Abstract: The present invention relates to an OLED device and a corresponding display apparatus, which includes a metal cathode; an organic emitter layer which is disposed on the metal cathode; a transparent cathode which is disposed on the organic emitter layer; and a reflective layer which is disposed between the metal cathode and the organic emitter layer. The reflective layer is an Ag—Mg—Cu alloy layer. The OLED device and the corresponding display apparatus of the present invention have low production cost and high light outputted efficiency.

Abstract: The present disclosure provides a method for removing bubbles in polyimide solution, including: putting the polyimide solution in an open container; and emitting microwaves to the polyimide solution using a microwave generator to perform a microwave treatment lasting a time period so as to remove the bubbles in the polyimide solution. Using the method of the present disclosure to process polyimide solution may conveniently and quickly remove the bubbles in the polyimide solution. This greatly reduces the time required by the process and thus may meet industrialization demands. Meanwhile, the method effectively reduces the volatilization of an organic solvent having a low melting point in the polyimide solution, thereby maintaining proportion stability of the polyimide solution and avoiding defects generated in subsequent coating processes.

Abstract: A preparing method of a glass substrate film sputtering target is disclosed, which comprises the following steps of: weighing an alloy material for forming the glass substrate film sputtering target; adding the alloy material weighed into a plasma pressure compaction sintering cavity and sintering the alloy material to obtain a sintered target, wherein the sintering temperature is 500° C.˜1600° C. and the sintering time is 5˜20 minutes; and post-processing the sintered target. A glass substrate film sputtering target prepared by the preparing method is further disclosed. Because the plasma pressure compaction for quick sintering is adopted for the glass substrate film sputtering target and the preparing method thereof of the present disclosure, quality of the target can be improved and the time necessary for preparing the target can be shortened.

Abstract: The present invention relates to an OLED device and a corresponding display apparatus, which includes a metal cathode; an organic emitter layer which is disposed on the metal cathode; a transparent cathode which is disposed on the organic emitter layer; and a reflective layer which is disposed between the metal cathode and the organic emitter layer. The reflective layer is an Ag—Mg—Cu alloy layer. The OLED device and the corresponding display apparatus of the present invention have low production cost and high light outputted efficiency.

Abstract: The present invention provides a method for cleansing a glass substrate of a TFT-LCD, includes the following steps: providing an ultrasonic cleansing machine, a glass substrate in-feeding conveyor, and a glass substrate out-feeding conveyor, wherein the ultrasonic cleansing machine includes a cleansing tank, a cleansing liquid contained in the cleansing tank, and first and second ultrasonic frequency generators arranged in the cleansing tank and having different frequencies; conveying a glass substrate with the glass substrate in-feeding conveyor into the cleansing tank; immersing the glass substrate in the cleansing liquid of the cleansing tank; generating ultrasonic waves of different frequencies with the first and second ultrasonic frequency generators to be applied to the cleansing liquid to effect ultrasonic cleansing of the glass substrate; and conveying the cleansed glass substrate out of the cleansing tank with the glass substrate out-feeding conveyor.

Abstract: The present invention provides a method for forming a reflector and a reflective LCD manufactured with the method. The method for forming reflector includes (1) providing metal powder and gold varnish, the metal powder being one or more than one selected from aluminum powder, copper powder, zinc powder; (2) mixing the metal powder and the gold varnish to form slurry; (3) providing a substrate and coating or printing the slurry on the substrate; and (4) baking the substrate on which the slurry coated or printed at a temperature of 60-80° C. for a period of 3-5 minutes to have the slurry forming a reflector on the substrate. The present invention forms a reflector on a substrate by mixing metal powder and gold varnish together to form slurry so as to improve homogeneity of scattered reflection of light by the reflector so formed.

Abstract: The present invention relates to an etching solution for copper lead of TFT array substrate, which includes: primary oxidant, secondary oxidant, chelating agent, inhibitor, and additive. The primary oxidant is hydrogen peroxide and the secondary oxidant is phosphoric acid, sulfuric acid, and nitric acid. The chelating agent is amino compound. The inhibitor is amino azole compound and carboxylate compound. The additive is amine compound containing amino nitrogen and coordinating carboxylate oxygen atom. Through adoption of novel components and types of chelating agent and additive, the etching solution improves the characteristics of relatively short process window for copper lead etching solution, reduces the difficult of engineering control, improves stability of engineering operation and improves yield rate, increases stability of shelf time to thereby provide stable etching performance even in the rear half of shelf time, and extends lifespan (?5000 ppm).

