Abstract: The present invention provides a wafer container and a gas diffusion device applied in the wafer container. The wafer container includes a shell, and all components included and applied on the shell are made of thermal resistance materials. The gas diffusion device and the wafer container, when assembled together, utilize a coupling structure and a collar as a protection mechanism for the gas diffusion device. The gas diffusion device has a buffering chamber that provides a buffering tolerance and a communicating space for the gas before the gas enters an interior space of the wafer container.

Abstract: A substrate container including a container body, a filter member, a back cover is provided. The container body having a top face, a bottom face opposing the top face, a back plate of a first height connecting the top face and the bottom face, a front opening located between the top face and the bottom face, and a back opening opposing the front opening. The front opening enables passage of a substrate and the back opening is located on the back plate and has a smaller second height. The filter member covers the back opening. The back cover establishes sealing engagement with the container body. A gas guiding channel extending in a direction of the first height is formed between the back cover and the container body. The back cover and the filter member define a buffering compartment, and the gas guiding channel has an outlet connecting the buffering compartment.