun Chuang, Hao-Juin Liu, Tsung-Hsien Chiang, Chen-Cheng Kuo, Chen-Shien Chen
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Publication number: 20140248722Abstract: A method includes placing a plurality of bottom units onto a jig, wherein the plurality of bottom units is not sawed apart and forms an integrated component. Each of the plurality of bottom units includes a package substrate and a die bonded to the package substrate. A plurality of upper component stacks is placed onto the plurality of bottom units, wherein solder balls are located between the plurality of upper component and the plurality of bottom units. A reflow is performed to join the plurality of upper component stacks with respective ones of the plurality of bottom units through the solder balls.Type: ApplicationFiled: May 14, 2014Publication date: September 4, 2014Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Hao-Juin Liu, Chita Chuang, Ching-Wen Hsiao, Chen-Shien Chen, Chen-Cheng Kuo, Chih-Hua Chen
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Patent number: 8765497Abstract: A method includes placing a plurality of bottom units onto a jig, wherein the plurality of bottom units is not sawed apart and forms an integrated component. Each of the plurality of bottom units includes a package substrate and a die bonded to the package substrate. A plurality of upper component stacks is placed onto the plurality of bottom units, wherein solder balls are located between the plurality of upper component and the plurality of bottom units. A reflow is performed to join the plurality of upper component stacks with respective ones of the plurality of bottom units through the solder balls.Type: GrantFiled: September 2, 2011Date of Patent: July 1, 2014Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Hao-Juin Liu, Chita Chuang, Ching-Wen Hsiao, Chen-Shien Chen, Chen-Cheng Kuo, Chih-Hua Chen
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Publication number: 20140159203Abstract: A structure comprises a first pad protruding over a top surface of a package substrate, wherein the first pad is of a first elongated shape, a second pad embedded in the package substrate, wherein the second pad is of a second elongated shape and a via coupled between the first pad and the second pad.Type: ApplicationFiled: December 6, 2012Publication date: June 12, 2014Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Hao-Juin Liu, Chita Chuang, Yao-Chun Chuang, Ming Hung Tseng, Chen-Shien Chen
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Publication number: 20140070402Abstract: A structure comprises a plurality of connectors formed on a top surface of a first semiconductor die, a second semiconductor die formed on the first semiconductor die and coupled to the first semiconductor die through the plurality of connectors and a first dummy conductive plane formed between an edge of the first semiconductor die and the plurality of connectors, wherein an edge of the first dummy conductive plane and a first distance to neutral point (DNP) direction form a first angle, and wherein the first angle is less than or equal to 45 degrees.Type: ApplicationFiled: September 12, 2012Publication date: March 13, 2014Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Yao-Chun Chuang, Yu-Chen Hsu, Hao-Juin Liu, Chita Chuang, Chen-Cheng Kuo, Chen-Shien Chen
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Publication number: 20140048929Abstract: The embodiments described provide elongated bonded structures near edges of packaged structures free of solder wetting on sides of copper posts substantially facing the center of the packaged structures. Solder wetting occurs on other sides of copper posts of these bonded structures. The elongated bonded structures are arranged in different arrangements and reduce the chance of shorting between neighboring bonded structures. In addition, the elongated bonded structures improve the reliability performance.Type: ApplicationFiled: November 2, 2012Publication date: February 20, 2014Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Ming-Hong Cha, Chita Chuang, Yao-Chun Chuang, Hao-Juin Liu, Tsung-Hsien Chiang, Chen-Cheng Kuo, Chen-Shien Chen
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Publication number: 20130320524Abstract: A system and method for preventing cracks in a passivation layer is provided. In an embodiment a contact pad has a first diameter and an opening through the passivation layer has a second diameter, wherein the first diameter is greater than the second diameter by a first distance of about 10 ?m. In another embodiment, an underbump metallization is formed through the opening, and the underbump metallization has a third diameter that is greater than the first diameter by a second distance of about 5 ?m. In yet another embodiment, a sum of the first distance and the second distance is greater than about 15 ?m.Type: ApplicationFiled: November 2, 2012Publication date: December 5, 2013Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Yao-Chun Chuang, Chita Chuang, Hao-Juin Liu, Chen-Cheng Kuo, Chen-Shien Chen
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Publication number: 20130127045Abstract: The mechanisms of forming a copper post structures described enable formation of copper post structures on a flat conductive surface. In addition, the copper post structures are supported by a molding layer with a Young's modulus (or a harder material) higher than polyimide. The copper post structures formed greatly reduce the risk of cracking of passivation layer and delamination of at the dielectric interface surrounding the copper post structures.Type: ApplicationFiled: February 27, 2012Publication date: May 23, 2013Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Tsung-Shu LIN, Han-Ping PU, Ming-Da CHENG, Chang-Chia HUANG, Hao-Juin LIU
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Publication number: 20130093075Abstract: An embodiment is a structure. The structure comprises a substrate, a chip, and a reinforcement component. The substrate has a first surface, and the first surface comprises depressions. The chip is over and attached to the first surface of the substrate. The reinforcement component is over a first area of the first surface of the substrate. The first area is not under the chip. The reinforcement component has a portion disposed in at least some of the depressions in the first area.Type: ApplicationFiled: October 12, 2011Publication date: April 18, 2013Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Hao-Juin Liu, Chita Chuang, Chen-Cheng Kuo, Chen-Shien Chen
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Publication number: 20130056872Abstract: A method includes placing a plurality of bottom units onto a jig, wherein the plurality of bottom units is not sawed apart and forms an integrated component. Each of the plurality of bottom units includes a package substrate and a die bonded to the package substrate. A plurality of upper component stacks is placed onto the plurality of bottom units, wherein solder balls are located between the plurality of upper component and the plurality of bottom units. A reflow is performed to join the plurality of upper component stacks with respective ones of the plurality of bottom units through the solder balls.Type: ApplicationFiled: September 2, 2011Publication date: March 7, 2013Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Hao-Juin Liu, Chita Chuang, Ching-Wen Hsiao, Chen-Shien Chen, Chen-Cheng Kuo, Chih-Hua Chen