Abstract: The present disclosure discloses an array substrate, an LCD device and a manufacturing method of the array substrate. The TFT-LCD array substrate includes a metal electrode; the metal electrode includes a conducting layer; one side of the conducting layer is provided with an adhesive layer made of VOxSiy material, and the other side is provided with a barrier layer. On one side of the metal electrode of the present disclosure, the vanadium metal and the siliceous material in the array substrate (such as glass, n+a-Si layer) generate a chemical reaction, and the vanadium and the siliceous material generate a chemical reaction to generate the adhesive layer made of VOxSiy material; thus, the metal electrode can be firmly fixed to the glass base material; meanwhile, VOxSiy has low contact resistance so that the metal layer has better conducting property.

Abstract: The present invention relates to a method for manufacturing target material for copper lead of TFT-LCD array substrate and a target material. The method includes (1) providing copper powder and a spark plasma activated sintering device; and (2) placing the copper powder in the spark plasma activated sintering device for sintering to obtain a target material for manufacturing copper lead of TFT-LCD array substrate. The method for manufacturing target material for copper lead of TFT-LCD array substrate according to the present invention uses a spark plasma activated sintering device to sinter copper power for forming a target material. The process is simple and efficiency is high. Also, the orientation of crystalline plane of the target material can be effectively controlled to improve the performance of the target material, whereby a copper lead manufactured with such a target material shows low electrical resistivity, low film stress, and low surface roughness.

Abstract: The present invention provides a method for forming a reflector and a reflective LCD manufactured with the method. The method for forming reflector includes (1) providing metal powder and gold varnish, the metal powder being one or more than one selected from aluminum powder, copper powder, zinc powder; (2) mixing the metal powder and the gold varnish to form slurry; (3) providing a substrate and coating or printing the slurry on the substrate; and (4) baking the substrate on which the slurry coated or printed at a temperature of 60-80° C. for a period of 3-5 minutes to have the slurry forming a reflector on the substrate. The present invention forms a reflector on a substrate by mixing metal powder and gold varnish together to form slurry so as to improve homogeneity of scattered reflection of light by the reflector so formed.

Abstract: The present invention provides a method for cleansing a glass substrate of a TFT-LCD, includes the following steps: providing an ultrasonic cleansing machine, a glass substrate in-feeding conveyor, and a glass substrate out-feeding conveyor, wherein the ultrasonic cleansing machine includes a cleansing tank, a cleansing liquid contained in the cleansing tank, and first and second ultrasonic frequency generators arranged in the cleansing tank and having different frequencies; conveying a glass substrate with the glass substrate in-feeding conveyor into the cleansing tank; immersing the glass substrate in the cleansing liquid of the cleansing tank; generating ultrasonic waves of different frequencies with the first and second ultrasonic frequency generators to be applied to the cleansing liquid to effect ultrasonic cleansing of the glass substrate; and conveying the cleansed glass substrate out of the cleansing tank with the glass substrate out-feeding conveyor.

Abstract: The invention relates to a glass substrate cleaning apparatus and cleaning method. The glass substrate cleaning apparatus of the present invention includes a cleaning trough and first frequency generators for transmitting ultrasonic waves of a first frequency and second frequency generators for transmitting ultrasonic waves of a second frequency disposed at two sides of the cleaning trough. In the present invention, a cost is reduced and a good cleaning effect is reached by using the ultrasonic waves of different frequencies to clean a glass substrate.

Abstract: A preparing method of a glass substrate film sputtering target is disclosed, which comprises the following steps of: weighing an alloy material for forming the glass substrate film sputtering target; adding the alloy material weighed into a plasma pressure compaction sintering cavity and sintering the alloy material to obtain a sintered target, wherein the sintering temperature is 500° C.˜1600° C. and the sintering time is 5˜20 minutes; and post-processing the sintered target. A glass substrate film sputtering target prepared by the preparing method is further disclosed. Because the plasma pressure compaction for quick sintering is adopted for the glass substrate film sputtering target and the preparing method thereof of the present disclosure, quality of the target can be improved and the time necessary for preparing the target can be shortened.

Abstract: The present invention relates to an automatic optical detection method and an optical automatic detector. The automatic optical detection method includes the following steps: in the step of colored light projection, the lamplight with tricolor light is uniformly projected on an object to be detected to form images with different colors; gray-scale information corresponding to different zones of the images is obtained, then, an automatic optical inspection standard image is generated, and the automatic optical inspection standard image and a prestored reference image are contrastively detected.

Abstract: The present invention discloses a TFT, an array substrate, a device and a manufacturing method. The TFT comprises a conductive metal layer; an insulting oxidizing layer is formed on the surface of the metal layer. In the present invention, because the oxidation treatment is conducted on the surface of the metal layer, the insulating oxidizing layer is formed and can substitute for the silicon nitride as a TFT barrier layer; compared with the preparation of a silicon nitride barrier layer needing the drilling crew and the material cost, the preparation of the oxidizing layer needs cheap equipment without increasing further materials so that the cost is saved; in addition, the oxidizing layer only exists on the surface of the metal layer, and has small obstruction for light and low requirement for the penetration rate; thus, the process control is relatively simple and the cost can be further reduced.